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PR ODUCT INF ORMA TION Raw chipboard panels P3*

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<strong>PR</strong><strong>ODUCT</strong> <strong>INF</strong><strong>ORMA</strong><strong>TION</strong><br />

<strong>Raw</strong> <strong>chipboard</strong> <strong>panels</strong> <strong>P3*</strong><br />

As core and construction materials, <strong>chipboard</strong> <strong>panels</strong> are today indispensable in furniture<br />

manufacture and interior design. Their great versatility and good processing properties are<br />

just two of the many reasons why <strong>chipboard</strong> <strong>panels</strong> have become the most important<br />

wood-based material in terms of volume.<br />

* Certified to EN 13986<br />

Certificates apply only in combination with a valid delivery note<br />

<strong>PR</strong><strong>ODUCT</strong>ION OF RAW CHIPBOARD PANELS<br />

Chipboard <strong>panels</strong> are produced using waste from forest-grown<br />

timber, sawmill residues and to a certain extent clean and uncontaminated<br />

recycled timber. These consist mainly of softwoods (spruce,<br />

pine) and to a lesser extent (< 10 %) hardwoods from sustai nable<br />

forestry certified according to the PEFC system. By means of<br />

chopping, cutting and milling, the wood is turned into chips of a<br />

particular shape and size. These chips are fed through a chip-dryer<br />

before being separated into groups of different sizes. The dried<br />

chips are then mixed with low-formaldehyde E1 resins and shaped<br />

into a slab, which is then compressed under pressure and heat. This<br />

is followed by the processing stages of conditioning, grading and<br />

sanding.<br />

The end-product is a material with stable and consistent characteristics, good processing properties, an<br />

excellent strength-to-weight ratio and attractive value for money.<br />

Further benefits of <strong>chipboard</strong> <strong>panels</strong>:<br />

• a favourable energy balance<br />

• production using renewable raw materials<br />

• and recycling capability<br />

PFLEIDERER carries out production at several locations in Germany. Consistently high quality is ensured<br />

by the latest production technology, electronic production monitoring and certification to ISO 9001.<br />

004 PI <strong>Raw</strong> <strong>chipboard</strong> P3 - 0902 Page 1 of 2


<strong>PR</strong><strong>ODUCT</strong> <strong>INF</strong><strong>ORMA</strong><strong>TION</strong><br />

The following data apply for all raw <strong>chipboard</strong> <strong>panels</strong><br />

Construction materials class<br />

Emission class E1<br />

Heat conductivity 0.13 W/mK<br />

Moisture content on delivery ex-factory 9 ± 3 %<br />

Thickness tolerance for finished <strong>panels</strong> ± 0.3 mm<br />

Length/width tolerance for standard <strong>panels</strong> ± 5 mm<br />

Perpendicularity tolerance 2 mm/m<br />

Edge straightness tolerance 1.5 mm/m<br />

Outside monitoring of production by the WKI.<br />

B2 (normally inflammable),<br />

except for Pyroex B1 (low inflammability)<br />

All the above technical properties apply exclusively for normal climatic conditions (temperature, air humidity, light etc.).<br />

<strong>P3*</strong> (EN 312-P4) – the moisture-resistant material for lamination<br />

P3 is a wood-based material for structural use for non-supporting purposes. Due to the use of aminoplast<br />

adhesives, this wood-based material is resistant to high air humidity and suitable for lamination with foils,<br />

veneers, melamine-resin-impregnated decorative papers and DUROPAL high-pressure laminates (HPL).<br />

The bonding agent produces a light-coloured wood-based material which also withstands short-term high<br />

exposure to moisture.<br />

Mechanical and physical properties<br />

Properties<br />

Thickness in mm<br />

8 10 13 16 19 22 25 28 38<br />

<strong>Raw</strong> density in kg/m 3 720 700 680 670 650 650 650 640 610<br />

Bending strength (EN 310) in N/mm 2 15 15 15 14 14 12 12 11 9<br />

Transverse tensile strength (EN 319) in N/mm 2 0.45 0.45 0.45 0.45 0.45 0.40 0.40 0.35 0.30<br />

Module of bending elasticity (EN 310) in N/mmm 2 2,050 2,050 2,050 1,950 1,950 1,850 1,850 1,700 1,550<br />

Resistance to delamination (EN 311) in N/mm 2 14 14 14 14 14 13 13 13 12<br />

Transverse tensile resistance to boiling (EN<br />

1087-1) in N/mm²<br />

0.09 0.09 0.09 0.08 0.08 0.07 0.07 0.07 0.06<br />

P3 <strong>panels</strong> are manufactured in accordance with EN 312.<br />

All values correspond to the status of our production and are guideline values. Subject to amendment.<br />

* Certified to EN 13986<br />

A service of<br />

PFLEIDERER Industrie GmbH • Product Management<br />

Holzstraße 6 - 10 • D-33332 Gütersloh • Telephone: 0 52 41 / 8 71 - 0 • Telefax: 0 52 41 / 8 71 - 9 87<br />

e-mail: produktmanagement@pfleiderer.com • Internet: www.industrie.pfleiderer.com<br />

004 PI <strong>Raw</strong> <strong>chipboard</strong> P3 - 0902 Page 2 of 2

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