IV. Processes: Top-down and Bottom-up
IV. Processes: Top-down and Bottom-up
IV. Processes: Top-down and Bottom-up
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• Integrated Circuit (IC) Manufacturing<br />
- Plasma etching of metals, dielectrics, semiconductors<br />
- Plasma deposition of silicon, SiO 2 , dielectrics<br />
- Key steps in making memory & processor chips<br />
• III-V industry<br />
- Lasers, detectors, Rf <strong>and</strong> microwave devices, power amplifiers<br />
• Plasma Deposition of Inorganic Films<br />
SiO 2 , Al 2 O 3 , ITO, ZnO, SiN, AlN, PN, BN, TiN, TaN, SiC, TiC, Si, Ge, W, Mo, WS 2 , CuInSe 2<br />
• Plasma Deposition of Organic Films<br />
- Various monomers (acetylene, styrene, ethelyne, vinyl acetate…)<br />
- Plasma polymerized films<br />
- Carbon films<br />
• Plasma Surface Treatment<br />
- Oxygen plasma widely in use to clean surfaces of residues, mold release, etc.<br />
- Oxygen plasma treatment ⇑ wettability of surfaces for printing, dyeing, etc.<br />
• Plasma in sterilization of biological samples<br />
• Lighting, Flat panel plasma displays
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