Wafer Packaging Fab DATABASE - I-Micronews

Wafer Packaging Fab DATABASE
DATABASE – AUGUST 2011
Worldwide overview of the activity and installed capacities for
packaging at the wafer-scale in 250+ different ‘Mid-end’ factories
There is an unprecedented growing demand to meet the needs for Wafer Level Packaging. If flip-chip wafer
bumping and WLSCP platforms are well-established today, new technologies are also emerging like TSV for 3D
WLP, 2.5D interposers, 3DIC or FO WLP, requiring new capabilities and additional capacities for packaging at
the wafer-scale.
KEY OBJECTIVES OF THE DATABASE
This database presents the exhaustive list of
players and the different locations that are
involved in Wafer Level Packaging in general. This
unique tool provides a global overview of
capabilities (TSV, RDL, wafer bumping, etc…) and
capacities.
• An exclusive tool for equipment & material
suppliers to develop worldwide their business
and for Fabless and Fab-light semiconductor
players to identify new sourcing opportunities
• The tool enables you to analyze WLP
technologies distribution by players, technology
type, country, business model, investment &
growth evaluation
• Small R&D and prototype lines are also listed
• Already 20+ graphs are included for a better
understanding of the global trends
2010 Worldwide wafer bumping* capacity
Breakdown by business model (in 300mm eq wst/y)
TSV
3D WLP
foundries
houses
R&D labs
Yole Developpement
© July 2011
MEMS
players
CMOS
foundries
wafer
bumping
houses
OSAT
IDM -
captive
A DATABASE DEDICATED TO YOUR NEEDS
* including: stud and plated Au, printed and plated
solder, Cu pillar, ball drop, C4/C4NP
Our database references more than 250 fab locations worldwide with technical information related to Wafer
Level Packaging technologies (bumping, RDL, passivation, TSV) or “mid-end” capabilities
The tool provides an exhaustive list of players (IDM, OSAT, packaging house, bumping house, etc…).
It will enable you to:
• Search by WLP technology capacities and capabilities
• Review the profile and repartition of one given technology among the different industry players
• Study players manufacturing / outsourcing strategy and supply chain
• Identify and source new WLP service suppliers for the wafer -scale packaging of your products

Content of the database
This database lists the following information:
• General information:
‐ Fab location
‐ Fab function (Front-end, Back-end, etc…)
‐ Main customer, JV, partnership
• Details about technology:
‐ TSV
‐ RDL and passivation
‐ Bumping technologies (plating, printing, …)
‐ Stacking technologies (W2W, C2W)
• Technology platforms available by location:
‐ WLCSP
‐ FO-WLP
‐ Flip-chip wafer bumping (Au, solder, Cu,
etc…)
‐ 3D-WLCSP
‐ 3DIC
‐ Interposers
‐ Wafer Level Optic
• Capacities information (in 300mm eq wf/year):
‐ Wafer diameter (4”/6”/8”/12”/panel)
‐ Wafer type (Si, GaAs, etc…)
‐ Capacities by platforms
‐ Capacities by bumping technologies
‐ Others capabilities: thin wafer handling,
wafer bonding, …
• Business model & region:
‐ Breakdown by business models
‐ Breakdown by regions
Companies listed in the database
Our database references over 150 companies (IDMs, OSAT, foundries, MEMS, R&D Lab,
etc…) and their 250 + wafer fab locations worldwide
Wafer packaging houses:
- Xintec
- China WLCSP
- Nemotek
- OptoPac
- …
R&D Lab & prototype lines:
- CEA LETI
- IMEC
- RTI
- …
MEMS IDM/foundries:
- Silex
- Dalsa
- APM
- …
TSV foundries:
- ALLVia
- EPWorks
- …
Wafer
Packaging Fabs
Database
IC manufacturers (IDM):
- Texas Instruments
- STMicroelectronics
- Samsung
- …
Wafer bumping houses:
- NEPES
- ChipBond
- FCI
- …
OSAT:
- ASE
- SPIL
- STATSChipPac
- …
CMOS foundries:
- TSMC
- Globalfoundries
- UMC
- …

SAMPLE OF THE CONTENT
This first exhaustive database of 250+ factories with capabilities and capacities for Wafer
Level Packaging applications (Flip Chip wafer bumping, WL CSP, 3D WLP, 3DIC with TSV, 3D
interposers, FO-WLP). Below a partial screen shot of its content.
Capacities (in 300mm eq wf) per platforms
Wafer bumping capacities (in 300mm eq wf)

WORLDWIDE MAP OF THE WAFER PACKAGING FABS
250+ wafer fabs with ‘Mid-end’ capabilities worldwide
WHO SHOULD BUY THIS DATABASE?
• Equipment & Material suppliers
– Identify key WLP players and locations
worldwide with detailed quantitative and
qualitative information about their installed
capacities for wafer-level-packaging in the Midend
– Screen market penetration status of one
particular technology (e.g. TSV, copper pillar
bumping, gold bumping, RDL, etc…) worldwide
and understand who are their key users
• IDM, fabless and fab-light players
– Oversee supplier subcontractors capabilities and
capacities per WLP technology.
– Benchmark several different subcontractors
– Identify new sourcing strategies
• Small IDM or niche market IDM
– Identify prototype lines for WLP
worldwide
– Identify small fabs capable of handling
very specific wafer-level-packaging
schemes (e.g. with exotic materials, 4’’
small wafer diameter, etc…)
• OSAT, foundries, packaging and bumping
house
– Get an exhaustive list of competitors
or potential partners in your field
– Evaluate global WLP capacities by
technologies, regions, business
models
– Information about key customers’
internal installed capacities in the Midend
BIO OF THE AUTHOR
Christophe Zinck, PhD joined Yole Developpement after several positions in the wafer fab and
packaging environment of CE A-Leti, ST and TriQuint Semiconductor, where he has developed
WLP & flip-chip technology for S AW duplexers. He is now project manager for Advanced
Packaging, WLP & 3D system Integration and RF devices. He authored and co-authored 15+
publications and is currently holding 3 US patents.

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Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy
consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole
Développement group has expanded to include more than 40 associates worldwide covering MEMS and microfluidics, Advanced Packaging, Compound
Semiconductors, Power Electronics, LED, and Photovoltaic. The group supports companies, investors and R&D organizations worldwide to help them
understand markets and follow technology trends to develop their business.
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marketing analysis
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costing
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fund raising)
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tools
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