kingsford environmental (hk) ltd. - HKU Libraries - The University of ...
kingsford environmental (hk) ltd. - HKU Libraries - The University of ...
kingsford environmental (hk) ltd. - HKU Libraries - The University of ...
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As-plated tin-bismuth solder bumps<br />
Re-flowed tin-bismuth solder bumps<br />
As-plated tin-copper solder bumps<br />
Re-flowed tin-copper solder bumps<br />
As-plated tin-silver solder bumps<br />
Fig. 3.<br />
Re-flowed tin-silver solder bumps<br />
Specific project deliverables for the Small Entrepeneur Resarch Assistance Program<br />
(SERAP) grant include the fabrication and characterization <strong>of</strong> the four types <strong>of</strong> lead-free<br />
bump technologies, establishment <strong>of</strong> the process parameters for bump fabrication (by<br />
electroplating), an assessment <strong>of</strong> the reliability <strong>of</strong> the lead-free bumps in comparison to<br />
lead-tin bumps, their compatibility with solder paste materials and reflow processes for<br />
attachment onto substrates and commercialization <strong>of</strong> the bumping technologies.<br />
For further information on the SERAP project please contact:<br />
Dr. Zaheed S. Karim (Technology Director)<br />
1901 Sunley Centre<br />
9 Wing Yin Street<br />
Tsuen Wan<br />
Hong Kong<br />
Tel: (852)2719-5440<br />
Fax: (852)2358-4766<br />
E-mail: ait@ait.com.<strong>hk</strong><br />
WWW: www.ait.com.<strong>hk</strong><br />
<strong>The</strong> above information is provided by the SERAP company for reference only. SERAP is a technopreneur fund.<br />
To learn more about SERAP, please visit www.info.gov.<strong>hk</strong>/itc/itfor call (852) 27372409.<br />
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