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SI-3000LSA Series
■External Dimensions
(Unit : mm)
1.27
7 6
2 3
1.27
0.995max.
0.10
0.4 ±0.1 0.12 M
0.4 ±0.1 0.15+0.1 –0.05
8 5
1 4
0.05 ±0.05 1.5 ±0.1
4.4 ±0.2
1.55 ±0.15
6.2
0.5 ±0.1
0~10°
Pin Assignment
q VIN
w NC (Leave open)
e VIN
r VC
t GND
y GND
u VO
i VO
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
■Block Diagram
VIN
1
8
VO
NC
2
7
VO
VIN
3
TSD
+
–
6
GND
VC
4
5
GND
■Typical Connection Diagram
VIN
+
CIN
VC
VIN
1
2
3
4
VO
8
7
6
5
GND
+
CO
Load
CO: Output capacitor (22 µF or larger)
CIN: Input capacitor (10 µF)
This capacitor is required in the case of an inductive input line or long
wiring.
Tantalum capacitors are recommended for CIN and CO, particularly at
low temperatures.
* Leave pin 2 open.
■Reference Data
PCB Copper Laminate Area vs. Junction to
Ambient Air Thermal Resistance
Allowable Output Current
(vs. VIN-VOUT Voltage Difference)
VIN-IO max
150
1.2
θ
j-a (°C/W)
140
130
120
110
100
90
PCB (glass-epoxy, 40×40mm)
160mm (40×40) mm
Iout (max) (A)
1.0
0.8
0.6
0.4
Tj = 120°C (20% derating of 150°C)
θ j-a=100°C/W
Ta=25°C
The inner frame stage, on which the PTr is mounted,
is directly connected to the VOUT pin.
Therefore, enlarging the copper laminate area
around the VOUT pin is really effective for a heat
radiation.
80
0.2
Ta=85°C
70 100 1000 5000
Copper Laminate Area (mm 2)
0
1 2 3 4
VIN-VOUT Voltage Difference (V)
IC
15