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SI-3000LU Series
■External Dimensions
(Unit : mm)
0.40
4.5 ±0.05
1.6±0.05
0.4 ±0.03
4.2 ±0.05 4.2 ±0.05 4.2 ±0.05
0.1 ±0.05
t
r
( 1.0 ±0.05 )
4.2 ±0.05 4.7±0.05 4.2 ±0.05
q w e
φ
0.90 ±0.1 2.5 ±0.05
0.90 ±0.1
1.5 ±0.05
4.3 ±0.05
Pin Assignment
q ADJ
w GND
e VC
r VIN
t VO
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.05g
1.5 ±0.05 1.5 ±0.05
0.4 ±0.05
■Block Diagram
SI-3012LU
SI-3018LU, SI-3025LU, SI-3033LU, SI-3050LU
VIN 4
5
VO
VIN
4
5
VO
VC 3
1
Adj
3
1
Adj
TSD
TSD
+
–
2
GND
+
–
2
GND
REF
REF
■Standard External Circuit
SI-3018LU, SI-3025LU, SI-3033LU, SI-3050LU
SI-3012LU
VIN
CIN
+
+
CIN
VIN
VIN
4
VC
3
2
GND
4
3
2
GND
VO
5
VDJ
1
VO
5
R1
1
R2
CO
+
+
CO
Load
Load
CO: Output capacitor (10 µF or larger)
For SI-3000LU series, Co has to be a low ESR capacitor such as a
ceramic capacitor.
CIN: Input capacitor (10 µF approx.)
• Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)
R1 and R2: Resistors for output setting
The output voltage can be set by connecting R1 and R2 as shown in the
diagram on the left.
R2: 100 kΩ is recommended
R1=(VO–VADJ)/(VADJ/R2)
VC
■Reference Data
Power Dissipation PD (W)
Copper Laminate Area vs Power Dissipation
Tj=100°C PCB size 40×40
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Ta=25°C
Ta=40°C
Ta=60°C
Ta=85°C
•A monolithic IC mounts an inner frame stage that is connected to the GND
pin (pin 2). Therefore, enlarging the copper laminate area connected to the
GND pin improves heat radiation effect.
• Obtaining the junction temperatureMeasure the temperature TC at the lead
part of the GND pin (pin 2) with a thermocouple, etc. Then, substitute this
value in the following formula to obtain the junction temperature.
Tj=PD×θj–c+Tc (θj–c=5°C/W)
0
10 100 1000
Copper Laminate Area (mm 2 )
Case temperature Tc
measurement point
IC
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