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THROUGH-HOLE REWORK (DVD-41C) v.1<br />
This test consists of twenty-five multiple-choice questions. All questions are from the<br />
video: Through-Hole Rework (DVD-41C).<br />
Each question has only one most correct answer. Circle the letter corresponding to<br />
your selection for each test item. If you wish to change an answer, erase your choice<br />
completely.<br />
You should read through the questions and answer those you are sure of first. After<br />
your first pass through the test, then go back and answer the questions that you were<br />
not sure of. If two answers appear to be correct, pick the answer that seems to be the<br />
most correct response.<br />
When you are finished, check to make sure you have answered all of the questions.<br />
Turn in the test materials to the instructor.<br />
The passing grade for this test is 70% (18 correct answers or better).<br />
Good luck!<br />
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ANSWER SHEET<br />
THROUGH-HOLE REWORK (DVD-41C) v.1<br />
Name: __________________________________________ Date: ____________________<br />
Circle the letter corresponding to your answer for each test item.<br />
1 A B C D<br />
2 A B C D<br />
3 A B C D<br />
4 A B C D<br />
5 A B C D<br />
6 A B C D<br />
7 A B C D<br />
8 A B C D<br />
9 A B C D<br />
10 A B C D<br />
11 A B C D<br />
12 A B C D<br />
13 A B C D<br />
14 A B C D<br />
15 A B C D<br />
16 A B C D<br />
17 A B C D<br />
18 A B C D<br />
19 A B C D<br />
20 A B C D<br />
21 A B C D<br />
22 A B C D<br />
23 A B C D<br />
24 A B C D<br />
25 A B C D<br />
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THROUGH-HOLE REWORK (DVD-41C) v.1<br />
1. The industry specifications many companies use for workmanship standards are<br />
a. <strong>IPC</strong>-T-50 and <strong>IPC</strong>-A-620<br />
b. DRM-64 and DRM-SMT<br />
c. ANSI/J-STD-001 and <strong>IPC</strong>-A-610<br />
d. all of the above<br />
2. If a solder joint meets minimum acceptable conditions, it should be<br />
a. left alone<br />
b. touched up so that its cosmetic appearance is more acceptable<br />
c. reworked so that it has the attributes of a target solder joint<br />
d. none of the above<br />
3. Cosmetic imperfections not considered detrimental to the reliability of a solder joint<br />
are called<br />
a. cosmetic anomalies<br />
b. process indicators<br />
c. process imperfections<br />
d. cosmetic processes<br />
4. Electromigration is the<br />
a. movement of electrons through a passive component<br />
b. fancy name for the copper plating on circuit board assemblies<br />
c. growth of metal dendrites in the presence of flux residues<br />
d. migration of electrons along the path electronic circuitry<br />
5. A safe starting temperature for reworking solder joints is<br />
a. 400 degrees C<br />
b. 360 degrees C<br />
c. 330 degrees C<br />
d. 315 degrees C<br />
6. The main reason to tin the tip of the soldering iron is to<br />
a. give the tip much more surface area<br />
b. have better heat transfer<br />
c. create oxidation<br />
d. all of the above<br />
7. The material that removes oxidation and assists with heat transfer during soldering<br />
is<br />
a. the lead in tin-lead solder<br />
b. the solder alloy<br />
c. flux<br />
d. dross<br />
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THROUGH-HOLE REWORK (DVD-41C) v.1<br />
8. The solder braid is used to<br />
a. remove solder from the joint<br />
b. create more professional looking solder joints<br />
c. assist in heart transfer<br />
d. apply the flux more evenly<br />
9. The vacuum extractor is used to<br />
a. remove solder from the joint<br />
b. create more professional looking solder joints<br />
c. assist in heart transfer<br />
d. apply the flux more evenly<br />
10. Tip selection for the vacuum extractor is based upon<br />
a. the shape of the soldered lead<br />
b. the diameter of the soldered lead<br />
c. the size of the land<br />
d. all of the above<br />
11. The vacuum switch is pressed on the vacuum extractor<br />
a. immediately after the lead comes loose<br />
b. after the extractor tip is placed on the joint<br />
c. when complete solder melt is achieved<br />
d. before the extractor tip is placed on the joint<br />
12. The purpose of continuing to press the vacuum switch after the solder is removed<br />
a. is to distribute the flux evenly<br />
b. is to cool the metals inside the hole<br />
c. is to repair any damage done to the land<br />
d. is to allow the solder to dissipate inside the extractor<br />
13. A sweat joint occurs when<br />
a. a bead of water appears on the joint after the extraction process<br />
b. the soldering temperature is too high<br />
c. flux remains after the extraction process<br />
d. the joint isn’t properly cooled and the residual solder bonds to the lead<br />
14. A partially clinched lead should be straightened by<br />
a. placing a chisel tip beneath the lead and applying upward pressure<br />
b. using needle nose pliers to twist the lead and bend it up<br />
c. using a vacuum extractor to melt the solder, then bend the lead upright<br />
d. any of the above<br />
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THROUGH-HOLE REWORK (DVD-41C) v.1<br />
15. To straighten a fully clinched lead<br />
a. use a thermal parting tool with a flat tip<br />
b. use a chisel tip on a hand soldering iron<br />
c. use a vacuum, extractor and pliers<br />
d. any of the above<br />
16. The main functional difference between desoldering DIP and axial components is<br />
a. DIP components contain ICs<br />
b. DIP components have flat leads<br />
c. vacuum extractors cannot be used on DIP components<br />
d. there are no polarity markings on axial components<br />
17. In order to avoid potential heat damage to the board when desoldering DIPs<br />
a. skip around as you desolder the leads<br />
b. desolder in a continuous line starting at the corners<br />
c. desolder in a continuous line starting in the middle<br />
d. the order in which leads are desoldered is not a factor in heat damage to the board<br />
18. If you’re having trouble desoldering, it can be helpful to<br />
a. significantly raise the temperature of the vacuum extractor<br />
b. use a solder braid in addition to the extractor<br />
c. use an auxiliary heating source on the opposite side of the board<br />
d. all of the above<br />
19. To correct a solder bridging condition<br />
a. place a chisel tip on the solder bridge and reheat both joints completely<br />
b. use a solder braid to desolder the bridge and the affected joints, then resolder the joints<br />
c. remove the bridge with a vacuum extractor, then resolder the joints<br />
d. all of the above<br />
20. The easiest way to remove unacceptable solder icicles is to use a<br />
a. solder braid<br />
b. hand soldering iron and a small amount of flux<br />
c. vacuum extractor<br />
d. thermal parting tool<br />
21. The easiest and fastest method to remove excess solder is to use a<br />
a. hand soldering iron and a small amount of flux<br />
b. vacuum extractor<br />
c. thermal parting tool<br />
d. solder braid<br />
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THROUGH-HOLE REWORK (DVD-41C) v.1<br />
22. Cross contamination can occur when<br />
a. an operator sneezes on an assembly<br />
b. different solder alloys are mixed<br />
c. oils from ungloved hands get on the assembly<br />
d. coffee is spilled on an assembly<br />
23. The visual appearance of the lead free solder joints is<br />
a. smoother than tin-lead<br />
b. grainier than tin-lead<br />
c. shinier than tin-lead<br />
d. wetter than tin-lead<br />
24. The melting temperature for lead free solder is typically<br />
a. 50 degrees C higher than tin-lead<br />
b. 40 degrees C higher than tin-lead<br />
c. 30 degrees C higher than tin-lead<br />
d. 20 degrees C higher than tin-lead<br />
25. In lead free soldering, the more robust fluxes<br />
a. clean surfaces more aggressively<br />
b. assist in heat transfer<br />
c. are harder to clean after soldering<br />
d. all of the above<br />
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