ipc-a-610 “acceptability of electronic assemblies” - SMTA

IPC-A-610 “ACCEPTABILITY OF
ELECTRONIC ASSEMBLIES”
REVISION “D”
THE CHANGES ARE IN!

TOPICS OF DISCUSSION:
♦ USING IPC-A-610 AND THE PURPOSE
♦ TRAINING PROGRAM STATUS
♦ NEW FORMAT
♦ OVERVIEW OF EACH OF THE 12
SECTIONS
♦ ADDITIONAL AND NEW CRITERIA

TRAINING PROGRAM
CERTIFIED IPC TRAINER (CIT)
♦ Will be certified to the complete document.
♦ 32 hour format has been developed.

TRAINING PROGRAM CONT.
CERTIFIED IPC APPLICATION
SPECIALIST
♦ This course is modularized.
♦ Sections 1,2,3 will be mandatory.
♦ Set up is like the J-STD-001 Operator
course. (If you do not do conformal coating,
then why spend the time training your
operators, etc.)

SECTIONS RE-NUMBER
♦ Section 1 – Foreword
(Same)
♦ Section 2 – Applicable
Documents (Same)
♦ Section 3 – Protecting the
Assembly (Same)
♦ Section 4 – Hardware
(Same – less some criteria.)
♦ Section 5 – Soldering
(New)
♦ Section 6 – Terminals
(New)
♦ Section 7 – Through Hole
Technology (Section 5 & 6)
♦ Section 8 – Surface Mount
Assemblies (Section 12)
♦ Section 9 – Component
Damage (New)
♦ Section 10 – Printed Circuit
Board Assemblies (Same &
includes markings, coatings,
cleaning)
♦ Section 11 – Discrete Wiring
(Same)

NEW FORMAT
6 Terminals
♦ 6.1 Terminals - Edge Clip 4.7
♦ 6.2 Swaged Hardware 4.3
♦ 6.2.1 Swaged Hardware - Flared Flange 4.3
♦ 6.2.1.1 Swaged Hardware - Flared Flange - Controlled Split 4.3.1.1
♦ 6.2.2 Swaged Hardware - Terminals 4.3.3
♦ 6.2.3 Swaged Hardware - Flat Flange - Fused-in-Place 4.3.2, 6.6.6
♦ 6.3 Wire/Lead Preparation, Tinning 4.3.2
♦ 6.4 Terminals - Lead Forming - Stress Relief 5.3.2.3
♦ 6.5 Terminals - Service Loop 5.5.4
♦ 6.6 Terminals - Stress Relief Lead/Wire Bend 5.5.3
♦ 6.7 Terminals – Lead/Wire Placement 5.5.5, 5.5.1
♦ 6.7.1 Terminals – Lead/Wire Placement - Turrets and Straight Pins
5.5.1

NEW FORMAT CONT.
♦ 6.10 Terminals – Solder 6.6
♦ 6.10.1 Terminals – Solder - Turrets 6.6.2
♦ 6.10.2 Terminals – Solder – Bifurcated 6.6.1
♦ 6.10.3 Terminals – Solder - Slotted Terminal Assembly
Requirements
♦ 6.10.4 Terminals – Solder - Pierced/ Perforated 6.6.4
♦ 6.10.5 Terminals – Solder - Hook/Pin 6.6.3
♦ 6.10.6 Terminals – Solder - Solder Cups 6.6.5

SECTION 6 – TERMINALS
♦ Added illustrations from IPC/WHMA-A-
620
♦ Wire placement
♦ Wire Insulation
♦ Terminal Types
♦ Soldering of wires

SECTION 6 – TERMINALS CONT.
♦ Criteria for wire tinning.

SECTION 6 – TERMINALS CONT.
♦ Better illustrations and more detail.

NEW SECTION
♦ 5 Soldering
♦ 5.1 Soldering Acceptability Requirements 6.1
♦ 5.2 Soldering Anomalies
♦ 5.2.1 Soldering Anomalies - Exposed Basis Metal 6.5.2
♦ 5.2.2 Soldering Anomalies - Pin Holes/Blow Holes 6.5.4, 12.4.8
♦ 5.2.3 Soldering Anomalies - Reflow of Solder Paste 12.4.3
♦ 5.2.4 Soldering Anomalies - Nonwetting 6.5.6 , 12.4.4
♦ 5.2.5 Soldering Anomalies - Dewetting 12.4.5
♦ 5.2.6 Soldering Anomalies - Excess Solder
♦ 5.2.6.1 Soldering Anomalies - Excess Solder- Solder Balls/Solder
Fines 6.5.3.1, 12.4.10
♦ 5.2.6.2 Soldering Anomalies - Excess Solder- Bridging 6.5.3.2, 12.4.9

SECTION 7
♦ Criteria has changed on meniscus in hole
for class 3. It is a defect, revision C it was a
process indicator – reason: part
manufacturers have stated that the first .050”
of the lead is non-solderable.

WHAT TO EXPECT
♦ TABLES LIKE J-STD-001 – These will be at the
beginning of each section in Section 8 SMT.

WHAT TO EXPECT CONT.
♦ Lead-free illustrations included to show
visual differences.
SnPb No Clean
SnAgCu No Clean

WHAT TO EXPECT CONT.
♦ Example of Tin-Lead and Lead-Free with
use of Water Soluble Paste (Section 5)

WHAT TO EXPECT CONT.
♦ Example of Tin-Lead and Lead-Free
(Section 5)

WHAT TO EXPECT CONT.
♦ Section 5 will show various examples of
connections that are Lead-Free.

WHAT TO EXPECT CONT.
♦ Additional examples:

ADDITIONAL CRITERIA
♦ PQFN
♦ BGA
♦ D-PAKS
♦ Better illustrations

BGA CRITERIA Section 8.2.12
♦ Defect – Class 1,2,3
• Visual or x-ray evidence of solder bridging
(Figure 8-144).
• A “waist” in the solder connection indicating that
the solder ball and the attaching solder paste did
not flow together (Figure 8-145).
• Incomplete wetting to the land.
• BGA solder ball terminations have incomplete
reflow of the solder paste (Figure 8-146).
• Fractured solder connection (Figure 8-147).

BGA CRITERIA CONT.
♦ 8.2.12.5 Plastic BGA – Voids (Plastic BGA’s are what
were used for testing that was done by Rockwell Collins
and Lockheed Martin Team providing data to the
committee).
♦ Thermal cycle test results show that no single value can be
used for void acceptance, and some voids have no impact
on integrity of the connections.
♦ Manufacturers are encouraged to use test or analysis to
develop acceptance criteria for voiding that consider the
end-use environment. If this information is not available
and x-ray is used for inspection, the following criteria
apply.

BGA CRITERIA CONT.
Acceptable - Class 1,2,3
♦ Less than 25% voiding in the ball to board or ball
to component interface.
Defect - Class 1,2,3
♦ More than 25% voiding in the ball to board or ball
to component interface.
Test data showed that more than 25% was not a
problem in some cases; 25% is what the
committee could live with.

PLASTIC QUAD FLAT PACK – NO
LEADS (PQFN) Section 8.2.13
There are some package configurations that have no
toe exposed or do not have a continuous solderable
surface on the exposed toe on the exterior of the
package and a toe fillet will not form.

D-PAK Section 8.2.14
♦ These criteria are specific to packages that employ a
bottom thermal plane.
♦ Criteria for non-visible thermal plane solder connections
are not described in this document and will need to be
established by agreement between the user and the
manufacturer. The thermal transfer plane acceptance
criteria are design and process related. Issues to consider
include but are not limited to component manufacturer’s
application notes, solder coverage, voids, solder height, etc.
When soldering these types of components voiding in the
thermal plane is common.

D-PAK Section 8.2.14 CONT.
Target – Class 1,2,3
♦ No thermal plane side overhang.
♦ Thermal plane termination edges have 100%
wetting.

D-PAK Section 8.2.14 CONT.
Defect – Class 1,2,3
♦ Side overhang of thermal plane termination is greater than
25% of termination width.
♦ End of thermal plane termination overhangs land.
♦ End joint width of the thermal plane end termination has
less than 100% wetting to land in the contact area.

SECTION 9 – COMPONENT
DAMAGE (New Section)
9.5 Connectors:
♦ These criteria cover the plastic molded
housings/shrouds which are used primarily
as a guide for the mating connector.

9.5 CONNECTORS CONT.
Acceptable – Class 1,2
• Plastic burrs on housing but still attached (have not broken
loose).
• Crack in noncritical area (does not impact integrity of the
housing/shroud).
Acceptable – Class 3
• No cracks in housing/shroud.

9.5 CONNECTORS CONT.
Defect - Class 1, 2, 3
♦ • Evidence of burning or charring.
♦ • Changes in shape, chips, scrapes, scratches, melting or other damage
that affect form, fit or function.

SECTION 10 PRINTED CIRCUIT
BOARD ASSEMBLIES
10.1 Gold Fingers
10.2 Laminate Conditions
10.3 Marking
10.4 Coatings
10.5 Cleanliness

IPC-A-610 REVISION “D”
WORKSHOP
Now we will review the document!