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Surface and bulk passivation of multicrystalline silicon solar cells by ...

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17<br />

damage or stress in the <strong>silicon</strong> lattice in such a way that extended defects needed for<br />

trapping impurities are formed. These chemically reactive trapping sites are usually<br />

located at the wafer backside.<br />

Solar <strong>cells</strong> are minority-carrier devices <strong>and</strong> use nearly the entire <strong>bulk</strong> <strong>of</strong> the<br />

device. It is more attractive to apply external gettering techniques to clean up the <strong>bulk</strong><br />

<strong>of</strong> the material. Phosphorous diffusion <strong>and</strong> Al alloying are some <strong>of</strong> the processes that<br />

have worked well for efficient gettering <strong>of</strong> <strong>solar</strong> <strong>cells</strong>. Because these processes are<br />

used extensively in <strong>solar</strong>-cell manufacturing for junction <strong>and</strong> contact formation, all Si<br />

<strong>solar</strong> <strong>cells</strong> experience a certain degree <strong>of</strong> gettering.<br />

1.7 Passivation <strong>of</strong> Residual Impurities <strong>and</strong> Defects<br />

It should be noted that not all impurities can be completely gettered during <strong>solar</strong>-cell<br />

processing. Even impurities which are readily getterable remain in the <strong>solar</strong> cell at<br />

significant levels <strong>and</strong> introduce detrimental effects on <strong>solar</strong>-cell performance. In<br />

addition to the residual impurities, many crystallographic defects are stable at the<br />

processing temperatures. It is <strong>of</strong>ten observed that defect concentrations remain<br />

essentially unaltered <strong>by</strong> <strong>solar</strong>-cell processing. Therefore, it is important to identify<br />

methods <strong>of</strong> dealing with residual impurities <strong>and</strong> defects. Passivation has been applied<br />

to deal with residual impurities <strong>and</strong> defects. .<br />

It is known that the hydrogen <strong>passivation</strong> yields very good results in terms <strong>of</strong><br />

<strong>passivation</strong>. One <strong>of</strong> the most promising methods is application <strong>of</strong> the hydrogenated<br />

amorphous <strong>silicon</strong> nitride layers (a-SiΝ :Η) deposited <strong>by</strong> plasma-enhanced chemical<br />

vapor deposition (PECVD). These layers are used as very effective antireflective<br />

coatings [37]. The major interest in these films, however, is attributed to the <strong>bulk</strong> <strong>and</strong><br />

surface defect <strong>passivation</strong> <strong>of</strong> <strong>silicon</strong>. It has been shown that hydrogen released from

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