Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Materials<br />
ENCAPSULANTS<br />
PACKAGE LEVEL: FILL MATERIALS<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
% FILLER RECOMMENDED CURE<br />
HYSOL<br />
3327<br />
HYSOL<br />
3329<br />
Developed for encapsulation of wire bonded dies, used for Smart Card IC<br />
modules. It is designed for use only with Hysol UV dam encapsulants, such as<br />
Hysol 3323.<br />
Developed for encapsulation of wire bonded dies, used for Smart Card IC<br />
modules. It is designed for use only with Hysol UV dam encapsulants, such as<br />
Hysol 3323.<br />
N/A 8,000 110 45 40 30 sec. @ 365 nm (UVA)<br />
N/A 8,000 150 45 40 30 sec. @ 365 nm (UVA)<br />
HYSOL<br />
CB0260<br />
HYSOL<br />
CB0260-1<br />
HYSOL CB064 /<br />
FP4653<br />
HYSOL<br />
FP4450<br />
High adhesion version of FP4450 for 260°C L3 JEDEC performance. High 40,000 145 18 74<br />
High adhesion version of FP4450 for 260°C L2A JEDEC performance. High 40,000 149 18 74<br />
Ultra low CTE, low stress version of FP4450 for large array packages. Low 80,000 150 8 86<br />
Industry standard fill material for dam and fill or cavity down BGAs. Medium 43,900 155 22 73<br />
1 hr. @ 110°C<br />
+ 2 hrs. @ 160°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
2 hrs. @ 110°C<br />
+ 2 hrs. @ 160°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4450HF<br />
High flow version of FP4450LV using synthetic filler for use in fine wire and low<br />
alpha application.<br />
Very High 32,000 164 21 73<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4450LV<br />
HYSOL<br />
FP4460<br />
HYSOL<br />
FP4470<br />
HYSOL<br />
FP4654<br />
HYSOL<br />
UV8800M<br />
Low viscosity version of FP4450 incorporating cleaner resins. High 35,000 160 22 72<br />
Glob top version of FP4450. Low 300,000 173 20 75<br />
High adhesion version of FP4450 for 260°C L3 JEDEC performance. High 48,000 148 18 75<br />
Low viscosity, high adhesion, version of FP4653 for large array packages. Medium 32,000 146 13 80<br />
UV cure Encapsulant for smart card and other COB applications. Medium 3,500 29 41 54<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
1 hr. @ 125°C<br />
+ 2 hrs. @ 160°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
30 sec. @ 315<br />
- 400 nm (UVA)<br />
PACKAGE LEVEL: MAP Low Stress<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
VISCOSITY,<br />
cPs<br />
Tg, °C<br />
CTEa1,<br />
ppm/°C<br />
% FILLER RECOMMENDED CURE<br />
HYSOL<br />
FP4651<br />
Low viscosity version of FP4650 for large array packages. Medium 130,000 150 11 82<br />
1 hr. @ 125°C<br />
+ 90 min. @ 165°C<br />
HYSOL<br />
FP4652<br />
Fast cure, low stress version of FP4450 for large array packages. Medium 180,000 150 14 80<br />
15 min. @ 110°C<br />
+ 30 min. @ 165°C<br />
HYSOL CB064 /<br />
FP4653<br />
Ultra low CTE, low stress version of FP4450 for large array packages. Low 80,000 150 8 86<br />
2 hrs. @ 110°C<br />
+ 2 hrs. @ 160°C<br />
HYSOL<br />
FP4654<br />
Low viscosity, high adhesion, version of FP4653 for large array packages. Medium 32,000 146 13 80<br />
30 min. @ 125°C<br />
+ 90 min. @ 165°C<br />
DISCRETES, Fill Material<br />
PRODUCT DESCRIPTION FLOW SPEED<br />
VISCOSITY,<br />
cPs<br />
Tg, °C CTEa1, ppm/°C % FILLER RECOMMENDED CURE<br />
HYSOL<br />
FP0087<br />
Low stress fill for potting automated sensor and diodes; high Tg. High 20,000 175 18 76<br />
1 hr. @ 125°C<br />
+ 1 hr. @ 180°C<br />
29
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