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LIST OF FIGURES<br />

(Continued)<br />

Figure<br />

Page<br />

3.9 Calculated dependence <strong>of</strong> surface recombination velocity (Ss) for (a) n-Si <strong>and</strong><br />

(b) p-Si surfaces as a function <strong>of</strong> injection level (Δn) for different fixed positive<br />

charge densities <strong>and</strong> interface state densities, σn= 10 14 cm 2 <strong>and</strong> σp= 10-16 16<br />

cm-2 56<br />

3.10 Measured effective SRV showing dependence on excess carrier density [89]<br />

57<br />

3.11 High-resolution cross-sectional TEM <strong>of</strong> Si-SiΝx :Η interface before firing<br />

showing process-induced damage <strong>by</strong> plasma [92] 58<br />

3.12 Calculated recombination velocity, components S S <strong>and</strong> SSCR (dotted lines), <strong>and</strong><br />

the total Seff (solid lines) at SiΝx :Η/Si interface as a function <strong>of</strong> injection level.<br />

Assumptions: p-Si, 1.5 Ωcm, Q = 2x 1012cm-2, Dit1=1 x10 12 eV-1cm-2,<br />

D21x10 1 eV-1cm-2 ................... .......................................... .....e.....,. 60<br />

3.13 A schematic illustration <strong>of</strong> Η transport from SiΝ:Η layer to <strong>bulk</strong> Si .. 62<br />

3.14 The SIMS pr<strong>of</strong>iles <strong>of</strong> Η in a <strong>solar</strong> cell introduced during a PECVD SiN coating<br />

before (red line) <strong>and</strong> after contact annealing (black line) [98] ............ . ........... 63<br />

3.15 Effect <strong>of</strong> PECVD on the internal quantum efficiency <strong>of</strong> the cell [99] ............... 64<br />

4.1 A photograph <strong>of</strong> QSSPCD apparatus at NREL ... 67<br />

4.2 τb <strong>of</strong> a p-type Si wafer measured <strong>by</strong> QSSPCD as a function <strong>of</strong> time. The sample<br />

was cleaned <strong>by</strong> "ICP" <strong>and</strong> passivated in IE solution. (A) after ICP; (B) dilute<br />

HF dip after (A); (C) dilute HF dip after (B); (D) after oxidation clean [108] ...... 69<br />

4.3 Time dependence <strong>of</strong> 'Lb after including oxidation in the cleaning procedure, for<br />

sequential cleaning steps [ 108] ... ........................................ . .. . ..... . . .. 70<br />

4.4 τb decay after light exposure (no rise time was observed) [108] 72<br />

4.5 Short-term variation <strong>of</strong> τb fora long lifetime wafer. The wafer was cleaned with<br />

the new procedure [ 108] 72<br />

4.6 τb <strong>of</strong> a p-type wafer, resistivity 27 Ω-cm measured after several treatments: UV<br />

for 15 min <strong>and</strong> 30 min, heating, exposure to light for different times [108] 73<br />

xiv

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