Microsystem technology (MST) - Geert's pages

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Physical building blocks sensor Physical interface • interact, communicate • function integration • complex packages • System-in-Package (SiP) “More than Moore” actuator communication signal processing energy storage power energy supply Digital core - compute, store - scaling, miniaturization - complex circuits - System-on-Chip (SoC) “Moore” 26
Research strategy • develop device concepts across <strong>technology</strong> domains • integrate functions into one <strong>technology</strong> platform • (re-)use available technologies CMOS, passive integration, substrate transfer, magneto-resistive,.. • optimize for an integrated system solution packaging, interface electronics, circuit design, algorithms 27
Page 1 and 2: Fred Roozeboom and Geert Langereis
Page 3 and 4: Microsystem technology (MST) in our
Page 5 and 6: More Moore: the Brains Critical dim
Page 7 and 8: Intelligent systems compute & inter
Page 9 and 10: … resulting in two system realiza
Page 13 and 14: Ambient Intelligence penetration in
Page 15 and 16: Microcosmos different proportions M
Page 17 and 18: Scaling Physical phenomenon Scales
Page 19 and 20: Surface- and bulk-micromachining Ac
Page 21 and 22: Low-loss MOS integrated capacitors
Page 25: What’s in common? • Devices int
Page 29 and 30: Electrowetting: fluid focus lens 29
Page 31 and 32: Reflection [a.u.] Electrowetting di
Page 33 and 34: SiP solutions for mobile phones R,
Page 35 and 36: RF Passive Integration on Si thin-f
Page 37 and 38: RF Passive Integration + MEMS modul
Page 39 and 40: High-value trench capacitors 1. Inc
Page 41 and 42: RF-MEMS switchable capacitor Free-h
Page 43 and 44: Sensors & actuators Magnetic sensor
Page 45 and 46: Magneto-resistive sensing concept S
Page 47 and 48: Stick-in-chip module Ferrite stick
Page 49 and 50: Biosensor cartridge flex foil In co
Page 51 and 52: Energy management & Autonomous devi
Page 53 and 54: Applications • value paper • ba
Page 55 and 56: Towards home fetal monitoring • s
Page 59 and 60: Glass Microfabrication Glass is a v
Page 61 and 62: Materials and production What enabl
Page 63 and 64: Manufacturing Bottlenecks for indus
Page 65 and 66: Manufacturing “Sensors and Actuat
Page 67 and 68: Dry etching at room temperature 1.
Page 69 and 70: Details of our macropore array mask
Page 71 and 72: First results on pores STS-HRE Etch
Page 73 and 74: RIE etching (‘Bosch’ process) f
Page 77 and 78:
Microsystem packaging RF-MEMS herme
Page 79 and 80:
Microsystem packaging Plug-‘n-pla
Page 81 and 82:
MEMS Modeling Lumped elements with
Page 83 and 84:
Microsystem technology (MST) in our
Page 85:
Acknowledgment J. van Beek R. Dekke
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