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and personal digital assistants (PDAs) and target markets for solder wafer bumping
services are primarily flip-chip-in-package (FCIP) applications for ball-gnd-array (EGA)
and chip-scale-packages (CSP) widely used in computers, telecoms, hand-held portables,
and automotive electronics as well as Smart Cards.
Project Summary:
A ban on the use of lead-containing solders in electronic products is currently
under consideration since it is believed that the lead from such products, which are
typically disposed of in landfills, have the potential to leach out and contaminate the
drinking water system. The electronics industry has been targeted to go "lead-free" and
laws banning the use of lead in electronics products are due to be enacted in the European
Community (in January 2008) with similar legislation to restrict the use of lead pending
in the United States and in Japan.
Efforts to identify suitable lead-free finishes for electronic components have thus
far been focused mainly on printed circuit boards, leadframe packages, and in the
selection of solder pastes. Little attention has being paid to the fabrication of lead-free
bump interconnections which are required when packaging integrated circuits (ICs) by
flip-chip bonding despite industry predictions that 2.5% of all ICs manufactured in the
year 2004, approximately 2.4 billion ICs, will have to be bumped and packaged using
flip-chip (Fig. 2).
Approx total usage = 490 million chips
Approx total usage = 2,400 million cf
(-2.5% of total worldwide 1C production)
Telecom Consumer
2% 1% Consumer Medical
01%
Computers
7%
1997 2004
(Source: TechSearch International Inc., 1998)
The above information is provided by the SERAP company for reference only SERAP is a technopreneur fund
To learn more about SERAP, please visit www mfo gov hk/itc/itf or call (852) 27372409
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