ipc-a-610 âacceptability of electronic assembliesâ - SMTA
ipc-a-610 âacceptability of electronic assembliesâ - SMTA
ipc-a-610 âacceptability of electronic assembliesâ - SMTA
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D-PAK Section 8.2.14<br />
♦ These criteria are specific to packages that employ a<br />
bottom thermal plane.<br />
♦ Criteria for non-visible thermal plane solder connections<br />
are not described in this document and will need to be<br />
established by agreement between the user and the<br />
manufacturer. The thermal transfer plane acceptance<br />
criteria are design and process related. Issues to consider<br />
include but are not limited to component manufacturer’s<br />
application notes, solder coverage, voids, solder height, etc.<br />
When soldering these types <strong>of</strong> components voiding in the<br />
thermal plane is common.
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