ipc-a-610 “acceptability of electronic assemblies” - SMTA

BGA CRITERIA Section 8.2.12
♦ Defect – Class 1,2,3
• Visual or x-ray evidence of solder bridging
(Figure 8-144).
• A “waist” in the solder connection indicating that
the solder ball and the attaching solder paste did
not flow together (Figure 8-145).
• Incomplete wetting to the land.
• BGA solder ball terminations have incomplete
reflow of the solder paste (Figure 8-146).
• Fractured solder connection (Figure 8-147).