Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MaTERIALS<br />
Discretes / High Voltage Applications<br />
TO, AXIAL, BRIDGE, DIP<br />
Molding<br />
CompoundS<br />
PRODUCT<br />
DESCRIPTION<br />
VOLTAGE<br />
RATING<br />
IONIC<br />
CONDUCTIVITY,<br />
ROOM TEMP.<br />
IONIC<br />
CONDUCTIVITY,<br />
150°C<br />
MSL<br />
GREEN<br />
SPIRAL<br />
FLOW, cm<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR15F-1P<br />
Green, anhydride-cured Molding Compound contains spherical<br />
filler and is designed for high voltage applications. This product<br />
has excellent moldability performance with high yield rates.<br />
>900 V discrete,<br />
>400 V IC<br />
3.6 5.2 L1/235°C N 65 23 160<br />
HYSOL<br />
MG15F<br />
Anhydride-cured Molding Compound designed specifically for use<br />
in high voltage power applications requiring good electrical stability<br />
at high temperature. This material is specifically recommended for<br />
power discrete, high voltage rectifier and other applications where up<br />
until now only silicone Molding Compounds have been satisfactory.<br />
>900 V discrete,<br />
>400 V IC<br />
3.6 5.2 L1/235°C N 65 23 160<br />
37
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