wlcsp-4-p5 - Ricoh

PACKAGE INFORMATION PE-WLCSP-4-P5-100709
• WLCSP-4-P5 Unit: mm
PACKAGE DIMENSIONS
× 4
0.05
A
INDEX
S 0.06 S
TAPING SPECIFICATION
0.69 B
0.18±0.1
1.2Max.
0.69
Dummy Pocket
0.10 S
0.08±0.03
0.40±0.02
1.5 +0.1
0
4.0±0.1
B
0.40
A
Bottom View
4.0±0.1
0.78
0.78
TR User Direction of Feed
2
1
0.40
∅0.16±0.03
2.0±0.05
1.75±0.1
3.5±0.05
8.0±0.3
∅0.05 M
TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc)
(1reel=5,000pcs)
21±0.8
2±0.5
11.4±1.0
9.0±0.3
13±0.2
∅
∅ 60 +1 0
∅180
0
−1.5
S AB

PACKAGE INFORMATION PE-WLCSP-4-P5-100709
POWER DISSIPATION (WLCSP-4-P5)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plastic (Double sided)
Board Dimensions 40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50%, Back side : Approx. 50%
Through-holes φ0.5mm × 28pcs
Measurement Results (Topt=25°C, Tjmax=125°C)
Power Dissipation PD (mW)
Standard Land Pattern
Power Dissipation 278mW
Thermal Resistance θja=(125−25°C)/0.278W=360°C/W
Thermal Resistance θjc=46°C/W
500
400
300
200
100
348
278
0
85
0 25 50 75 100 125 150
Ambient Temperature (°C)
Power Dissipation
The above graph shows the Power Dissipation of the package based on Tjmax=125°C and Tjmax=150°C.
Operating the IC in the shaded area in the graph might have an influence it's lifetime.
Operating time must be within the time limit described in the table below, in case of operating in the shaded area.
Product Name
40
Operating
time
40
Estimated
years ∗
RP106Z RP107Z RP200Z RP201Z 13,000hrs 9years
Measurement Board Pattern
IC Mount Area (Unit:mm)
∗The volume is calculated on the supposition that operating four hours/day.

PACKAGE INFORMATION PE-WLCSP-4-P5-100709
RECOMMENDED LAND PATTERN
NSMD
Solder Mask
(resist)
Copper Pad
Substrate
NSMD and SMD Pad Definition
Pad definition Copper Pad Solder Mask Opening
NSMD (Non-Solder Mask defined) 0.20mm Min. 0.30mm
SMD (Solder Mask defined) Min. 0.30mm 0.20mm
* Pad layout and size can be modified by customers material, equipment, method.
* Please adjust pad layout according to your conditions.
* Recommended Stencil Aperture Size....ø0.3mm
* Since lead free WLCSP components are not compatible with the tin/lead solder process, you shall not mount lead free WLCSP
components using the tin/lead solder paste.
SMD