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SI-3000KS Series
■External Dimensions
(Unit : mm)
1.27
7 6
2 3
1.27
0.995max.
0.10
0.4 ±0.1 0.12 M
0.4 ±0.1 0.15+0.1 –0.05
8 5
1 4
0.05 ±0.05 1.5 ±0.1
4.4 ±0.2
1.55 ±0.15
6.2
0.5 ±0.1
0~10°
Pin Assignment
q VC
w VIN
e VO
r Sence (ADJ for SI-3012KS)
t GND
y GND
u GND
i GND
Plastic Mold Package Type
Flammability: UL 94V-0
Product Mass: Approx. 0.1 g
■Block Diagram
●SI-3012KS
●SI-3018KS, SI-3025KS, SI-3033KS
VIN 2
3
VOUT
VIN
2
3
VOUT
VC 1
4 ADJ
VC
1
4
Sense
-
+
TSD
8
7
-
+
TSD
8
7
REF
6
5 GND
REF
6
5 GND
■Typical Connection Diagram
●SI-3012KS
●SI-3018KS, SI-3025KS, SI-3033KS
CIN
+
VIN
2
VC
1
GND
5 to 8
VO
3
ADJ
4
R1
CO
R2
Load
CIN
VIN
2
VC
1
GND
5 to 8
VO
3
sense
4 CO Load
R2
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2
as shown above.
The recommended value of R2 is 24 kΩ .
R1=(VO–VADJ)÷(VADJ/R2)
CIN: Input capacitor (22 µF or larger)
CO: Output capacitor (22 µF or larger)
For SI-3000KS series, Co has to be a low ESR capacitor.
When using the electrolytic capacitor, the SI-3000KS series may oscillate at a low temperature.
■Reference Data
Thermal resistance θ j-a (°C/W)
140
120
100
80
60
Copper Laminate Area vs.
Thermal Resistance
Area of PC board : 40×40mm
Power dissipation PD (W)
1.2
1
0.8
0.6
0.4
0.2
Copper Laminate Area vs.
Power Dissipation
Tj=100°C Area of PC board : 40×40mm
Ta=25°C
Ta=50°C
Ta=80°C
• Obtaining the junction temperature
Measure the temperature TL at the lead part of the GND
pin (pin 7) with a thermocouple, etc. Then, substitute
this value in the following formula to obtain the junction
temperature.
Tj=PD × θj–L + TL ( θj–L = 22°C/W)
40
10 100
Copper laminate area (mm 2 )
(GND terminal)
1000
0
10 100
Copper laminate area (mm 2 )
(GND terminal)
1000
IC
17