INTEGRATED TECHNOLOGY CORPORATION
INTEGRATED TECHNOLOGY CORPORATION
INTEGRATED TECHNOLOGY CORPORATION
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Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
PROBE CARD METROLOGY<br />
HIGH TEMPERATURE TESTING<br />
OF PROBE CARDS<br />
Rod Schwartz<br />
VP & Technical Director<br />
Integrated Technology Corporation<br />
Dan Kosecki<br />
VP Software Development<br />
Integrated Technology Corporation<br />
4/9/2002 Copyright April 2002 - ITC<br />
www.inttechcorp.com<br />
<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Purpose<br />
• To show the effects of temperature<br />
on probe card parameters<br />
• To prove the usefulness of high<br />
temperature probe card metrology<br />
• To highlight some differences in<br />
probe card technology &<br />
construction<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Equipment & Samples<br />
• Probilt PB3500 Probe Card Analyzer with Hot<br />
Chuck Option<br />
• Epoxy Ring Cards<br />
– 3 Identical Cards<br />
– J971 Type<br />
– Designed for High Temperature<br />
• Form Factor Card<br />
– Logic Array<br />
• Membrane Card<br />
– Logic Array<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Hot Chuck Block Diagram<br />
HPCDA<br />
Supply<br />
Computer<br />
Interface<br />
Air Filter<br />
&<br />
Heater<br />
Hot Chuck<br />
System<br />
Controller<br />
Heated Air Control<br />
Heated Air Flow<br />
Probe Card<br />
Hot Chuck<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Hot Chuck System Controller<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Heated Measurement Chuck<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Heated Air “Top-Hat”<br />
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Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Bottom of “Top-Hat”<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
“Top-Hat” & Adapter<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Hot Chuck Specifications<br />
Control<br />
Point<br />
Minimum<br />
Temp.<br />
Maximum<br />
Temp.<br />
Control<br />
Stability<br />
Heated<br />
Chuck<br />
Room<br />
125 C<br />
+/- 1.0 C<br />
Heated<br />
Air<br />
Stream<br />
Room<br />
125 C<br />
+/- 1.0 C<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Metrology Environment<br />
Heated Air Flow<br />
Pogo Pins<br />
Pogo Pins<br />
Retainer<br />
Planarity<br />
Adjustors<br />
Camera & Optics<br />
Heated Chuck<br />
Heater Strips<br />
&<br />
Thermal Barrier<br />
X,Y,Z Stage<br />
Subchuck<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Probe Card Construction<br />
PCB<br />
PCB Aperture<br />
Ring Aperture<br />
Ring<br />
Epoxy<br />
Probe<br />
Probe Tip Depth<br />
PC<br />
Botto<br />
Surfa<br />
Probe Details<br />
Ring<br />
Highest<br />
Probe<br />
Lowest<br />
Probe<br />
Probe Wire<br />
Diameter<br />
Epoxy<br />
Planarity<br />
Tip<br />
Length<br />
Epoxy<br />
Clearance<br />
Tip Diameter<br />
Tip Shape<br />
Flat<br />
E-tip (Radiused)<br />
Figure 3: PCB and Epoxy Ring Assembly<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Probe Ring<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Large Ceramic Probe Ring<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Large Array on Probe Card<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Cross Section View<br />
CHUCK<br />
TEMP.<br />
25 C<br />
25 C<br />
60 C<br />
120 C<br />
80 C<br />
10 mils<br />
1000 mils<br />
1004 mils<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Pitch Change with Temp<br />
CHUCK<br />
TEMP<br />
25 C<br />
120 C<br />
70 u<br />
80 u<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Alignment Shifts (3 Cards)<br />
• Averages of 6 groups of 5 probes<br />
• 3 groups each side, evenly spaced<br />
• Boxes represent +/- 5 microns movement<br />
• Lines represent direction and magnitude<br />
of movement (25 °C C to 125 °C)<br />
• The “+” is 25 °C C location<br />
• #11-Red, #12-Blue, #14-Green<br />
• Repeatability of multiple runs affected by<br />
stabilization time<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Epoxy Ring Probe Card<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Epoxy Card Array<br />
X,Y Pad Coordinates<br />
6000<br />
4000<br />
2000<br />
Y (microns)<br />
0<br />
-6000 -4000 -2000 0 2000 4000 6000<br />
-2000<br />
-4000<br />
-6000<br />
X (microns)<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Alignment Shift (Epoxy Card)<br />
*Box = +/- 10u<br />
*The + in center of box is 25<br />
°C location<br />
*Each line is 5 probe average<br />
*Card 11 – Red<br />
*Card 12 – Blue<br />
*Card 13 – Green<br />
*Length of line represents<br />
the shift in position from<br />
25 °C to 125 °C.<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Other Shifts (Epoxy Card)<br />
Parameter<br />
Card 11<br />
Card 12<br />
Card 14<br />
Z Shift<br />
-221 u<br />
-147 u<br />
-148 u<br />
Planar<br />
55u (25)<br />
58u (25)<br />
30u (25)<br />
Window<br />
50u (125)<br />
54u (125)<br />
33u (125)<br />
Leakage<br />
6-10<br />
uA<br />
6-9 uA<br />
6-10<br />
uA<br />
Increase<br />
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Memory Card<br />
Probes at 25, 36, 70 & 90 °C<br />
Probes Movement with Temperature<br />
15<br />
Yoffset (microns)<br />
10<br />
5<br />
0<br />
-10<br />
-5<br />
0 10 20 30<br />
Series1<br />
Series2<br />
Series3<br />
-10<br />
Xoffset (microns)<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Form Factor Micro Spring<br />
MLC Connections<br />
Space Transformer<br />
Micro-Spring<br />
Contact Paddle<br />
Truncated Pyramid<br />
Probe Tip<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Form Factor Probe Card<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Form Factor Array<br />
X,Y Pad Coordinates<br />
6000<br />
4000<br />
2000<br />
Y (microns)<br />
0<br />
-8000 -6000 -4000 -2000 0 2000 4000 6000 8000<br />
-2000<br />
-4000<br />
-6000<br />
X (microns)<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Alignment Shifts (FFI)<br />
*Box = +/- 10u<br />
*The + in center of box is 25<br />
°C location<br />
*Each line is a single probe<br />
*Length of line represents<br />
the shift in position from 25<br />
°C to 125 °C.<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Other Shifts (FFI)<br />
Parameter<br />
FFI Card Value<br />
Z Shift<br />
-160 microns<br />
Planar Window<br />
Leakage Increase<br />
36 microns (25°C)<br />
48 microns (125 °C)<br />
0.4 to 0.6 uA<br />
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Form Factor Results<br />
• Fairly predictable results<br />
• Larger shift than epoxy ring<br />
• Not as consistent as expected<br />
• Data on only one card should not be<br />
taken as representative of type<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Membrane Probe Head<br />
Window (opt)<br />
Springs<br />
Probe<br />
Frame<br />
PCB<br />
Membrane<br />
Plunger<br />
Bumps<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Membrane Array<br />
X,Y Pad Coordinates<br />
15000<br />
10000<br />
5000<br />
Y (microns)<br />
0<br />
-15000 -10000 -5000 0 5000 10000 15000<br />
-5000<br />
-10000<br />
-15000<br />
X (microns)<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Alignment Shifts (Membrane)<br />
*Box = +/- 10u<br />
*The + in center of box is 25<br />
°C location<br />
*Each line is a single probe<br />
*Length of line represents the<br />
shift in position from 25 °C to<br />
100 °C.<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Other Shifts (Membrane)<br />
Parameter<br />
FFI Card Value<br />
Z Shift<br />
-145 microns<br />
Planar Window<br />
Leakage Increase<br />
72 microns (25°C)<br />
71 microns (100 °C)<br />
Not Run<br />
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Membrane Results<br />
• Mylar expands and probes move a<br />
lot<br />
• Very well behaved – predictable<br />
results<br />
• More temperature sensitive than<br />
other technologies<br />
• Requires card to be designed for<br />
temperature of use<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
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Cobra Probe Card<br />
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Cobra Head Cross Section<br />
Metalization<br />
Space<br />
Transformer<br />
Upper<br />
Die<br />
Mylar<br />
Lower<br />
Die<br />
"Cobra"<br />
Probe Needle<br />
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Cobra Considerations<br />
• Lower die is close to wafer<br />
– Heats up considerably<br />
– Test time vs. Index Time changes<br />
heating<br />
• Mylar insulator may move<br />
• Probe stresses<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
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Conclusions<br />
• Probe movement for most technologies<br />
with temperature is NOT predictable, but<br />
it IS repeatable<br />
• Epoxy card construction techniques can<br />
make a significant difference in<br />
temperature performance<br />
• FFI cards are more predictable than<br />
epoxy, but there are still variations<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
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Conclusions (2)<br />
• Membrane card is the most<br />
predictable<br />
• Membrane card has largest shifts<br />
with temperature<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
Providing Leading Edge Technology to Meet Your Future Requirements Today<br />
Future Studies<br />
• Other Probe Card Technologies<br />
• Scrub Mark vs. Analyzer Data<br />
• Probe Material Variations<br />
• Card Construction Techniques<br />
• Path of Probe Movement vs. Temperature<br />
Change<br />
• Stabilization Times vs. Repeatability<br />
4/9/2002 Copyright April 2002 - ITC<br />
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<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
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Acknowledgements<br />
• Bill Williams – Motorola<br />
– Thanks for supplying cards for this<br />
study.<br />
• Russ Allred - ITC<br />
– Data Collection<br />
• Hoa Do Thai - ITC<br />
– Data Collection<br />
4/9/2002 Copyright April 2002 - ITC<br />
www.inttechcorp.com<br />
<strong>INTEGRATED</strong> <strong>TECHNOLOGY</strong> <strong>CORPORATION</strong>
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