Semiconductors Inside a Smartphone - india electronics ...

Innovation, Collaboration, & Government Partnership
IBM Packaging Technology Corridor Example
NY State Partnership
C2MI Center
CNSE CCIC Center
East Fishkill PRDC
IBM Research
•Stand alone Bond and assembly line used to develop and
launch products based upon JDA ecosystem technology
•Focus on Product qualification & Process
optimization for rapid manufacturing scale-up
•Follow Silicon model & create world class packaging
Research facility fostering collaboration between public and
private entities
•Current focus is W2W 3D integration
•World class packaging interconnect and Bond & Assembly
development facility in East Fishkill
•Development of evolutionary and revolutionary
packaging technology
•World wide research across multiple labs, including Watson
(NY), ZRL (Zurich) and TRL (Tokyo), ARL (Austin) and BRL
(Brazil)
•Fundamental research exploring new
materials/process/paradigms
ISA CXO Conclave –Nov 2012 19