Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Image sensors<br />
Image sensors are devices that are integrated into digital<br />
cameras, cell phones and other handheld devices where<br />
functionality dictates image capture capability. Image<br />
processors such as digital light processors (DLPs) are<br />
incorporated into projectors, televisions and, now, even<br />
into cell phones.<br />
Like all electronics, the trend in<br />
image sensor technology is the<br />
drive toward miniaturization, and<br />
also combines requirements for<br />
automatic focus and consumer<br />
affordability. From a materials<br />
point of view, image sensor assembly<br />
processes call for Adhesives that offer<br />
low temperature and fast cure, precise<br />
position and bondline control, and,<br />
in some cases, UV and transparency<br />
properties. Through the use of rheology<br />
control and filler technology, unique<br />
Adhesives have been designed to address<br />
the emerging requirements of image<br />
sensor assembly.<br />
Thermal Cure<br />
ABLEBOND<br />
8387B<br />
ABLEBOND<br />
8387BS<br />
ABLELUX<br />
LHA-2<br />
LOCTITE<br />
3128<br />
LOCTITE<br />
3129<br />
LOCTITE<br />
3220<br />
Image Sensor / Processor<br />
Module Assembly<br />
Lens Holder Attach / Lens<br />
Locking Materials<br />
UV Cure<br />
LOCTITE<br />
3751<br />
HYSOL<br />
UV3000<br />
LOCTITE<br />
UV8000<br />
UV / Thermal Cure<br />
ABLELUX<br />
A4502<br />
ABLELUX<br />
LA-1UV<br />
LOCTITE<br />
3131<br />
LOCTITE<br />
3217<br />
Image Sensor / Processor<br />
Package & Module<br />
Die Attach, Underfill &<br />
Glass Attach<br />
Die Attach<br />
Flip-Chip Bonding<br />
Wafer Level Assembly<br />
Glass Lid Attach<br />
ABLEBOND<br />
2035SC<br />
ABLEBOND<br />
GA-2W<br />
hysol<br />
qmi538nb<br />
HYSOL<br />
FP5110C<br />
HYSOL<br />
FP5201<br />
ABLELUX<br />
OGR150THTG<br />
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