PR ODUCT INF ORMA TION Melamine-faced panels (MFC/MFMDF)
PR ODUCT INF ORMA TION Melamine-faced panels (MFC/MFMDF)
PR ODUCT INF ORMA TION Melamine-faced panels (MFC/MFMDF)
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<strong>PR</strong><strong>ODUCT</strong> <strong>INF</strong><strong>ORMA</strong><strong>TION</strong><br />
Cleaning instructions<br />
<strong>Melamine</strong>-<strong>faced</strong> <strong>panels</strong> (<strong>MFC</strong>/<strong>MFMDF</strong>) can be cleaned using all normal household cleaning agents,<br />
although no highly abrasive cleaning materials should be used. Please note our cleaning instructions for<br />
<strong>MFC</strong>/<strong>MFMDF</strong> <strong>panels</strong>.<br />
Technical data and material properties<br />
Edge properties Requirements to DIN EN 14322 Pfleiderer <strong>panels</strong><br />
Standard <strong>panels</strong> Break-outs up to 10 mm ≤ 5 mm<br />
Rough cuttings Break-outs up to 3 mm ≤ 3 mm<br />
Surface faults:<br />
Points ≤ 2 mm2/m2 ≤ 2 mm²/m²<br />
Lengthwise faults ≤ 20 mm2/m2 ≤ 20 mm²/m²<br />
Distortion:<br />
Thickness ≥ 15<br />
(only for balanced build-up of the<br />
surfaces)<br />
Behaviour under abrasion stress to<br />
DIN EN 14322<br />
≤ 2 mm/m ≤ 2 mm/m<br />
WR turns<br />
1 < 150<br />
2 ≥ 150<br />
3A ≥ 350<br />
3B ≥ 650<br />
4 ≥ 1,000<br />
Behaviour under scratch stress to DIN<br />
EN 14322<br />
Stress 1.5 N No continuous track<br />
Insensitivity to marks<br />
Decorative <strong>panels</strong> must be insensitive to<br />
the mark- or stain-forming materials speci<br />
fied in DIN EN 14322, Appendix A.<br />
Printed décors (stone and wood<br />
reproductions and fantasy décors)<br />
Plain colours depending on layer<br />
thickness<br />
Plain colours depending on layer<br />
thickness<br />
Plain colours depending on layer<br />
thickness<br />
Plain colours depending on layer<br />
thickness<br />
> 1.5 N<br />
(The value 1 – 1.2 N is achieved for<br />
the surfaces SO and SM)<br />
PFLEIDERER <strong>panels</strong> fulfil the required<br />
values with a contact time of 16 hours.<br />
Heat sources (e.g. coffee machines, printers, faxes etc.) should not have any direct contact with the panel, since this can<br />
otherwise lead to the formation of cracks due to drying out.<br />
All the above technical properties apply exclusively for normal climatic conditions (temperature, air humidity, light etc.).<br />
Further information on subjects such as bending strength, transverse tensile strength, thickness<br />
swelling etc. can be found in the product information sheets on core materials<br />
The values specified for raw chipboard <strong>panels</strong> also apply for decorative <strong>panels</strong>.<br />
015 PI Direct-laminated <strong>panels</strong> - 0902 Page 2 of 4