international directory of flip-chip die attach bonders/aligners
international directory of flip-chip die attach bonders/aligners
international directory of flip-chip die attach bonders/aligners
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INTERNATIONAL DIRECTORY OF FLIP-CHIP DIE ATTACH BONDERS/ALIGNERS<br />
Company Name<br />
Address<br />
b Phone > Fax<br />
Year Founded<br />
Executives<br />
Advertisers are listed in boldface type.<br />
Model<br />
x Introduced<br />
A Level <strong>of</strong> Automation:<br />
M=Manual,<br />
S=Semi-Automated,<br />
A=Automated<br />
Wafer Size Range<br />
P Placement Accuracy,<br />
µm@3 sigma<br />
Z Z-Axis Travel<br />
D Die Edge<br />
Length Capability<br />
V Footprint<br />
Width by Depth, mm<br />
and (inches)<br />
Primary Applications<br />
Secondary Applications<br />
B Bonding Methods:<br />
A=Adhesive, E=Eutectic,<br />
F=Flip Chip, P=Preform,<br />
S=Solder, T=Tape, O=Other<br />
S Special Features<br />
[web site]<br />
Technical Contact<br />
b Phone > Fax<br />
Additional Offices<br />
Notes: All shown information was furnished by the respective manufacturers. All <strong>bonders</strong> listed are designated automated by their manufacturer, and Chip Scale Review assumes no liability for errors or<br />
omissions to this table. Due to space constraints, not all models are listed. For detailed information consult each manufacturer’s web site. Issue advertisers are designated with bold type.<br />
Alphasem AG<br />
A Dover Technologies Company<br />
Andhauserstrasse 64<br />
CH-8572 Berg/TG, Switzerland<br />
b +41.71.637.63.63<br />
> +41.71.637.63.64<br />
1979<br />
Claus Lichtenberg<br />
Easyline 8032<br />
x May 2002<br />
A A<br />
Swissline 9022<br />
x May 2001<br />
A A<br />
100-200mm<br />
P ±38µm (±1.5mils)<br />
Z 8mm (Y range 0-90mm)<br />
100-300mm<br />
P ±30µm@3 sigma<br />
Z 30mm (Y range 0-55mm)<br />
D 0.25-20.3mm<br />
(10-800mils)<br />
V 900 x 1100mm<br />
(35.4 x 43.3)<br />
D 0.5-30mm<br />
(20-1200mils)<br />
V 1703 x 1200mm<br />
(67 x 40.1)<br />
MLP/QFN<br />
SOIC, TSOP, PLCC, QFP<br />
B A, S<br />
BGA, CSP<br />
QFP, LOC/BOC<br />
B A<br />
[alphasem.com]<br />
Philippe Gaille<br />
alphasem.sales@alphasem.com<br />
ASM Pacific Technology Ltd.<br />
4/F, Watson Centre<br />
1 Kung Yip Street, Kwai Chung<br />
N.T., Hong Kong<br />
b +852.2619.2000<br />
> +852.2619.2118<br />
1975<br />
Arthur H. del Prado<br />
AD900<br />
x 2001<br />
A A<br />
AD9012<br />
x 2004<br />
A A<br />
200mm<br />
P ±10µm@3 sigma<br />
Z 40mm (5µm)<br />
200-300mm<br />
P ±10µm@3 sigma<br />
Z 40mm (5µm)<br />
D 0.25-25mm<br />
V 1270 x 1100mm 2<br />
D 0.25-25mm<br />
V 1355 x 1370mm 2<br />
Flip <strong>chip</strong> in package<br />
Die <strong>attach</strong><br />
B A, S<br />
Flip <strong>chip</strong> in package<br />
Die <strong>attach</strong><br />
B A, S<br />
[asmpt.com]<br />
Jerry Dellheim,<br />
Vice President–Strategic Mktg.<br />
jdellheim@asmpacific.com<br />
b 408.451.0800<br />
San Jose<br />
Besi Die Handling<br />
(Division <strong>of</strong> BE Semiconductor Ind. NV)<br />
10 Tinker Ave.<br />
Londonderry, NH 03053<br />
b 603.206.4800<br />
> 603.626.4242<br />
RD Automation<br />
M-9 Series<br />
x 2002<br />
A S<br />
N/A<br />
P ±0.5µm<br />
Z 50mm<br />
D 0.2-50mm<br />
(Optional 100mm)<br />
V 686 x 762mm<br />
(27 x 30)<br />
All <strong>flip</strong> <strong>chip</strong> bonding<br />
Die bonding<br />
B A, E, F, P, S, T<br />
O=Ultrasonic,<br />
Thermocompression<br />
[besi<strong>die</strong>handling.com]<br />
Henry Chou, Product Manager<br />
hchou@besi<strong>die</strong>handling.com<br />
b 603.206.4828<br />
> 603.626.4242<br />
Datacon Semiconductor<br />
Equipment GmbH<br />
Innstrasse 16<br />
A-6240 Radfeld<br />
Tyrol, Austria<br />
b +43.5337.600.0<br />
> +43.5337.600.660<br />
1986<br />
Helmut Rutterschmidt<br />
FC 8800 Quantum<br />
x April 2004<br />
A A<br />
2200 apm+<br />
x July 2001<br />
A A<br />
2200 apm<br />
x April 2000<br />
A A<br />
300mm<br />
P 10µm@3 sigma<br />
Z -25mm<br />
(0.02µm Z axis<br />
resolution)<br />
300mm max.<br />
P 7µm@3 sigma<br />
Z -35mm<br />
(-47mm special,<br />
0.02µm Z axis<br />
resolution)<br />
200mm max.<br />
P 10µm@3 sigma<br />
Z -35mm<br />
(-47mm special,<br />
0.02µm Z axis<br />
resolution)<br />
D 0.5-30mm<br />
V 1600 x 1200mm<br />
(63 x 47.24)<br />
D 0.17-50mm<br />
(0.007-1.97)<br />
V 1000 x 1200mm<br />
(39.4 x 47.2)<br />
D 0.17-35mm<br />
(Up to 62mm with<br />
custom apps.)<br />
V 800 x 1200mm<br />
(31.5 x 47.2)<br />
Dedicated <strong>flip</strong> <strong>chip</strong><br />
B Not supplied<br />
S High speed, dual gantry<br />
system, simultaneous processing <strong>of</strong><br />
2 <strong>die</strong>, COO optimized for FC, SMEMA<br />
in-line capability, 25N bond force,<br />
fully automatic calibration system<br />
Flip <strong>chip</strong><br />
MCM/hybrid<br />
B A, F, P, S, T<br />
S All 2200 apm features,<br />
300mm wafer capability, up to 2 <strong>die</strong><br />
handling<br />
Flip <strong>chip</strong><br />
MCM<br />
B A, P, S, T, O=Flux<br />
S Combined <strong>die</strong> <strong>attach</strong> and <strong>flip</strong><br />
<strong>chip</strong> capability, modular and flexible,<br />
dip fluxing, full MCM capability<br />
[datacon.at]<br />
Dana Baedke,<br />
Marketing Comm. Manager<br />
dana.baedke@datacon.at<br />
b 215.245.3052 > 215.245.3060<br />
Datacon North America<br />
Seven Neshaminy Interplex<br />
Suite 116, Trevose, PA 19053<br />
info.dcna@datacon.at<br />
b 215.245.3050 > 215.245.3060<br />
Datacon Asia Pacific Pte. Ltd.<br />
40 Ubi Crescent, #01-07 Ubi<br />
Techpark, Singapore 408567<br />
info.dcap@datacon.at<br />
b +65.67430.600<br />
> +65.67430.660<br />
Technical: Lorenzo Manca<br />
lorenzo.manca@datacon.at<br />
b 215.245.3057<br />
ESEC<br />
Hinterbergstrasse 32<br />
CH-6330 Cham<br />
Switzerland<br />
b +41.41.749.5111<br />
1968<br />
Asuri S. Raghavan<br />
ESEC 2008HS<br />
x 2003<br />
A A<br />
ESEC 2007 SSIplus<br />
x 2004<br />
A A<br />
200mm (300mm option)<br />
P ±37µm@3 sigma<br />
Z 25mm<br />
200mm<br />
P ±60µm@3 sigma<br />
Z N/A<br />
D 0.25-25mm<br />
(10mil-1 inch)<br />
V 1150 x 1280mm<br />
(45.3 x 50.4)<br />
D 1.0-11mm<br />
(40mil-430mil)<br />
V 1770 x 1250mm<br />
(69.7 x 49.2)<br />
Leadframe apps<br />
Substrate apps<br />
(BGA, CSP)<br />
B A<br />
Full range <strong>of</strong> power<br />
packages<br />
High-power RF devices<br />
B Not supplied<br />
[esec.com]<br />
Peter Buehlmann,<br />
Technical Manager, ESEC USA<br />
pb@esec.com<br />
b 480.893.6990<br />
F&K Delvotec<br />
Bondtechnik GmbH<br />
Daimlerstr. 5-7<br />
85521 Ottobrunn<br />
Germany<br />
b +49.89.62995.0<br />
> +49.89.62995.100<br />
1978<br />
Dr. Farhad Farassat<br />
4501 (Single-Station, Large<br />
Area Multi-Chip Multi-Placement<br />
Die Bonder)<br />
x January 2001<br />
A M, S, A<br />
4500 (Double-Head, Multi-Chip<br />
Multi-Placement Die Bonder)<br />
x 1998<br />
A S, A<br />
Up to 200mm<br />
P ±12µm@3 sigma<br />
Z A<br />
Up to 200mm<br />
P ±12µm@3 sigma<br />
Z A<br />
D 0.25-20mm<br />
V 1200 x 1500mm<br />
D 0.25-20mm<br />
V 1200 x 1500mm<br />
Opto<br />
Hybrids<br />
B A, E, P<br />
Opto<br />
Hybrids<br />
B A, E, P<br />
S Flexible <strong>die</strong> input,<br />
various handling<br />
systems<br />
[fkdelvotec.com]<br />
Desmond Bradley<br />
desmond.bradley@de.fkdelvotec.com<br />
b +49.89.62995.120<br />
California<br />
Rick Bailey, Vice President<br />
rick.bailey@fkdelvotecusa.com<br />
b 949.595.2200<br />
> 929.595.2207<br />
4410 (Double-Head, Single-Chip<br />
Multi-Placement Die Bonder)<br />
x 1998<br />
A A<br />
Up to 200mm<br />
P ±30µm@3 sigma<br />
Z A<br />
D 0.25-20mm<br />
V 1200 x 1500mm<br />
Leadframe BGA<br />
B A, E, P<br />
S Flexible <strong>die</strong> input,<br />
various handling<br />
systems<br />
Chip Scale Review • March 2004 • [ChipScaleReview.com]<br />
Review March 2004 [ChipScaleReview.com] 43
INTERNATIONAL DIRECTORY OF FLIP-CHIP DIE ATTACH BONDERS/ALIGNERS<br />
Company Name<br />
Address<br />
b Phone > Fax<br />
Year Founded<br />
Executives<br />
Model<br />
x Introduced<br />
A Level <strong>of</strong> Automation:<br />
M=Manual,<br />
S=Semi-Automated,<br />
A=Automated<br />
Wafer Size Range<br />
P Placement Accuracy,<br />
µm@3 sigma<br />
Z Z-Axis Travel<br />
D Die Edge<br />
Length Capability<br />
V Footprint<br />
Width by Depth, mm<br />
and (inches)<br />
Primary Applications<br />
Secondary Applications<br />
B Bonding Methods:<br />
A=Adhesive, E=Eutectic,<br />
F=Flip Chip, P=Preform,<br />
S=Solder, T=Tape, O=Other<br />
S Special Features<br />
[web site]<br />
Technical Contact<br />
b Phone > Fax<br />
Additional Offices<br />
Finetech Inc.<br />
1334 E. Chandler Blvd.<br />
5D 5D22<br />
Phoenix, AZ 85048<br />
b 480.460.8777<br />
> 480.460.8778<br />
1991<br />
Gunter Kuerbis<br />
PICO A4<br />
x 1994<br />
A S, A<br />
AUTO-PICO VA24P<br />
x 1999<br />
A A<br />
200mm<br />
P Better than 5µm<br />
Z 10mm<br />
200mm<br />
P ±5µm@3 sigma<br />
Z Not supplied<br />
D Not supplied<br />
V 700 x 600mm<br />
(28 x 24)<br />
D Not supplied<br />
V 900 x 600mm<br />
(36 x 24)<br />
Flip <strong>chip</strong><br />
Opto, MEMS<br />
B A, E, P, S, T, O=ACF/ACP<br />
S Heat 450°C, force 50kgm<br />
Flip <strong>chip</strong><br />
Opto, MEMS<br />
B A, E, P, S, T, O=ACF/ACP<br />
S Thermocompression,<br />
thermosonic<br />
[finetechusa.com]<br />
Chris Underhill<br />
cu@finetechusa.com<br />
b 480.460.8777<br />
Hesse & Knipps GmbH<br />
Vattmannstrasse 6<br />
D-33100 Paderborn<br />
Germany<br />
b +49.52.51.1560.0<br />
> +49.52.51.1560.97<br />
1978<br />
Dr. Hans J. Hesse,<br />
Hans-Ulrich Knipps<br />
FLIPJET FJ510<br />
x 2000<br />
A A<br />
Up to 203mm<br />
P ±15µm@3 sigma<br />
Z 25mm<br />
(Z-axis accuracy<br />
1µm@3 sigma)<br />
D 0.5-5mm<br />
(20-200mil)<br />
V 1800 x 1700mm<br />
(71 x 67)<br />
SAW filters, power<br />
devices<br />
B Not supplied<br />
S Ultrasonic bonding,<br />
monometallic connections<br />
North American HQ:<br />
Hesse & Knipps Inc.<br />
2305 Paragon Dr.<br />
San Jose, CA 95131<br />
[hesse-knipps.com]<br />
Roberto Gilardoni,<br />
Technical Coordinator<br />
gilardoni@hesse-knipps.com<br />
b +49.52.51.1560.31<br />
Joseph S. Bubel,<br />
VP, Sales and Marketing<br />
bubel@hesse-knipps.com<br />
b 408.436.9300<br />
> 408.436.2822<br />
Mühlbauer AG<br />
Werner-von-Siemens-Str. 3<br />
D-93426 Roding<br />
Germany<br />
b +49.9461.952.0<br />
> +49.9461.952.101<br />
1981<br />
Josef Mühlbauer<br />
DB 200 WTX<br />
A A<br />
FCM 6000<br />
A A<br />
Up to 200mm<br />
P ±30µm<br />
Up to 200mm<br />
P ±20µm@3 sigma<br />
D 0.20-7mm<br />
V 1200 x 1100mm<br />
(47 x 44)<br />
D 0.20-7mm<br />
V 1500 x 1100mm<br />
(60 x 44)<br />
Die bonding with<br />
epoxy process<br />
S Endless reel-to-reel<br />
application possible<br />
Flip <strong>chip</strong><br />
S Endless reel-to-reel<br />
application possible<br />
[muehlbauer.de]<br />
Gerald Niklas<br />
gerald.niklas@muehlbauer.de<br />
b +49.9461.952.194<br />
Newport Corporation<br />
101 Billerica Ave., Bldg. 3<br />
N. Billerica, MA 01862<br />
b 978.667.9449<br />
> 978.667.6109<br />
1969 Robert Deuster<br />
Newport Mach FC Plus<br />
x 2003<br />
A A<br />
200-300mm<br />
P ±8µm@3 sigma<br />
Z 25mm place to a force<br />
D Up to 53mm<br />
V 1000 x 1200<br />
x 1778mm<br />
(39 x 47 x 70)<br />
Flip <strong>chip</strong> in package<br />
Flip <strong>chip</strong> on board<br />
B S, E, A, P<br />
S Parallel processing motions,<br />
300mm capability<br />
[newport.com]<br />
Dan Crowley, Director <strong>of</strong> Sales<br />
dcrowley@newport.com<br />
1791 Deere Ave., Irvine, CA<br />
92606<br />
b 949.863.3144<br />
> 949.253.1680<br />
Palomar Technologies<br />
2230 Oak Ridge Way<br />
Vista, CA 92083<br />
b 760.931.3600<br />
1995 Kevin Conlon<br />
Laser Diode Attach<br />
(LDA) Die Bonder<br />
x March 2001<br />
A A<br />
50-300mm<br />
P 5µm@3 sigma<br />
Z 50.8mm<br />
D 177.8-508mm<br />
V 1524 x 1070mm<br />
RF eutectic<br />
Optical device <strong>attach</strong><br />
B A, E, P, S, T,<br />
O=thermocompression<br />
[palomartechnologies.com]<br />
Jeff King<br />
sales@<strong>bonders</strong>.com<br />
b 760.931.3600<br />
Semiconductor Equipment Corp.<br />
5154 Goldman Ave.<br />
Moorpark, CA 93020<br />
b 805.529.2293<br />
> 805.529.2193<br />
1975 Don Moore<br />
410XP Precision<br />
Die Bonder<br />
x 2001<br />
A S<br />
NA<br />
P 1-2µm<br />
D 0.254-25.4mm<br />
V 2032 x 1473mm<br />
Photonic<br />
Flip Chip<br />
B A, E, P, S<br />
[semicorp.com]<br />
Don Moore<br />
dmoore@aol.com<br />
b 805.529.2293 x22<br />
Shinkawa USA Inc.<br />
1930 S. Alma School Road,<br />
Suite D-107, Mesa, AZ 85210<br />
b 480.831.7988<br />
> 480.831.9480<br />
1959 Sadashi Iida<br />
COF-300<br />
x 2003<br />
A A<br />
150-200mm<br />
P ±3µm<br />
D 1-25mm<br />
V 2470 x 1280mm<br />
(99 x 51)<br />
Chip on flex,<br />
<strong>flip</strong> <strong>chip</strong> <strong>attach</strong><br />
TCP <strong>attach</strong><br />
B Not supplied<br />
[shinkawausa.com/english]<br />
Doug Day<br />
d_day@shinkawausa.com<br />
b 480.831.7988<br />
SUSS MicroTec S.A.<br />
Division <strong>of</strong> SUSS MicroTec AG<br />
Avenue des Colombieres<br />
74490 Saint Jeoire, France<br />
b +33.450.35.8392<br />
> +33.450.35.8801<br />
1975<br />
Gael Schmidt<br />
HQ: Schleissheimer Strasse 90<br />
85741 München-Garching<br />
Germany<br />
TRIAD05AP<br />
x Sept. 2003<br />
A A<br />
FC250<br />
x Jan. 2000<br />
A A<br />
0.2-50mm<br />
P 0.5µm@3 sigma<br />
Z Arm: 190mm<br />
Chuck: 24mm<br />
2-200mm<br />
P 1µm@3 sigma<br />
Z Arm: 155mm<br />
D 0.2-20mm<br />
V 2160 x 1700mm<br />
(85 x 66)<br />
D 0.2-50mm<br />
V 2275 x 1250mm<br />
(90 x 50)<br />
Opto<br />
Flip Chip<br />
B A, E, P, S<br />
S Combine passive and active<br />
alignment, post bonding IR<br />
inspection, laser welding<br />
SIP, MCM<br />
Opto<br />
B A, E, P, S<br />
S Laser leveling, feeding parallel<br />
to process for higher<br />
throughput<br />
[suss.com/devicebonder/triad]<br />
Gilbert Lecarpentier,<br />
Product Manager<br />
glecarpentier@sussmicrotec.fr<br />
b +33.450.35.3803<br />
See web site<br />
USA: Waterbury, VT<br />
USA: Tempe AZ<br />
Thailand: Bangkok<br />
Taiwan: Hsinchu<br />
Japan: Yokohama<br />
Germany: Munich<br />
UK: London<br />
44<br />
Chip Scale Review March 2004 [ChipScaleReview.com]<br />
• March 2004 • [ChipScaleReview.com]
INTERNATIONAL DIRECTORY OF FLIP-CHIP DIE ATTACH BONDERS/ALIGNERS<br />
Company Name<br />
Address<br />
b Phone > Fax<br />
Year Founded<br />
Executives<br />
Model<br />
x Introduced<br />
A Level <strong>of</strong> Automation:<br />
M=Manual,<br />
S=Semi-Automated,<br />
A=Automated<br />
Wafer Size Range<br />
P Placement Accuracy,<br />
µm@3 sigma<br />
Z Z-Axis Travel<br />
D Die Edge<br />
Length Capability<br />
V Footprint<br />
Width by Depth, mm<br />
and (inches)<br />
Primary Applications<br />
Secondary Applications<br />
B Bonding Methods:<br />
A=Adhesive, E=Eutectic,<br />
F=Flip Chip, P=Preform,<br />
S=Solder, T=Tape, O=Other<br />
S Special Features<br />
[web site]<br />
Technical Contact<br />
b Phone > Fax<br />
Additional Offices<br />
SUSS MicroTec S.A.<br />
(continued)<br />
FC150PLUS<br />
x July 2003<br />
A S, A<br />
2-150mm<br />
P 1µm@3 sigma<br />
Z Arm: 160mm<br />
Chuck: 6mm<br />
D 0.2-50mm<br />
V 1600 x 1280mm<br />
(63 x 51)<br />
Opto, IR-FPA<br />
Flip Chip<br />
B A, E, P, S<br />
S Laser leveling, high flexibility<br />
[suss.com/devicebonder/triad]<br />
SYSMELEC S.A.<br />
Route de Berne 5<br />
CH-2076 Gals, Switzerland<br />
1982<br />
Jean-Claude Prélaz<br />
SMB 1000<br />
x 2002<br />
A A<br />
50-200mm<br />
P 1µm@3 sigma<br />
Z 55mm<br />
D 0.2-2.4mm<br />
V 2540 x 1870mm<br />
(100 x 74)<br />
Opto<br />
MEMS<br />
B A, E, P, S, T<br />
[sysmelec.ch]<br />
Dr. Pierre Voumard,<br />
Technical Director<br />
p.voumard@sysmelec.ch<br />
b +41.32.33.88.585<br />
Tresky Corporation<br />
50 Route 9, Suite 304<br />
Morganville, NJ 07751<br />
1980<br />
Marc Tresky<br />
T-3200 Series Die<br />
Bonding Systems<br />
x 2004<br />
A S<br />
50-300mm<br />
P 5µm<br />
Z 100mm<br />
D 0.2 x 0.2mm min.<br />
V 1060 x 600mm<br />
Flip <strong>chip</strong> eutectic<br />
bonding<br />
Epoxy bonding<br />
B A, E, P, S, T<br />
[tresky.com]<br />
Allen Weil,<br />
VP–Sales & Marketing<br />
sales@tresky.com<br />
b 732-536-8600<br />
Universal Instruments<br />
Corporation A Dover Company<br />
PO Box 825<br />
Binghamton, NY 13902<br />
b 607.779.4992<br />
> 607.779.5105<br />
1919<br />
Ian McEvoy (President), Richard<br />
Roulanger (VP–Advanced Semiconductor<br />
Assembly Division)<br />
AdVantis 5717A<br />
with Wafer Feeder<br />
x 2004<br />
A A<br />
Genesis 5719A<br />
with Wafer Feeder<br />
x 2004<br />
A A<br />
300mm<br />
P ±15µm@3 sigma<br />
Z 12.7mm<br />
300mm<br />
P ±12µm@3 sigma<br />
Z 12.7mm<br />
D 0.2-50mm<br />
V 1556 x 1632mm<br />
D 0.2-50mm<br />
V 1676 x 2248mm<br />
Flip <strong>chip</strong><br />
Bare <strong>die</strong>, SMT<br />
B A, P, S, T<br />
S Multiple heads and cameras,<br />
parallel processing<br />
Flip <strong>chip</strong><br />
Bare <strong>die</strong>, SMT<br />
B P, S, T<br />
S Multiple heads and cameras,<br />
parallel processing<br />
[uic.com]<br />
Jacques Coderre<br />
coderre@uic.com<br />
b 607.779.4362<br />
Chip Scale Review • March 2004 • [ChipScaleReview.com]
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