Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
SOIC / SOP<br />
The Small Outline Integrated Circuit (SOIC) and Small<br />
Outline Package (SOP) are arguably the most common<br />
package types used today. Similar to the QFP and QFN,<br />
the SOIC ands SOP are leadframe-type packages, with<br />
leadframe finish dictating the Die Attach and Molding<br />
Compound requirements.<br />
SOIC / SOP<br />
Die Attach Adhesives<br />
Molding<br />
Compounds<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Green<br />
Non-Green<br />
ABLEBOND<br />
8352L<br />
ABLEBOND<br />
8200C<br />
ABLEBOND<br />
2025DSI<br />
ABLEBOND<br />
8900NC<br />
HYSOL<br />
GR725LV-LS<br />
HYSOL<br />
KL-4500-1NT<br />
ABLEBOND<br />
84-1LMISR4<br />
ABLEBOND<br />
8200TI<br />
HYSOL<br />
QMI538NB<br />
ABLECOAT<br />
8008NC (WBC)<br />
HYSOL<br />
GR828D<br />
ABLECOAT<br />
8008HT (WBC)<br />
ABLEBOND<br />
8290<br />
HYSOL<br />
QMI536HT<br />
ABLECOAT<br />
8006NS (WBC)<br />
HYSOL<br />
KL-G450H<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLEBOND<br />
FS849-TI<br />
ABLESTIK<br />
ABP-8910T<br />
HYSOL<br />
KL-G730<br />
HYSOL<br />
QMI519<br />
ABLEBOND<br />
84-1LMISR8<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
QMI529HT<br />
ABLESTIK<br />
C100 (Film)<br />
HYSOL<br />
QMI529HT-LV<br />
9
Change language