Service manual FastMig Pulse power sources version 1.1

Replacing the Z001 card
FastMig production family has a soldering IGBT module and it is
not possible to change it separately. Only reliable way to replace
the module is to change the whole Z001 main circuit card.
Electrolube HTC NON-Silicone heat transfer compound EHTC10S is
supplied for use during equipment repair.
The tools and workshop premises used during this type of work must be
kept clean and free from dirt and dust.
Even very small particles (0,050mm) between the surfaces could
increase the gap between the module an the heat sink ,causing
overheating and damage.
Heat sink transfer compound is to be spread in an even layer of
approximately 0,1mm onto the module. Then the module should be
immediately mounted onto the heat sink, this minimizes the possibility of
any contamination (dirt etc.) getting between the components.
The M5 fixing screws are tightened (stage 1) to 0,5 – 2 Nm. After few
minutes the module fixing screws can be finally tightened (stage 2) to a
torque of 3 Nm. Note! Input rectifier is tightened to 2 Nm.
Tightening sequence:
Stage 1: All four screws to 0,5 – 2 Nm
Stage 2: All four screws to 3 Nm