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SI-3000KMS Series
■External Dimensions
(Unit : mm)
6.60 ±0.20
1.10 ±0.20
(0.80)
6.60 ±0.20
C0.60
6.10 ±0.20
2.70 ±0.20
9.90 ±0.30
0.50 ±0.10
2.30 ±0.10
5.34 ±0.20 0.76 ±0.10 2.30 ±0.20
(0.89)
(5°)
(5°)
(5°)
SEATING PLANE 0.00 to 0.127
1.524 +0.254
–0.127
9.90 ±0.30
R0.25
5.34 ±0.20
(5.04)
(1.50)
2.70 ±0.20
(4.41)
Pin Assignment
q VIN
w GND (Common to the rear side of product)
e VOUT
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.33g
MAX 0.96
2.30 TYP 2.30 TYP
8°
0.50 ±0.10
(1.00)
0.1
■Block Diagram
VIN 1
3
VOUT
-
+
TSD
REF
2 GND
■Typical Connection Diagram
CIN
+
VIN
1
GND
2
D1 *2
VO
3
CO
+
*1
Load
CIN: Input capacitor (22 µF or larger)
CO: Output capacitor
*1: SI-3018KMS/3025KMS/3033KMS (22 µF or larger)
Co has to be a low ESR capacitor such as a ceramic capacitor.
When using the electrolytic capacitor, oscillation may occur at a low temperature.
SI-3050KMS/3090KMS/3120KMS/3120KMS/3150KMS (47 µF or larger)
If a low ESR capacitor is used, oscillation may occur.
*2: D1: Reverse bias protection diode
This diode is required for protection against reverse biasing between the
input and output.
(Sanken SFPL-52 is recommended.)
This diode is not required at VO≤3.3V.
■Reference Data
θ j-a(°C/W)
Copper Laminate Area-Thermal Resistance Copper Laminate Area-Power Dissipation Obtaining the junction temperature
Measure the temperature TC at the lead part
100
90
Glass-epoxy board: 30×30mm
Glass-epoxy board: 30×30mm
1.5
Ta=25°C
of the GND pin with a thermocouple, etc.
Then, substitute this value in the following
formula to obtain the junction temperature.
80
1
40°C
Tj=PD × θj–C + TC ( θj–C = 6°C/W)
70
PD=(VIN–VO) × IOUT
60°C
60
0.5
50
Power Dissipation PD (W)
85°C
40
10 100 1000
Copper Laminate Area (mm 2 )
0
10 100 1000
Copper Laminate Area (mm 2 )
Case temperature Tc
measurement point
IC
19