ipc-a-610 âacceptability of electronic assembliesâ - SMTA

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BGA CRITERIA CONT. Acceptable - Class 1,2,3 ♦ Less than 25% voiding in the ball to board or ball to component interface. Defect - Class 1,2,3 ♦ More than 25% voiding in the ball to board or ball to component interface. Test data showed that more than 25% was not a problem in some cases; 25% is what the committee could live with.
PLASTIC QUAD FLAT PACK – NO LEADS (PQFN) Section 8.2.13 There are some package configurations that have no toe exposed or do not have a continuous solderable surface on the exposed toe on the exterior <strong>of</strong> the package and a toe fillet will not form.
Page 1 and 2: IPC-A-610 “ACCEPTABILITY OF ELECT
Page 3 and 4: TRAINING PROGRAM CERTIFIED IPC TRAI
Page 5 and 6: SECTIONS RE-NUMBER ♦ Section 1 -
Page 7 and 8: NEW FORMAT CONT. ♦ 6.10 Terminals
Page 9 and 10: SECTION 6 - TERMINALS CONT. ♦ Cri
Page 11 and 12: NEW SECTION ♦ 5 Soldering ♦ 5.1
Page 13 and 14: WHAT TO EXPECT ♦ TABLES LIKE J-ST
Page 15 and 16: WHAT TO EXPECT CONT. ♦ Example of
Page 17 and 18: WHAT TO EXPECT CONT. ♦ Section 5
Page 19 and 20: ADDITIONAL CRITERIA ♦ PQFN ♦ BG
Page 21: BGA CRITERIA CONT. ♦ 8.2.12.5 Pla
Page 25 and 26: D-PAK Section 8.2.14 CONT. Target -
Page 27 and 28: SECTION 9 - COMPONENT DAMAGE (New S
Page 29 and 30: 9.5 CONNECTORS CONT. Defect - Class
Page 31: IPC-A-610 REVISION “D” WORKSHOP

ipc-a-610 âacceptability of electronic assembliesâ - SMTA

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ipc-a-610 âacceptability of electronic assembliesâ - SMTA