ipc-a-610 “acceptability of electronic assemblies” - SMTA

BGA CRITERIA CONT.
♦ 8.2.12.5 Plastic BGA – Voids (Plastic BGA’s are what
were used for testing that was done by Rockwell Collins
and Lockheed Martin Team providing data to the
committee).
♦ Thermal cycle test results show that no single value can be
used for void acceptance, and some voids have no impact
on integrity of the connections.
♦ Manufacturers are encouraged to use test or analysis to
develop acceptance criteria for voiding that consider the
end-use environment. If this information is not available
and x-ray is used for inspection, the following criteria
apply.