international directory of test and burn-in socket manufacturers
international directory of test and burn-in socket manufacturers
international directory of test and burn-in socket manufacturers
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
INTERNATIONAL DIRECTORY OF TEST AND BURN-IN SOCKET MANUFACTURERS<br />
Notes: We’ve changed our format. Due to the large number <strong>of</strong> <strong>socket</strong> vendors, each company was asked to submit only one “featured” <strong>socket</strong> for list<strong>in</strong>g. For additional <strong>in</strong>formation on a vendor’s product<br />
l<strong>in</strong>e, please visit the web site <strong>in</strong>dicated or ChipScaleReview.com. Material listed has been supplied by the respective companies. Advertisers are listed <strong>in</strong> boldface type. CM=Consult Manufacturer.<br />
Company Name<br />
Address<br />
b Phone<br />
> Fax<br />
Year Founded<br />
Model Name <strong>and</strong>/or Number<br />
Function<br />
V Introduced<br />
Operat<strong>in</strong>g Temperature<br />
(Degrees Celsius)<br />
C Contact Pitch (mm)<br />
T Technology<br />
I Typical Insertions<br />
Mutual Capacitance (pF)<br />
Self Capacitance (pF)<br />
Mutual Inductance (nH)<br />
Self Inductance (nH)<br />
P Contact Plat<strong>in</strong>g<br />
Features<br />
[web site]<br />
Contact<br />
Additional Offices<br />
Advanced Interconnections Corp.<br />
5 Energy Way<br />
West Warwick, RI 02893<br />
b 401.823.5200<br />
> 401.823.8723<br />
1982<br />
Flip-Top BGA Socket, Model FTG<br />
Test<br />
V March 2002<br />
10° to 85°<br />
C 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 1,000<br />
CM<br />
CM<br />
CM<br />
CM<br />
P Au<br />
Compact size; no external<br />
hold-downs needed<br />
[bga<strong>socket</strong>s.com]<br />
Curt Wilmot, Application Eng<strong>in</strong>eer<br />
cwilmot@adv<strong>in</strong>tcorp.com<br />
Burt Fisher, Application Eng<strong>in</strong>eer<br />
Eastern Region<br />
bfisher@adv<strong>in</strong>tcorp.com<br />
Altanova<br />
19 Great Oaks Blvd., Ste. 30<br />
San Jose, CA 95119<br />
b 408.225.7011<br />
> 408.225.7031<br />
2000<br />
1704-BGA-1.00-0116-0 High<br />
Speed Test Contactor<br />
Test V June 2004<br />
-55° to 130°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 500,000<br />
CM CM<br />
0.16 0.25<br />
P BeCu/Au<br />
B<strong>and</strong>width up to 33.92GHz<br />
@-3.083db, current rat<strong>in</strong>g up to<br />
2A cont<strong>in</strong>uous<br />
[altanova1.com]<br />
Bill Selfridge, Technical Sales<br />
bill@altanova1.com<br />
Joshua Burdick, Customer Support<br />
joshua@altanova1.com<br />
AQL Manufactur<strong>in</strong>g Services<br />
25599-D SW 95th Ave.<br />
Wilsonville, OR 97070<br />
b 503.682.3193<br />
> 503.682.1648<br />
CM<br />
B Series<br />
Unlimited<br />
V January 2000<br />
-50° to 150°<br />
C 0.4 to 1.27mm<br />
T Compliant probes<br />
I >400,000<br />
510.357.7600<br />
1995<br />
RF <strong>and</strong> Mixed-Signal<br />
Unlimited<br />
V February 2003<br />
CM<br />
C CM<br />
T Spr<strong>in</strong>g probes<br />
I 500,000<br />
CM<br />
CM<br />
0.06<br />
0.48<br />
P CM<br />
Ultra-high performance contacts<br />
[contechsolutions.com]<br />
Afsh<strong>in</strong> Nouri, President<br />
afsh<strong>in</strong>@contechsolutions.com<br />
Mehran Jafarzadeh, Sales<br />
mehran@contechsolutions.com<br />
b 510.357.7900 ext. 201<br />
Chip Scale Review • November - December Chip Scale 2004 Review • [ChipScaleReview.com]<br />
November/December 2004 [ChipScaleReview.com] 35
INTERNATIONAL DIRECTORY OF TEST AND BURN-IN SOCKET MANUFACTURERS<br />
Company Name<br />
Address<br />
b Phone<br />
> Fax<br />
Year Founded<br />
Model Name <strong>and</strong>/or Number<br />
Function<br />
B=Burn-In, P=Production, T=Test<br />
V Introduced<br />
Operat<strong>in</strong>g Temperature<br />
(Degrees Celsius)<br />
C Contact Pitch (mm)<br />
T Technology<br />
I Typical Insertions<br />
Mutual Capacitance (pF)<br />
Self Capacitance (pF)<br />
Mutual Inductance (nH)<br />
Self Inductance (nH)<br />
P Contact Plat<strong>in</strong>g<br />
Features<br />
[web site]<br />
Contact<br />
Additional Offices<br />
Dimensions Consult<strong>in</strong>g Inc.<br />
3350 Scott Blvd.<br />
Santa Clara, CA 95054<br />
b 408.988.6800<br />
> 408.988.8950<br />
1989<br />
Quick Turn BGA<br />
Test<br />
V January 2003<br />
-40° to 150°<br />
C 0.8 to 1.27mm<br />
T Spr<strong>in</strong>g probes I 200,000<br />
0.42 1.4<br />
0.1 0.9<br />
P Au<br />
Sockets are configurable <strong>and</strong><br />
deliverable <strong>in</strong> one week ARO<br />
[dci-us.com]<br />
Nick Langston, Vice President<br />
nicksr@dci-us.com<br />
Maryl<strong>and</strong>: Jim Swayze, Eastern Mgr.<br />
jswayze@comcast.net<br />
b 301.598.2620<br />
Emulation Technology Inc.<br />
2344 Walsh Ave., Bldg. F<br />
Santa Clara, CA 95051<br />
b 408.982.0660<br />
> 408.982.0664<br />
1983<br />
BGA Knob Lock Socket<br />
CM<br />
V January 2002<br />
-55° to 130°<br />
C 0.5 to 1.27mm<br />
T Spr<strong>in</strong>g probes I 10,000<br />
CM +41.21.781.08.11<br />
1992<br />
Lever Lock Socket<br />
Burn-<strong>in</strong>, <strong>test</strong><br />
V July 2004<br />
-40° to 170°<br />
C 0.50 to 1.27mm<br />
T Spr<strong>in</strong>g probes I 100,000<br />
0.05 CM<br />
0.14 1.69<br />
P Au<br />
Quick <strong>and</strong> simple <strong>in</strong>sertion/<br />
extraction <strong>of</strong> chips<br />
[e-tec.com]<br />
Chris Haffter, President<br />
<strong>in</strong>fo@e-tec.com<br />
U.S. Rep.: Bud Kundich<br />
<strong>in</strong>fo-us@e-tec.com<br />
b 408.746.2800<br />
Everett Charles Technologies<br />
Semiconductor Test Group<br />
4837 White Bear Pkwy.<br />
St. Paul, MN 55110<br />
b 651.407.7777<br />
> 651.407.7290 1963<br />
Micro Bantam Pak<br />
Test<br />
V 2002<br />
-50° to 150°<br />
C 0.5 to 0.65mm<br />
T Spr<strong>in</strong>g probes I >500,000<br />
0.04 0.28<br />
0.10 0.93<br />
P Several plat<strong>in</strong>g options<br />
Probe architecture <strong>of</strong>fers<br />
superior force <strong>and</strong> travel,<br />
return<strong>in</strong>g high yield<br />
[ect<strong>in</strong>fo.com]<br />
Tony DeRosa, Product Manager<br />
tony.derosa@ect<strong>in</strong>fo.com<br />
b 651.407.7745<br />
Ever Technologies Pte. Ltd.<br />
52 Serangoon North Ave. 4<br />
S<strong>in</strong>gapore 555853<br />
b +65.6483.1811<br />
> +65.648.12607<br />
1992<br />
Elite High Performance Test Socket<br />
Test<br />
V May 1999<br />
-55° to 125°<br />
C 0.4mm <strong>and</strong> greater<br />
T Spr<strong>in</strong>g probes I >100,000<br />
0.1 0.47<br />
0.3 0.8<br />
P Au<br />
Suitable for use with all <strong>test</strong><br />
h<strong>and</strong>lers, short leadtime<br />
[aem-evertech.com]<br />
S.M. Low,<br />
Bus<strong>in</strong>ess <strong>and</strong> Operations Director<br />
smlow@aem-evertech.com<br />
Exatron Inc.<br />
2842 Aiello Dr.<br />
San Jose, CA 95111<br />
b 408.629.7600<br />
> 408.629.2832<br />
1974<br />
DUO PI Interposer<br />
Test<br />
V September 2004<br />
CM<br />
C 0.35mm <strong>and</strong> above<br />
T CM I 1,000,000<br />
CM CM<br />
CM CM<br />
P Au/diamond<br />
Suitable for all types <strong>of</strong> <strong>test</strong><strong>in</strong>g,<br />
especially for RF devices<br />
[exatron.com]<br />
Bob Garcia<br />
bgarcia@exatron.com<br />
b 800.392.8766<br />
Gold Technologies Inc.<br />
2360-F Qume Dr.<br />
San Jose, CA 95133<br />
b 408.321.9568<br />
> 408.321.9569<br />
1998<br />
Horizontal <strong>and</strong> Vertical Cam<br />
Lid Sockets<br />
CM V 2003<br />
-55° to 150°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes I 1,000,000<br />
INTERNATIONAL DIRECTORY OF TEST AND BURN-IN SOCKET MANUFACTURERS<br />
Company Name<br />
Address<br />
b Phone<br />
> Fax<br />
Year Founded<br />
Model Name <strong>and</strong>/or Number<br />
Function<br />
B=Burn-In, P=Production, T=Test<br />
V Introduced<br />
Operat<strong>in</strong>g Temperature<br />
(Degrees Celsius)<br />
C Contact Pitch (mm)<br />
T Technology<br />
I Typical Insertions<br />
Mutual Capacitance (pF)<br />
Self Capacitance (pF)<br />
Mutual Inductance (nH)<br />
Self Inductance (nH)<br />
P Contact Plat<strong>in</strong>g<br />
Features<br />
[web site]<br />
Contact<br />
Additional Offices<br />
High Connection Density Inc. (HCD)<br />
1267 Borregas Ave.<br />
Sunnyvale, CA 94089<br />
b 408.743.9700<br />
> 408.743.9701<br />
1997<br />
SuperSpr<strong>in</strong>g BGA/LGA<br />
Test V 2002<br />
125°<br />
C 0.5 to 1.27mm<br />
T Proprietary: SuperSpr<strong>in</strong>g<br />
I 100,000<br />
CM 0.03<br />
0.7 0.9<br />
P Au<br />
Custom footpr<strong>in</strong>ts, various<br />
low-pr<strong>of</strong>ile contact elements<br />
[hcdcorp.com]<br />
Charlie Stevenson,<br />
Sales Director<br />
charlie.stevenson@hcdcorp.com<br />
High Performance Test Inc.<br />
48531 Warm Spr<strong>in</strong>g Blvd.<br />
Fremont, CA 94538<br />
b 510.445.1182<br />
> 510.445.1183<br />
1996<br />
Model ZB<br />
Test V August 2004<br />
-55° to 150°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 100,000+ (application dependent)<br />
0.042<br />
0.45<br />
0.065<br />
0.62<br />
P Au<br />
Dual compliance<br />
[hp<strong>test</strong>usa.com]<br />
Mark Malfatti,<br />
Sales Manager<br />
mmalfatti@hp<strong>test</strong>usa.com<br />
Ironwood Electronics Inc.<br />
P.O. Box 21151<br />
St. Paul, MN 55121<br />
b 800.404.0204<br />
> 651.452.8400<br />
1986<br />
Giga-Snap Socket<br />
CM<br />
V August 2004<br />
-40° to 125°<br />
C 1.0mm<br />
T Mach<strong>in</strong>e p<strong>in</strong>s I 200<br />
CM CM<br />
0.463 2.456<br />
P Au<br />
Small footpr<strong>in</strong>t, long last<strong>in</strong>g,<br />
low cost, low <strong>in</strong>sertion force,<br />
resolderable<br />
[ironwoodelectronics.com]<br />
Mike Fedde, President<br />
mikef@ironwoodelectronics.com<br />
b 800.404.0204 ext. 206<br />
Johnstech International Corp.<br />
1210 New Brighton Blvd.<br />
M<strong>in</strong>neapolis, MN 55413<br />
b 612.378.2020<br />
> 612.378.2030<br />
1990<br />
Pad ROL200 Series<br />
Test, production<br />
V July 2004 -40° to 155°<br />
C 0.5mm <strong>and</strong> above<br />
T Proprietary: rigid contact<br />
I 300,000 to 500,000<br />
0.31 0.55<br />
0.08 0.55<br />
P CM<br />
Roll<strong>in</strong>g contact maximizes<br />
board pad life<br />
[johnstech.com]<br />
Meg McCormick,<br />
Market<strong>in</strong>g Manager<br />
memccormick@johnstech.com<br />
Kulicke & S<strong>of</strong>fa Industries Inc.<br />
2101 Blair Mill Rd.<br />
Willow Grove, PA 19090<br />
b 215.784.6000<br />
> 215.784.6284<br />
1951<br />
Micro BGA/BGA Socket<br />
CM V 2003<br />
CM<br />
C 0.3 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 1,000,000<br />
CM 0.4<br />
CM 1.2<br />
P Au, Ni<br />
Low resistance, high reliability,<br />
suitable with all <strong>test</strong> h<strong>and</strong>lers<br />
[loranger.com]<br />
Michael Flores,<br />
Manager, Strategic Market<strong>in</strong>g<br />
mikef@loranger.com<br />
Micronics Japan Co. Ltd.<br />
1201 S. Alma School Rd., Ste. 7750<br />
Mesa, AZ 85206<br />
b 408.971.7388<br />
> 408.971.7389<br />
CM<br />
MJC J-Contact, K-Series<br />
Test<br />
V May 2002<br />
-50° to 150°<br />
C >0.5mm<br />
T Elastomer I >500,000<br />
0.03 0.04<br />
0.05 0.7<br />
P Au<br />
Suitable for all h<strong>and</strong>lers, full<br />
Kelv<strong>in</strong> contact to DUT p<strong>in</strong><br />
[mjc.co.jp/english]<br />
Keith Jones,<br />
Market<strong>in</strong>g Consultant<br />
keithjones@earthl<strong>in</strong>k.net<br />
b 480.413.2016<br />
M&M Specialties<br />
1145 W. Fairmont<br />
Tempe, AZ 85282<br />
b 480.858.0393<br />
> 480.858.1882<br />
1976<br />
Data not available Data not available [mmspec.com]<br />
Paricon Technologies Corp.<br />
421 Currant Rd.<br />
Fall River, MA 02333<br />
b 508.676.6888<br />
> 508.676.8111<br />
1997<br />
PariPoser Sockets<br />
Burn-<strong>in</strong>, production, <strong>test</strong><br />
V February 2001<br />
-40° to 150°<br />
C 0.1 to 2.0mm<br />
T Elastomer<br />
I >500,000<br />
0.027<br />
0.042<br />
0.046<br />
0.08<br />
P Ag<br />
Highest performance (60GHz+)<br />
separable <strong>in</strong>terface material<br />
available anywhere<br />
[paricon-tech.com]<br />
David Barnum,<br />
VP–Sales <strong>and</strong> Market<strong>in</strong>g<br />
sales@paricon-tech.com<br />
b 508.676.8080<br />
Chip Scale Review • November - December Chip Scale 2004 Review • [ChipScaleReview.com]<br />
November/December 2004 [ChipScaleReview.com] 37
INTERNATIONAL DIRECTORY OF TEST AND BURN-IN SOCKET MANUFACTURERS<br />
Company Name<br />
Address<br />
b Phone<br />
> Fax<br />
Year Founded<br />
Model Name <strong>and</strong>/or Number<br />
Function<br />
B=Burn-In, P=Production, T=Test<br />
V Introduced<br />
Operat<strong>in</strong>g Temperature<br />
(Degrees Celsius)<br />
C Contact Pitch (mm)<br />
T Technology<br />
I Typical Insertions<br />
Mutual Capacitance (pF)<br />
Self Capacitance (pF)<br />
Mutual Inductance (nH)<br />
Self Inductance (nH)<br />
P Contact Plat<strong>in</strong>g<br />
Features<br />
[web site]<br />
Contact<br />
Additional Offices<br />
Phoenix Test Arrays LLC<br />
3105 S. Potter<br />
Tempe, AZ 85282<br />
b 602.870.3775<br />
2003<br />
Firebird 2/3/4<br />
Test<br />
V March 2003<br />
-55° to 165°<br />
C 0.4 to 1.27mm<br />
T Elastomer I >250,000<br />
831.338.1010<br />
2002<br />
High Performance BGA Model PTS50<br />
Test V April 2004<br />
-55° to 125°<br />
C 1.0 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 500,000<br />
CM CM<br />
0.68 0.72<br />
P Au/custom<br />
For high-speed, low-<strong>in</strong>ductance<br />
production <strong>test</strong><br />
[protoselectronics.com]<br />
Gregg Wooden<br />
sales@protoselectronics.com<br />
Rika Denshi America Inc.<br />
112 Frank Mossberg Dr.<br />
Attleboro, MA 02703<br />
b 508.226.2080<br />
> 508.226.2980<br />
1991<br />
F<strong>in</strong>e Pitch Test Socket Series<br />
Test V March 2002<br />
-40° to 150°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 500,000<br />
100,000<br />
0.013 0.05<br />
0.04 0.15<br />
P Au, Ni<br />
Uses GCI/Flex <strong>in</strong>terconnects,<br />
excellent for high-frequency,<br />
high-current chips<br />
[rtec.com]<br />
David Ries,<br />
VP–Sales <strong>and</strong> Market<strong>in</strong>g<br />
dries@rtec.com<br />
SER Electronics<br />
3478 Buskirk Ave., Ste. 1020<br />
Pleasant Hill, CA 94523<br />
b 925.746.7166<br />
> 925.746.7153<br />
1998<br />
FBGA Test Socket<br />
Burn-<strong>in</strong> V CM<br />
100° to 155°<br />
C 0.5 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 100,000<br />
1.5 5.0<br />
0.02 0.5<br />
P Au, Pd<br />
Suitable for manual use <strong>and</strong><br />
with <strong>test</strong> h<strong>and</strong>lers<br />
[serusa.com]<br />
Masamoto Taira<br />
mtaira@serusa.com<br />
Synergetix<br />
310 S. 51st St.<br />
Kansas City, KS 66106<br />
b 913.342.0404<br />
> 913.342.6623<br />
1994<br />
BGA Socket, Endura Probe Series<br />
CM<br />
V January 2004<br />
-55° to 150°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 500,000<br />
0.04<br />
0.25<br />
0.01<br />
0.05<br />
P Au<br />
Long life, lead-free compatible,<br />
high b<strong>and</strong>width capabilities<br />
[synergetix.com]<br />
Jamie Andes, Semiconductor<br />
Product Mgr., jamiea@synergetix.com<br />
Eastern U.S.: Pete Blitch<strong>in</strong>gton<br />
peteb@synergetix.com<br />
b 508.222.1658<br />
Western U.S.: Chris Huhn, chrish@synergetix.com<br />
b 408.272.9065<br />
38<br />
Chip Scale Review November/December Chip Scale 2004 [ChipScaleReview.com]<br />
• November - December 2004 • [ChipScaleReview.com]
INTERNATIONAL DIRECTORY OF TEST AND BURN-IN SOCKET MANUFACTURERS<br />
Company Name<br />
Address<br />
b Phone<br />
> Fax<br />
Year Founded<br />
Model Name <strong>and</strong>/or Number<br />
Function<br />
B=Burn-In, P=Production, T=Test<br />
V Introduced<br />
Operat<strong>in</strong>g Temperature<br />
(Degrees Celsius)<br />
C Contact Pitch (mm)<br />
T Technology<br />
I Typical Insertions<br />
Mutual Capacitance (pF)<br />
Self Capacitance (pF)<br />
Mutual Inductance (nH)<br />
Self Inductance (nH)<br />
P Contact Plat<strong>in</strong>g<br />
Features<br />
[web site]<br />
Contact<br />
Additional Offices<br />
Tecknit Interconnection Products<br />
129 Dermody ST.<br />
Cranford, NJ 07016<br />
b 908.272.5500<br />
> 908.809.8230<br />
1958<br />
Data not available Data not available [fuzzbuttons.com]<br />
Texas Instruments<br />
Sensors & Controls<br />
34 Forest St., MS 01-10<br />
Attleboro, MA 02703<br />
b 508.236.3800<br />
> 508.236.5200<br />
1959<br />
CBG/FBGA Family<br />
Burn-<strong>in</strong><br />
V June 2002<br />
-55° to 150°<br />
C 0.5 to 1.27mm<br />
T Dual-beam p<strong>in</strong>ch<br />
I 10,000<br />
0.4 to 0.9<br />
CM<br />
5 to 12<br />
CM<br />
P Ni/Au<br />
Open-top <strong>and</strong> clamshell <strong>socket</strong>s<br />
[ti.com/mc/igb]<br />
Beverly Wilk<strong>in</strong>s, Interconnection<br />
Market<strong>in</strong>g, bwilk<strong>in</strong>s@ti.com<br />
b 508.236.5216<br />
Italy: Tamas Kerekes<br />
tamas@n-plus-t.com<br />
b +39.0744.949157<br />
TG Technology Co. Ltd.<br />
No. 46 Section 1, Sun-Giau Rd.<br />
Chang-Hua, Taiwan 530<br />
b +886.49.2933847<br />
> +886.49.2933732<br />
2002<br />
MBS084066-B<br />
Burn-<strong>in</strong><br />
V March 2004<br />
Up to 135°<br />
C 0.8mm<br />
T Spr<strong>in</strong>g probes<br />
I 12,500<br />
CM<br />
CM<br />
CM<br />
CM<br />
P Au<br />
CM<br />
[Under construction]<br />
Arthur Chen, Vice GM<br />
arthur.bl@msa.h<strong>in</strong>et.net<br />
b +886.963.121810<br />
3M Electronic Solutions Division<br />
6801 River Place Blvd.<br />
Aust<strong>in</strong>, TX 78726<br />
b 800.225.5373<br />
> 800.932.9373<br />
1980 (Textool)<br />
Textool BGA Open-Top Type III<br />
Burn-<strong>in</strong>, <strong>test</strong><br />
V November 2004<br />
-55° to 150°<br />
C 1.0mm<br />
T Dual-beam<br />
I 20,000<br />
CM<br />
CM<br />
CM<br />
CM<br />
P CM<br />
High p<strong>in</strong>count capability,<br />
no-warp nest design, reliable<br />
microwipe contacts<br />
[3m.com/<strong>in</strong>terconnects]<br />
Tony Smith, Bus<strong>in</strong>ess Manager<br />
alsmith@mmm.com<br />
b 512.984.6953<br />
Unitechno USA Inc.<br />
7856 Jeanette Ct.<br />
Cupert<strong>in</strong>o, CA 95014<br />
b 408.255.3550<br />
> 408.255.3557<br />
2002<br />
BGA LGA R<strong>in</strong>g Contact System<br />
HF5 Series<br />
Burn-<strong>in</strong>, <strong>test</strong> V August 2003<br />
-40° to 150°<br />
C M<strong>in</strong>imum 0.5mm<br />
T R<strong>in</strong>g-shaped contact<br />
I 100,000<br />
CM<br />
CM<br />
CM<br />
CM<br />
P Au<br />
Accepts 5 amps at room<br />
temperature<br />
[unitechno.com]<br />
Masa Fuchigami, President<br />
mfuchigami@unitechno.com<br />
VN-TEK Inc.<br />
2262 Trade Zone Blvd.<br />
San Jose, CA 95131<br />
b 408.719.5000<br />
> 408.719.5003<br />
2001<br />
5x5x65mm QFN<br />
Test<br />
V March 2004<br />
-50° to 150°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I Up to 500,000<br />
CM<br />
CM<br />
0.25<br />
0.50<br />
P Au<br />
Used from develop<strong>in</strong>g stage<br />
boards to automated-h<strong>and</strong>ler<br />
temperature <strong>test</strong><br />
[vn-tek.com]<br />
James Tu, CFO<br />
james.tu@vn-tek.com<br />
Wells-CTI<br />
2102 W. Quail Ave., Ste. 2<br />
Phoenix, AZ 85027<br />
b 623.581.5330<br />
> 623.780.3987<br />
1948<br />
Open Top QFN/MLF 776P<br />
Burn-<strong>in</strong><br />
V March 2004<br />
-55° to 150°<br />
C 0.5mm<br />
T Stamped BeCu<br />
I 10,000<br />
0.7<br />
2.0<br />
0.8<br />
2.3<br />
P Au<br />
Compatible with all BLUs <strong>and</strong><br />
smallest open-top QFN <strong>socket</strong>s<br />
available<br />
[wellscti.com]<br />
Mark Murdza, Market<strong>in</strong>g Director<br />
mark.murdza@wellscti.com<br />
b 623.581.5330 ext. 49<br />
Yamaichi Electronics Co. Ltd.<br />
3-28-7 Nakamagome, Ohta-Ku<br />
Tokyo, 143 Japan<br />
b 408.456.0797 (U.S.)<br />
1956<br />
TCBGA Series<br />
CM<br />
V April 2003<br />
-40° to 125°<br />
C 0.4 to 1.27mm<br />
T Spr<strong>in</strong>g probes<br />
I 200,000<br />
0.17<br />
0.6<br />
0.25<br />
1.5<br />
P Ni/Au<br />
Even pressur<strong>in</strong>g lid, bias-cut p<strong>in</strong><br />
for stable contact resistance<br />
[yeu.com]<br />
Owen Prillaman<br />
owen.p@yeu.com<br />
Yamaichi Electronics USA Inc.<br />
2235 Zanker Rd.<br />
San Jose, CA 95131<br />
Chip Scale Review • November - December Chip Scale 2004 Review • [ChipScaleReview.com]<br />
November/December 2004 [ChipScaleReview.com] 39
Change language