Probe-tip Clean on Demand - Semiconductor Wafer Test Workshop
Probe-tip Clean on Demand - Semiconductor Wafer Test Workshop
Probe-tip Clean on Demand - Semiconductor Wafer Test Workshop
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Introducti<strong>on</strong><br />
• Today <str<strong>on</strong>g>Probe</str<strong>on</strong>g>-<str<strong>on</strong>g>tip</str<strong>on</strong>g> clean settings are static<br />
• <str<strong>on</strong>g>Clean</str<strong>on</strong>g> interval is every x-dies or x-wafers<br />
• How to determine the right settings?<br />
• Not enough cleaning can cause yield loss!<br />
• To often cleaning will “eat-up” your <str<strong>on</strong>g>tip</str<strong>on</strong>g>s<br />
– When abrasive scrub is being used<br />
– Above all; it will cost time!<br />
• This presentati<strong>on</strong> is not about the cleanmethod<br />
but the clean moment!<br />
June 8 to 11, 2008<br />
IEEE SW <strong>Test</strong> <strong>Workshop</strong> 2
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