Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MaTERIALS<br />
DIE ATTACH ADHESIVES<br />
LEADED PACKAGES: SOP, SOIC, QFN, QFP, DISCRETES<br />
LEADED PACKAGES: NON-ELECTRICALLY CONDUCTIVE<br />
PRODUCT<br />
ABLEBOND<br />
2025DSI<br />
DESCRIPTION<br />
FINISH (Ag,<br />
Cu, Au)<br />
MRT<br />
ELECTRICAL<br />
CONDUCTIVITY<br />
THERMAL<br />
CONDUCTIVITY,<br />
W/mK<br />
DISPENSABILITY<br />
Non-conductive, low bleed Adhesive. Ag, Cu, Au L2 - 260 N/A 0.4 Good<br />
CURE SCHEDULE<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLECOAT<br />
8006NS (WBC)<br />
Non-conductive, oven cure Adhesive utilizing WBC technology. Ag, Cu, Au L1 - 260 N/A 0.4<br />
Screen or Stencil<br />
Print<br />
B-stage + 120 min. @ 160°C<br />
ABLECOAT<br />
8008NC (WBC)<br />
Non-conductive, snap cure Adhesive utilizing WBC technology. Ag, Cu, Au L1 - 260 N/A 0.5 Stencil Print B-stage + 60 sec. @ 230°C<br />
ABLEBOND<br />
8900NC<br />
Non-conductive, epoxy Die Attach Adhesive is designed for in-line snap<br />
cure processing or fast cure operations in conventional box ovens. This<br />
high strength Adhesive is moderately stress-absorbing, and intended for<br />
small-to-medium size packages.<br />
Ag, Cu, PdCu N/A 2.3 x 10 13 0.3 Excellent<br />
30 min. ramp to 175°C<br />
+ 15 min. @ 175°C<br />
ABLESTIK<br />
ABP-8910T<br />
Self-filleting Adhesive for same die stacking applications that require<br />
100% coverage.<br />
N/A L3 - 260 1 x 10 13 0.3 Excellent<br />
30 min. ramp to 150°C<br />
+ 30 min. @ 150°C<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
QMI547<br />
For component or die attach where very high electrical and thermal<br />
conductivity is required. Suitable for high heat dissipation devices and<br />
solder replacement applications.<br />
Ag, Au L1 - 260 4 x 10 -5 7 Fair<br />
Fluoropolymer-filled, Non-conductive Adhesive. Au, Ag, Cu L3 - 260 1 x 10 13 0.3 Excellent<br />
≥ 60 sec. @ 185°C<br />
(SkipCure) 30 min. @ 185°C<br />
(Oven)<br />
≥8 sec. @ 150°C (SkipCure)<br />
15 min. @ 150°C (Oven)<br />
DIE ATTACH SOLDER PASTE: DISPENSABLE<br />
PRODUCT DESCRIPTION APPLICATION VISCOSITY, cPs ALLOY REFLOW CLEANABILITY<br />
IPC/J-STD-004<br />
CLASSIFICATION<br />
MULTICORE<br />
DA100<br />
Flux designed for Solder Die Attach Paste applications.<br />
Effective thermal control for Cu leadframe power<br />
semiconductor devices, such as rectifiers, power transistors,<br />
and for automotive and consumer packages.<br />
Dispensing 250,000 High Pb Forming Fast Excellent ROL0<br />
DIE ATTACH SOLDER PASTE: PRINTABLE<br />
PRODUCT DESCRIPTION APPLICATION VISCOSITY, cPs ALLOY REFLOW CLEANABILITY<br />
IPC/J-STD-004<br />
CLASSIFICATION<br />
MULTICORE<br />
DA101<br />
Flux designed for Solder Die Attach Paste applications.<br />
Effective thermal control for Cu leadframe power<br />
semiconductor devices, such as rectifiers, power transistors,<br />
and for automotive and consumer packages.<br />
Printing 250,000 High Pb Forming Fast Excellent ROL0<br />
19
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