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Rated Power and VSWR Improvement of Termination Resistor with ...

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frequency response <strong>of</strong> the fabricated component. Return loss plots <strong>of</strong> the measured results<br />

proved exceptional <strong>VSWR</strong> characteristics <strong>of</strong> both power resistors. Then we tested the parts<br />

for rated power. We applied various power <strong>and</strong> tested for highest peak surface temperature<br />

rise. We provided thermal pr<strong>of</strong>ile plots <strong>of</strong> both 20 Watt <strong>and</strong> 100 Watt resistors. Thermal<br />

pr<strong>of</strong>ile demonstrates the outst<strong>and</strong>ing power h<strong>and</strong>ling capability <strong>of</strong> both RF termination<br />

power resistors.<br />

References:<br />

[1] H. Wang, H. Shao, Z. Li, B. Liang, <strong>and</strong> F. Lin, “Development <strong>of</strong> simulant high power<br />

resistor,” Precision Electromagnetic Measurement Digest, CPEM 2008, pp. 404, June.<br />

2008.<br />

[2] E. Smart, “A low pr<strong>of</strong>ile power resistor,” IEE Colloquium on Pulsed <strong>Power</strong> 97, pp. 26,<br />

Mar. 1997.<br />

[3] H.C. Jiang, X. Si, W. L. Zhang, C. J. Wang, B. Peng, <strong>and</strong> Y. R. Li “Microwave power<br />

thin film resistors for high frequency <strong>and</strong> high power load applications,” Applied<br />

Physics Letters., vol. 97,no. 17, pp. 13750, Oct. 2010.<br />

[4] J.E. Naefe, R.W. Johnson, <strong>and</strong> R.R. Grzybowski, “High-temperature storage <strong>and</strong> thermal<br />

cycling studies <strong>of</strong> thick film <strong>and</strong> wirewound resistors” IEEE trans. On Components <strong>and</strong><br />

Packaging Technologies, vol. 25,no. 1, pp. 45, Mar. 2002.<br />

[5] W.D. Glodzik, D.J. II Yanko, <strong>and</strong> K. Chia, “Advanced ceramic composite for high<br />

energy resistors; characterization <strong>of</strong> electrical <strong>and</strong> physical properties,” IEEE Tenth<br />

International Pulsed <strong>Power</strong> Conference., vol. 2, pp. 1422, Jul. 1995.<br />

[6] E. C. Smith, <strong>and</strong> R.S. Chang, “Microstrip transmission line <strong>with</strong> finite-width dielectric<br />

<strong>and</strong> ground plane,” IEEE transaction on Microwave Theory <strong>and</strong> Techniques, vol. MTT-<br />

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[7] J.S. Fisher, <strong>and</strong> P.M. Hall, “<strong>Termination</strong> material for thin film resistors,” Proceedings <strong>of</strong><br />

the IEEE, vol. 59, no. 10, pp. 1418, Oct. 1971.<br />

[8] S. Chen, P. Sun, X. Wei, Z. Cheng, <strong>and</strong> J. Liu, “Studies <strong>of</strong> solder joint reliability under<br />

mechanical bending test on FR-4 PCBs <strong>with</strong> Sn-1.0 Ag-0.5 Cu solder paste,”<br />

International Symposium on High Density packaging <strong>and</strong> Microsystem Integration<br />

(HDP 2007), pp. 1, June. 2007.

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