Microsystem technology (MST) - Geert's pages

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Moore, 40 years ago (1965).… Passive integration Smart system integration 4
More Moore: the Brains Critical dimension [µm] 0.25 0.18 0.13 [nm] 90 65 45 32 22 Microelectronics Nanoelectronics 2000 2010 2020 Risk production 5
Page 1 and 2: Fred Roozeboom and Geert Langereis
Page 3: Microsystem technology (MST) in our
Page 7 and 8: Intelligent systems compute & inter
Page 9 and 10: … resulting in two system realiza
Page 11 and 12: Microsystem technology (MST) in our
Page 13 and 14: Ambient Intelligence penetration in
Page 15 and 16: Microcosmos different proportions M
Page 17 and 18: Scaling Physical phenomenon Scales
Page 19 and 20: Surface- and bulk-micromachining Ac
Page 21 and 22: Low-loss MOS integrated capacitors
Page 23 and 24: Microsystem technology (MST) in our
Page 25 and 26: What’s in common? • Devices int
Page 27 and 28: Research strategy • develop devic
Page 29 and 30: Electrowetting: fluid focus lens 29
Page 31 and 32: Reflection [a.u.] Electrowetting di
Page 33 and 34: SiP solutions for mobile phones R,
Page 35 and 36: RF Passive Integration on Si thin-f
Page 37 and 38: RF Passive Integration + MEMS modul
Page 39 and 40: High-value trench capacitors 1. Inc
Page 41 and 42: RF-MEMS switchable capacitor Free-h
Page 43 and 44: Sensors & actuators Magnetic sensor
Page 45 and 46: Magneto-resistive sensing concept S
Page 47 and 48: Stick-in-chip module Ferrite stick
Page 49 and 50: Biosensor cartridge flex foil In co
Page 51 and 52: Energy management & Autonomous devi
Page 53 and 54: Applications • value paper • ba
Page 55 and 56:
Towards home fetal monitoring • s
Page 57 and 58:
Microsystem technology (MST) in our
Page 59 and 60:
Glass Microfabrication Glass is a v
Page 61 and 62:
Materials and production What enabl
Page 63 and 64:
Manufacturing Bottlenecks for indus
Page 65 and 66:
Manufacturing “Sensors and Actuat
Page 67 and 68:
Dry etching at room temperature 1.
Page 69 and 70:
Details of our macropore array mask
Page 71 and 72:
First results on pores STS-HRE Etch
Page 73 and 74:
RIE etching (‘Bosch’ process) f
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Microsystem packaging RF-MEMS herme
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Microsystem packaging Plug-‘n-pla
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MEMS Modeling Lumped elements with
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Page 85:
Acknowledgment J. van Beek R. Dekke
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