Probe-tip Clean on Demand - Semiconductor Wafer Test Workshop

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Results / Relevant Findings / Key Data • How does it work in practice? June 8 to 11, 2008 IEEE SW Test Workshop 22
Results / Relevant Findings / Key Data • Expect full recovery direct after clean – Measured value of 1 st die after clean is not above the threshold! – We had to change settings in recovery check mechanism (selectable after x-die) • Needed to implement site to site independency – For multi-side probe cards – If one of the sites requires cleaning, looking at the total-data did not initiate the clean in time! • Needed to exclude “real-rejects” from consecutive count. • How to handle geographical variation; – Different threshold towards the edge of a wafer? June 8 to 11, 2008 IEEE SW Test Workshop 23
Page 1 and 2: Rob Marcelis Salland Engineering <s
Page 3 and 4: Background • Case study for one o
Page 5 and 6: Objectives / Goals • To clean onl
Page 7 and 8: Methods / Materials / Procedures
Page 9 and 10: Methods / Materials / Procedures Mo
Page 11 and 12: Methods / Materials / Procedures Wa
Page 13 and 14: Methods / Materials / Procedures
Page 15 and 16: Real wafer data with clean every 10
Page 17 and 18: Wafer run without clean to 680 TD
Page 19 and 20: Test number 10634.0047 • Test dat
Page 21: Zoom in on clean moment threshold v
Page 25 and 26: site to site independency Site-0 an
Page 27 and 28: Strengths • Clean</strong
Page 29 and 30: Summary / Conclusion • It is poss
Page 31: Thank You • Let us clean on deman

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