Inertial Combo Sensors in Consumer and Automotive - I-Micronews
Inertial Combo Sensors in Consumer and Automotive - I-Micronews
Inertial Combo Sensors in Consumer and Automotive - I-Micronews
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<strong>Inertial</strong> <strong>Combo</strong> <strong>Sensors</strong> for<br />
<strong>Consumer</strong> & <strong>Automotive</strong><br />
Sample<br />
W<strong>in</strong>dows 8<br />
Sensor Fusion Driver<br />
Accelero<br />
meter<br />
Driver<br />
Gyro<br />
Driver<br />
Magneto<br />
meter<br />
Driver<br />
3D<br />
3D<br />
Accelero 3D Gyro Magneto SensorDynamics – Source<br />
Freescale meter<br />
System Plus Consult<strong>in</strong>g<br />
meter<br />
Cont<strong>in</strong>ental InvenSense<br />
© 2011
<strong>Inertial</strong> <strong>Combo</strong> <strong>Sensors</strong><br />
for <strong>Consumer</strong> & <strong>Automotive</strong><br />
Table of contents<br />
• Introduction, Def<strong>in</strong>itions & Methodology 3<br />
• Executive Summary 13<br />
1. 2009-2016 combo market overview 45<br />
2. 2009-2016 global market for accelerometers, gyroscopes <strong>and</strong><br />
magnetometers 62<br />
– Mobile phone & consumer electronics applications<br />
– <strong>Automotive</strong> applications<br />
3. Penetration of combo sensors: 2009-2016 market forecasts<br />
142<br />
4. Competitive l<strong>and</strong>scape 162<br />
– Market shares <strong>and</strong> major OEM contracts <strong>in</strong> consumer<br />
– Market shares <strong>and</strong> major OEM contracts <strong>in</strong> automotive<br />
5. System <strong>in</strong>tegration challenges <strong>and</strong> penetration of combo sensors<br />
185<br />
– System <strong>in</strong>tegration challenges for motion sensor combos<br />
<strong>in</strong> consumer<br />
– System <strong>in</strong>tegration challenges for motion sensor combos<br />
<strong>in</strong> Auto<br />
6. Software challenges for motion sensor combos 218<br />
– Challenges for sensor fusion<br />
– From a sensor to a function: OS compliance, APIs,<br />
functionality <strong>in</strong>tegration<br />
– Key motion sens<strong>in</strong>g solution providers<br />
– Key motion sensor manufacturers with strong software<br />
<strong>in</strong>volvment<br />
– <strong>Inertial</strong> process<strong>in</strong>g trends <strong>in</strong> automotive<br />
7. Evolution of the supply cha<strong>in</strong> <strong>and</strong> bus<strong>in</strong>ess models 253<br />
– Supply cha<strong>in</strong> analysis: divergence of models <strong>and</strong><br />
strategic partnerships<br />
– Evolution of the <strong>in</strong>ertial sensor <strong>in</strong>dustry <strong>and</strong> expected<br />
competitive changes<br />
– Strategic analysis for each key player of the <strong>in</strong>ertial<br />
combo market<br />
‣ AKM, Analog Devices, Bosch, Denso, Epson Toyocom,<br />
Freescale, InvenSense, Kionix, Memsic, Murata, Panasonic,<br />
Qualtre, SensorDynamics, Silicon Sens<strong>in</strong>g, ST<br />
Microelectronics, VTI<br />
• Conclusion <strong>and</strong> perspectives 290<br />
© 2011• 2<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Def<strong>in</strong>itions<br />
Types of combos<br />
• <strong>Consumer</strong> combo acronyms used <strong>in</strong> this report:<br />
– A+G combo<br />
• S<strong>in</strong>gle package with 3-axis accelerometer <strong>and</strong> 3-axis gyroscope (+ 1 ASIC die <strong>in</strong> general)<br />
– A+M combo<br />
• S<strong>in</strong>gle package with 3-axis accelerometer <strong>and</strong> 3-axis magnetometer (+ 1 or several ASIC dies)<br />
– A+G+M combo<br />
• S<strong>in</strong>gle package with 3-axis accelerometer, 3-axis gyroscope <strong>and</strong> 3-axis magnetometer (+ 1 or several ASIC dies)<br />
• Also called 9DOF combo (9 degrees of freedom)<br />
• <strong>Automotive</strong> combo acronyms used <strong>in</strong> this report:<br />
– ESC combo:<br />
• S<strong>in</strong>gle package with MEMS gyroscope die (1-axis), MEMS accelerometer die (1 or 2 axis) <strong>and</strong> 1 or 2 ASIC dies<br />
• Used for ESC function<br />
– ESC / Rollover combo:<br />
• S<strong>in</strong>gle package with MEMS gyroscope die (2 or 3 axis), MEMS accelerometer die (2 or 3 axis) <strong>and</strong> 1 or 2 ASIC dies<br />
• Used for both ESC <strong>and</strong> rollover function (+ sometimes other functions)<br />
– ESC / Airbag combo<br />
• S<strong>in</strong>gle package with MEMS gyroscope die (1, 2 or 3 axis), MEMS accelerometer die (low-g 1 to 3 axis + high g 2 axis) <strong>and</strong> 1<br />
or several ASIC dies<br />
• Used for both ESC, ma<strong>in</strong> airbag crash sensor functions (+ additional functions such as rollover…)<br />
• Does not exist today but this may exist with<strong>in</strong> a few years. Sometimes called « <strong>Automotive</strong> IMU » or « General sensor<br />
cluster »<br />
© 2011• 3<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Executive summary<br />
<strong>Inertial</strong> <strong>Combo</strong> <strong>Sensors</strong> <strong>in</strong> <strong>Consumer</strong> <strong>and</strong> <strong>Automotive</strong><br />
Scope of the study<br />
VTI<br />
A +G<br />
ESC<br />
BMW<br />
Rollover<br />
ST Microelectronics<br />
A+M<br />
<strong>Combo</strong>s <strong>in</strong><br />
CONSUMER<br />
ELECTRONICS<br />
<strong>Combo</strong>s <strong>in</strong><br />
AUTOMOTIVE<br />
ESC /<br />
TRW<br />
A+G+M<br />
ESC /<br />
Airbag<br />
Rollover<br />
Po<strong>in</strong>tInside<br />
SensorDynamics<br />
InvenSense<br />
Bosch<br />
Freescale<br />
Cont<strong>in</strong>ental<br />
© 2011• 4<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Executive summary<br />
Complexity of sensor fusion<br />
• One clear motivation for combo sensors is the possibility to reduce both cost <strong>and</strong> footpr<strong>in</strong>t by comb<strong>in</strong><strong>in</strong>g the<br />
two sensors <strong>in</strong>to one package with a s<strong>in</strong>gle ASIC<br />
– However this cost benefit is not yet obvious with the dynamism of the evolution of each <strong>in</strong>dividual sensor. Such benefit will be<br />
very application dependent<br />
– Lower cost units comb<strong>in</strong><strong>in</strong>g multiple MEMS sensors are poised for healthy growth, start<strong>in</strong>g with ESCs, br<strong>in</strong>g<strong>in</strong>g opportunity for<br />
new players <strong>and</strong> dem<strong>and</strong>s for sensor management solutions. This trend is show<strong>in</strong>g up first <strong>in</strong> the more mature automotive<br />
MEMS sector, where the price of the sensor unit for the electronic stability control system (ESC) can now be significantly<br />
reduced, by comb<strong>in</strong><strong>in</strong>g the accelerometer <strong>and</strong> the gyroscope <strong>in</strong> one package with one ASIC<br />
– Adoption is a little slower on the consumer side, where the fast chang<strong>in</strong>g technology means discrete device prices are still<br />
fall<strong>in</strong>g rapidly, so products from even six months before have less of a cost advantage. But the consumer market’s fast model<br />
turnover <strong>and</strong> short replacement cycles means that once the economics become compell<strong>in</strong>g <strong>and</strong> adoption starts <strong>in</strong> 2012 – 2013,<br />
market penetration will be faster <strong>and</strong> deeper than on the automotive side.<br />
• The second key motivation from combo sensors relies on sensor fusion<br />
– New functionality can now be offered us<strong>in</strong>g multiple sens<strong>in</strong>g elements<br />
– We see a strong evolution from sensors to solutions<br />
– This is an opportunity for players <strong>in</strong> the MEMS <strong>in</strong>dustry to compensate for the drastic decrease <strong>in</strong> price by sell<strong>in</strong>g high value<br />
solutions that <strong>in</strong>clude more software content<br />
• Who will capture the added value of these smart sensor systems?<br />
• There is likely room for multiple alternatives, with the sensor makers supply<strong>in</strong>g the algorithms to comb<strong>in</strong>e <strong>and</strong> cross-calibrate the<br />
sensor data <strong>and</strong> do some st<strong>and</strong>ard applications, while the software <strong>and</strong> chipset makers supply the higher level, specialty functions<br />
– <strong>Combo</strong> sensors require more complex software for the sensor fusion calculations, <strong>and</strong> those will likely need to be done on an<br />
MCU, not just the usual ASIC<br />
• This is driv<strong>in</strong>g changes <strong>in</strong> the supply cha<strong>in</strong>, as makers of microcontrollers, software, <strong>and</strong> subsystems start to take over more of the<br />
sensor management.<br />
© 2011• 5<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Executive Summary<br />
Typology of <strong>Combo</strong> <strong>Sensors</strong><br />
•Gyros comb<strong>in</strong>ed with accelerometers<br />
make sense for some functions such as<br />
gam<strong>in</strong>g <strong>and</strong> navigation<br />
•Similar manufactur<strong>in</strong>g platforms <strong>and</strong><br />
constra<strong>in</strong>ts for <strong>in</strong>tegration potentially real<br />
cost <strong>and</strong> size benefit<br />
•=> expected to surge quickly<br />
•2010: about 5% of magnetometers are embedded <strong>in</strong> such Accel /<br />
Magneto modules<br />
•Challenges: compass location (<strong>in</strong>terferences…), cost, footpr<strong>in</strong>t<br />
•Should ga<strong>in</strong> success for tablets <strong>and</strong> mobile phones <strong>in</strong> the next few years<br />
3-axis<br />
accelerometer<br />
IMU: 3A + 3M<br />
3A + 3G<br />
3A + 3G<br />
+ 3M<br />
3-axis<br />
gyroscope<br />
3-axis digital<br />
compass<br />
© 2011• 6<br />
•Overcome the problems of 3A+3G (loose absolute orientation over time) <strong>and</strong> 3A+3M (corruption of data if<br />
external magnetic field <strong>and</strong> slow detection of change <strong>in</strong> head<strong>in</strong>g)<br />
•Long term view: limited number of functions us<strong>in</strong>g those 3 sensors at the same time<br />
•Monolithic <strong>in</strong>tegration should be developed to reach the cost <strong>and</strong> size targets<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Executive Summary<br />
Different possibilities to process motion sens<strong>in</strong>g<br />
E.g. Mobile phone architecture:<br />
Motion data process<strong>in</strong>g at the<br />
sensor ASIC / CMOS level<br />
Motion data process<strong>in</strong>g<br />
at the baseb<strong>and</strong> level<br />
Motion data process<strong>in</strong>g<br />
<strong>in</strong> GPS chipset, Audio<br />
processor, PMU…<br />
Motion data process<strong>in</strong>g at the<br />
ma<strong>in</strong> CPU / application processor<br />
level<br />
© 2011• 7<br />
Compass<br />
Motion data process<strong>in</strong>g <strong>in</strong> a low<br />
power MCU<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Executive Summary<br />
Structure of passager vehicles with current <strong>in</strong>tegration of<br />
<strong>in</strong>ertial sensors<br />
• Front crash sensor<br />
• Rollover sensors<br />
• ESC accelerometer<br />
• ESC gyro (possibly)<br />
St<strong>and</strong>alone sensor<br />
• ESC gyro (possibly)<br />
• Navigation gyroscope<br />
• ESC unit (process<strong>in</strong>g)<br />
• ESC gyroscope (possibly)<br />
• ESC accelerometer<br />
(possibly)<br />
GPS<br />
St<strong>and</strong>alone<br />
sensor<br />
St<strong>and</strong>alone<br />
peripharal<br />
module<br />
ABS /<br />
Brake ECU<br />
Airbag ECU<br />
TPMS<br />
module<br />
BMW<br />
St<strong>and</strong>alone<br />
peripharal<br />
module<br />
TPMS<br />
module<br />
• Motion detection sensor<br />
St<strong>and</strong>alone peripharal module<br />
• Satellite crash sensors<br />
© 2011• 8
MEMSIC<br />
3.7%<br />
Analog<br />
Devices<br />
6.2%<br />
Freescale<br />
7.1%<br />
Market Shares<br />
2009 & 2010 revenues - Accelero & Gyro<br />
2009 MEMS Accelerometer market shares <strong>in</strong><br />
value – <strong>Consumer</strong> (total: $506.5M)<br />
VTI<br />
0.3%<br />
Kionix<br />
10.9%<br />
Others<br />
13%<br />
Bosch<br />
Sensortec<br />
17.4%<br />
ST<br />
Microelectr<br />
onics<br />
41.5%<br />
MEMSIC<br />
2.2%<br />
Yole Developpement © Oct. 2011<br />
Analog<br />
Devices<br />
4.3%<br />
Freescale<br />
5.0%<br />
Kionix<br />
9.5%<br />
2010 MEMS Accelerometer market shares <strong>in</strong><br />
value - <strong>Consumer</strong> (total: $615.6M)<br />
VTI<br />
0.3%<br />
Others<br />
13.9%<br />
Bosch<br />
Sensortec<br />
17.4%<br />
ST<br />
Microelectr<br />
onics<br />
47.5%<br />
2009 MEMS Gyroscope market shares <strong>in</strong> value - <strong>Consumer</strong><br />
(total: $250.9M)<br />
Yole Developpement © Feb. 2011<br />
Murata<br />
14,8%<br />
Sony<br />
0,1%<br />
Others<br />
2,9%<br />
InvenSense<br />
29,1%<br />
2010 MEMS Gyroscope market shares <strong>in</strong> value<br />
– <strong>Consumer</strong> (total: $402.3M)<br />
Murata<br />
4.0% Others<br />
7.4%<br />
Sony<br />
10.6%<br />
InvenSense<br />
23.6%<br />
© 2011• 9<br />
Panasonic<br />
19,0%<br />
ST<br />
Microelectroni<br />
cs<br />
2,2%<br />
Epson<br />
Toyocom<br />
32,0%<br />
Panasonic<br />
15.0% ST<br />
Microelectr<br />
onics<br />
19.2%<br />
Epson<br />
Toyocom<br />
20.2%<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Impact of the new bus<strong>in</strong>ess models<br />
<strong>in</strong> the supply cha<strong>in</strong><br />
• As the <strong>in</strong>dustry maturates <strong>and</strong> as combo sensors are developed, new bus<strong>in</strong>ess models appear:<br />
– Some players specialize <strong>in</strong> MEMS die / wafer manufactur<strong>in</strong>g<br />
– Lead<strong>in</strong>g players specialize <strong>in</strong> supply<strong>in</strong>g sensor solutions<br />
2000-2010 2010-2020<br />
MEMS player A<br />
MEMS player B<br />
MEMS player A<br />
MEMS player B<br />
MEMS die A<br />
MEMS die B<br />
MEMS sensor A<br />
MEMS sensor B<br />
ASIC, packag<strong>in</strong>g,<br />
assembly, calibration,<br />
test<br />
<strong>Combo</strong> sensor<br />
Exemple: ST<br />
(Accelerometer /<br />
Magnetometer combo)<br />
Honeywell<br />
(Magnetometer wafers)<br />
© 2011• 10<br />
2011 Copyrights © Yole Développement SA. All right reserved.
New ways for motion sens<strong>in</strong>g <strong>in</strong>tegration<br />
GPS chipset<br />
CSR SIRFstarIV GSD4e<br />
(GPS RF <strong>and</strong> baseb<strong>and</strong> + ARM7 on a s<strong>in</strong>gle die)<br />
Power management unit<br />
Maxim Power SoC<br />
Motion process<strong>in</strong>g<br />
possibilities<br />
Audio processor<br />
Wolfson WM0010 HD Audio DSP<br />
© 2011• 11<br />
2011 Copyrights © Yole Développement SA. All right reserved.
<strong>Inertial</strong> sensors value cha<strong>in</strong> <strong>in</strong> 2011<br />
For consumer <strong>and</strong> automotive<br />
~ $450M ~ $350M ~ $420M ~ $270M ~ $30M<br />
MEMS Front-end<br />
ASIC Front-end<br />
~ $2.6B <strong>in</strong>dustry! (consumer + auto)<br />
Back-end /<br />
Packag<strong>in</strong>g<br />
Test &<br />
Calibration<br />
Software<br />
(<strong>in</strong>dependent sale of IP)<br />
SMDK<br />
+ $1.1B gross marg<strong>in</strong> (Cost of sales, G&A, R&D, Operational marg<strong>in</strong>)<br />
• In 2011, the <strong>in</strong>ertial sensor <strong>in</strong>dustry is now a $2.6 Billion bus<strong>in</strong>ess!<br />
– ~ $450M is related to the MEMS Front-end. This area is stable because the MEMS die cost is be<strong>in</strong>g strongly reduced<br />
– ~ $350M is related to the ASIC Front-end. This is grow<strong>in</strong>g because although the technology nodes are more <strong>and</strong> more<br />
advanced, the need for larger process<strong>in</strong>g capabilities (sometimes with MCUs) <strong>in</strong>crease with combo sensors<br />
– ~ $420M is related to the Back-end / Packag<strong>in</strong>g. This area will grow a lot thanks to <strong>in</strong>creas<strong>in</strong>g expertise needed for<br />
combo sensors<br />
– ~ $270M is l<strong>in</strong>ked to Test & Calibration. It is strongly grow<strong>in</strong>g, driven by 3-axis gyroscopes <strong>and</strong> combo sensors<br />
– ~ $30M is l<strong>in</strong>ked to Software features. It is small today but def<strong>in</strong>itively poised for important growth <strong>in</strong> the future,<br />
especially for combo sensors (for sensor fusion…)<br />
© 2011• 12<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Strategy of each key player on combo sensors<br />
Detailed for each player <strong>in</strong> the report…<br />
XXX position related to combo sensors<br />
Product portfolio<br />
5<br />
4<br />
Offer of multi axis sensors, control of different type of<br />
sens<strong>in</strong>g elements, different market segments targeted<br />
Industry partnerships<br />
Strategic partnerships <strong>and</strong> network to control<br />
more sens<strong>in</strong>g elements, to offer software, to be<br />
part of a large <strong>and</strong> powerful supplier (weight of<br />
the company), or to have close connection with<br />
OEMs <strong>and</strong> platform designers<br />
3<br />
2<br />
1<br />
0<br />
End-markets<br />
Market shares, diversity of customers,<br />
diversity of applications<br />
Capacity to susta<strong>in</strong> low costs<br />
Production <strong>in</strong>frastructure<br />
optimized for low cost…<br />
Invovment <strong>in</strong> combos<br />
<strong>Combo</strong>s <strong>in</strong> the portfolio, or <strong>in</strong> development,<br />
or capability to do it, variety of combo types<br />
Capability of technology <strong>in</strong>tegration<br />
Ability to <strong>in</strong>tegrate closely different sens<strong>in</strong>g elements <strong>in</strong> a size <strong>and</strong><br />
/ or cost-effective way (similar front-end technologies, WLP…)<br />
Involvment on software<br />
Offer of specific software libraries, of<br />
sensor fusion solutions<br />
Conclusion<br />
© 2011• 13<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Yole activities <strong>in</strong> MEMS<br />
Media bus<strong>in</strong>ess<br />
News feed / Magaz<strong>in</strong>es /<br />
Webcasts<br />
Market<br />
Research<br />
Reports<br />
Market research,<br />
Technology & Strategy<br />
Consult<strong>in</strong>g services<br />
www.yole.fr<br />
© 2011• 14<br />
2011 Copyrights © Yole Développement SA. All right reserved.
Available MEMS Reports<br />
Permanent Wafer<br />
Bond<strong>in</strong>g<br />
Th<strong>in</strong> Wafer<br />
H<strong>and</strong>l<strong>in</strong>g<br />
MEMS Microphone<br />
Ferro-Electric<br />
Th<strong>in</strong> Films<br />
Trends <strong>in</strong> MEMS<br />
Manufactur<strong>in</strong>g &<br />
Packag<strong>in</strong>g<br />
New!<br />
New!<br />
New!<br />
New!<br />
New!<br />
Motion <strong>Sensors</strong> for<br />
<strong>Consumer</strong> & Mobile<br />
applications<br />
IMU &High<br />
Performance MEMS<br />
MEMS & <strong>Sensors</strong><br />
for Smartphones<br />
Uncooled IR Cameras &<br />
detectors for thermography<br />
& nigh Vision<br />
CMOS Image<br />
<strong>Sensors</strong><br />
New!<br />
MEMS Cosim+<br />
MEMS Manufactur<strong>in</strong>g<br />
Cost Simulation Tool<br />
MEMS Players:<br />
Analysis of F<strong>in</strong>ancial<br />
Performance<br />
© 2011• 15<br />
2011 Copyrights © Yole Développement SA. All right reserved.
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