DDR4 Design Considerations - EEWeb
DDR4 Design Considerations - EEWeb
DDR4 Design Considerations - EEWeb
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<strong>EEWeb</strong> FEATURED PULSE PRODUCTS<br />
FEATURED INTERVIEW PRODUCTS<br />
Fiber Optic Receiver for 50 MBaud MOST<br />
AFBR-2013 Receiver are designed to receive up to 25MBit/s optical data<br />
which are biphase coded (up to 50Mbaud). They are packaged in 4-pin<br />
transfer molded, low-cost packages ready for assembly into MOST®<br />
plastic fiber optic connector receptacles. Output data has TTL switching<br />
levels, compatible with MOST® Network Interface Controller ICs. These<br />
optical components are specified for operation over a -40°C to +95°C<br />
temperature range, and reliability requirements of automotive applications.<br />
It is allowed to process the AFBR-2013 devices with reflow soldering. In<br />
the absence of data activity, the receiver switches to very low power mode.<br />
For more information, please click here.<br />
2G/3G/4G Multiband LTE Transceiver Chip<br />
Fujitsu Semiconductor Wireless Products, Inc. (FSWP) today announced<br />
that its second LTE multimode product, the MB86L11 2G/3G/4G transceiver,<br />
is shipping in commercial quantities. The MB86L11 is a single chip<br />
multiband, multimode transceiver that supports all wireless communication<br />
modes including LTE (FDD & TDD), HSPA+, DC-HSPA, WCDMA, GSM,<br />
EDGE, CDMA and TD-SCDMA. The MB86L11 transceiver incorporates<br />
many advanced features, including envelope tracking (ET) and antenna<br />
tuning (AT). For more information, please click here.<br />
14.2W/in3 Power Density in T8 LED Driver<br />
Power Integrations announced two new reference designs describing<br />
high-efficiency, non-isolated, high-power-factor (PF) LED drivers for T8<br />
tubes. The designs feature low component count and leverage simple<br />
magnetics and single-sided boards yielding industry-leading power<br />
densities of 14.2 W/in³. Based on the LNK460KG LED driver from Power<br />
Integrations’ LinkSwitch-PL family of ICs, the circuits detailed in DER-<br />
337 (high-line) and DER-345 (low-line) use single-stage non-isolated<br />
topologies which result in a profile of only 8 mm – small enough to be<br />
mounted behind the LEDs in the T8 tube. T8-tube reference designs<br />
describing high-efficiency, non-isolated, high-power-factor (PF) LED<br />
drivers. For more information, please click here.<br />
Wireless Power Transmitters<br />
Integrated Device Technology, Inc. announced the industry’s most<br />
integrated wireless power transmitter solutions optimized for the Wireless<br />
Power Consortium (WPC) Tx-A5, Tx-A6, and Tx-A11 configurations. The<br />
new products expand IDT’s portfolio of WPC Qi-compliant magnetic<br />
induction transmitters with solutions optimized for single-coil 5 V and<br />
three-coil 12 V applications. The IDTP9035 and IDTP9036 are highefficiency,<br />
feature-rich wireless power transmitters. The IDTP9035 is<br />
designed to meet the requirements of the WPC Tx-A5 and Tx-A11 (5<br />
V) specifications, while the IDTP9036 is designed to meet the WPC<br />
Tx-A6 (12 V) specification. The IDTP9035 is optimized for a single-coil<br />
configuration with a standard 5V supply input, allowing customers to<br />
reduce their bill-of-materials (BOM) with cost-effective, low-voltage<br />
power adaptors. For more information, please click here.<br />
World’s lowest power capacitive<br />
sensors with auto-calibration<br />
NXP is a leader in low power capacitance touch sensors, which work based<br />
on the fact that the human body can serve as one of the capacitive plates in<br />
parallel to the second plate, connected to the input of the NXP capacitive<br />
sensor device.<br />
Thanks to a patented auto-calibration technology, the capacitive sensors<br />
can detect changes in capacitance and continually adjust to the environment.<br />
Things such as dirt, humidity, freezing temperatures, or damage to the<br />
electrode do not affect the device function.<br />
The rise of touch sensors in modern electronics has become a worldwide<br />
phenomenon, and with NXP’s low power capacitive sensors it’s never been<br />
easier to create the future.<br />
Learn more at: touch.interfacechips.com<br />
12 <strong>EEWeb</strong> | Electrical Engineering Community<br />
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