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9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France<br />
Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr<br />
April 2012 - Version 1<br />
Written by: Romain FRAUX<br />
DISCLAIMER : <strong>System</strong> <strong>Plus</strong> <strong>Consulting</strong> provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic<br />
estimates which do not bind <strong>System</strong> <strong>Plus</strong> <strong>Consulting</strong> nor the manufacturers quoted in the report. <strong>System</strong> <strong>Plus</strong> <strong>Consulting</strong> is in no case responsible for the consequences related to the use which is<br />
made of the contents of this report. The quoted trademarks are property of their owners.<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 1
Table of Contents<br />
Glossary<br />
1. Overview / Introduction..………….…………….…........…4<br />
– Executive Summary<br />
– Reverse Costing Methodology<br />
2. STMicroelectronics Company Profile……….....…….....6<br />
– ST Profile<br />
– ST key fabs, assembly and R&D locations<br />
– ST MEMS Gyroscopes Portfolio<br />
– L3G3250A Characteristics<br />
– ST Business Model<br />
3. L3G3250A Physical Analysis…………...…............…...13<br />
– Physical Analysis Methodology<br />
– Package Characteristics & Markings<br />
– Package Pin-Out<br />
– Package X-Ray<br />
– Package Cross-Section<br />
– Package Opening<br />
– ASIC – Dimensions<br />
– ASIC – Markings<br />
– ASIC – Cross-Section<br />
– ASIC Process Characteristics<br />
– MEMS – Dimensions<br />
– MEMS – Markings<br />
– MEMS – Bond Pads Opening<br />
– MEMS – Bond Pads<br />
– MEMS – Cap Opening<br />
– MEMS – Cap<br />
– MEMS – Sensing Area<br />
– MEMS – Cross-section<br />
– MEMS Process Characteristics<br />
– Physical Data Summary<br />
4. Manufacturing Process Flow………………………..….59<br />
– Global Overview<br />
– ASIC Process Flow<br />
– Description of the ASIC Wafer Fabrication Unit<br />
– MEMS Process Overview<br />
– MEMS Sensor Process Flow<br />
– MEMS Cap Process Flow<br />
– MEMS Wafer Bonding Process Flow<br />
– Description of the MEMS Wafer Fabrication Unit<br />
5. Cost Analysis…………………….……………………..…..75<br />
– Synthesis of the Cost Analysis<br />
– Main Steps of Economic Analysis<br />
– Yields Explanation<br />
– Yields Hypotheses<br />
– Die per wafer & Probe Test<br />
– ASIC Front-End : Hypotheses<br />
– ASIC Front-End Cost<br />
– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing<br />
– ASIC Dies Cost<br />
– MEMS Front-End : Hypotheses<br />
– MEMS Front-End Cost<br />
– MEMS Front-End Cost per Process Steps<br />
– MEMS Front-End : Equipment Cost per Family<br />
– MEMS Front-End : Material Cost per Family<br />
– MEMS Back-End 0 : Probe Test & Dicing<br />
– MEMS Die Cost (Front End + Back End 0)<br />
– Back-End 1 : Packaging Cost<br />
– Back-End 1 : Final test & Calibration Cost<br />
– L3G3250A Component Cost (FE + BE 0 + BE 1)<br />
6. Estimated Price Analysis….………….……………........100<br />
– Definition of Prices<br />
– Manufacturer Financial Ratios<br />
– L3G3250A Estimated Manufacturer Price<br />
– L3G3250A Estimated Selling Price<br />
Contact…….……………………………...………………..….107<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 2
Executive Summary<br />
• This full reverse costing study has been conducted to provide insight on technology<br />
data, manufacturing cost and selling price of the STMicroelectronics L3G3250A<br />
component.<br />
• The L3G3250A is a 3-axis MEMS gyroscope manufactured using a surface<br />
micromachining process (THELMA process).<br />
• It is suitable for further applications:<br />
Gaming and virtual reality input devices<br />
Motion control with MMI (man-machine interface)<br />
GPS navigation systems<br />
Appliances and robotics<br />
• Compatible with SMD process, the L3G3250A is provided in a 3.5x3x1.0mm LGA 16-<br />
pin package.<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 3
Reverse Costing Methodology<br />
The reverse costing analysis is conducted in 3 phases:<br />
• Package is analyzed and measured.<br />
• The dies are extracted in order to get overall data: dimensions, main<br />
blocks, pad number and pin out, die marking<br />
• Set up of the manufacturing process.<br />
Teardown<br />
analysis<br />
• Setup of the manufacturing environment<br />
• Cost simulation of the process steps with different year scenarios<br />
Costing<br />
analysis<br />
• Supply Chain Analysis<br />
• Analysis of the selling price<br />
Selling price<br />
analysis<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 4
Packages X-Ray<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 5
Package Opening<br />
Package Opening – SEM view<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 6
MEMS – Cap Opening<br />
MEMS with Cap removed Overview – SEM View<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 7
ST's 3-Axis Gyroscope MEMS Dies Comparison<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 8
MEMS - Cross-Section<br />
MEMS cap cross-section – SEM View<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 9
Sensor Process Flow<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 10
Sensor Process Flow 1/2<br />
Si wafer<br />
• Thinning 300µm<br />
• Isolation oxide<br />
(Oxide1) deposit<br />
Si wafer<br />
• Buried Poly (Poly1)<br />
deposition<br />
• Ion implantation<br />
• Pattern & etch<br />
Si wafer<br />
• Sacrificial oxide<br />
(Oxide 2) deposit<br />
• Pattern & etch<br />
Si wafer<br />
• Structural Layer<br />
(Poly 2) deposit<br />
• CMP & ion implant<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 11
Main steps of economic analysis<br />
Front-End<br />
ASIC Front-End Cost<br />
MEMS Front-End Cost<br />
Back-End 0<br />
Probe Test Cost<br />
Backgrinding & Dicing Cost<br />
Probe Test Cost<br />
Dicing Cost<br />
Back-End 1<br />
Packaging Cost<br />
Final Test & Calibration Cost<br />
Component Cost<br />
L3G3250A<br />
• We perform the economic analysis of the ASIC with the IC Price+ software.<br />
• We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 12
ASIC Die Cost (Front-End + Back-End 0)<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 13
MEMS Front-End Cost<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 14
MEMS FE Cost per Process Steps (1/2)<br />
Sensor Manufacturing Steps Cost (Simulated with MEMS CoSim+ Cost Simulation Tool)<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 15
L3G3250A Component Cost (FE+BE 0+BE 1)<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 16
L3G3250A Estimated Selling Price (Medium Yield)<br />
© 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A – 3-Axis MEMS Gyroscope 17
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