Semiconductors Inside a Smartphone - india electronics ...
Semiconductors Inside a Smartphone - india electronics ...
Semiconductors Inside a Smartphone - india electronics ...
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Elements of an Open Collaborative Ecosystem:<br />
IBM Micro<strong>electronics</strong> Example<br />
• Mission: Provide world class semiconductor products<br />
through research, development, and manufacturing<br />
excellence to enable IBM systems and clients<br />
• Semiconductor Manufacturing Capabilities:<br />
– 200mm Manufacturing: 250nm+, 180nm, 130nm, 90nm nodes<br />
– 300mm Manufacturing: 90nm, 65nm, 45nm, 32nm nodes<br />
– Packaging: TSV 3D, flip chip, chip package interaction, Pb Free<br />
– Mask House: Capability for manufacturing nodes and advanced<br />
development<br />
– Yield / Factory Automation Software<br />
– Environmentally Friendly Manufacturing<br />
– Product Design / EDA capabilities<br />
Burlington, VT: 200mm Dev and Mfg<br />
Fishkill, NY: 300mm Dev and Mfg<br />
Bangalore, India: 200mm/300mm Dev<br />
• Research and Development Capabilities & Model:<br />
– Research and Development: 22nm, 14nm, 10nm =><br />
– World class technology research for materials, process,<br />
equipment, systems, and software<br />
– Collaboration model to create advanced semiconductor and<br />
packaging technologies with a range of partners<br />
• Process: Samsung, ST Micro, Global Foundries,…<br />
• Material: JSR, Rohm and Haas, BASF, etc<br />
• Equipment: Applied Materials, TEL, ASML, etc<br />
• Design / EDA: ARM, Cadence, Synopsis, Mentor Graphics, etc<br />
17 For Discussion Purposes only<br />
Albany NanoTech: 300mm R&D<br />
Watson Research Center (Yorktown,NY)<br />
Almaden Research Center (San Jose, CA)<br />
ISA CXO Conclave –Nov 2012 17
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