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ASIA<br />

POWER<br />

ARCHITECTURE<br />

CONFERENCE<br />

SHENZHEN, CHINA<br />

1 SEPTEMBER 2011<br />

<strong>THINKPOWER</strong><br />

CELEBRATING 20 YEARS OF POWER ARCHITECTURE INNOVATION<br />

Open Platform for <strong>Power</strong>PC-based SoC Design<br />

Rui Wang<br />

Vice President of China Sales, VeriSilicon<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


VeriSilicon: Global Design Foundry<br />

Headquartered in US and China with 350+ employee worldwide.<br />

Primary operation in Shanghai with 260+ employees.<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Design Foundry: Horizontal Specialization<br />

Fabless or Fab-lite become mainstream.<br />

Design-lite become next trend.<br />

IDM<br />

Vertical Integration<br />

Fabless/Foundry<br />

Horizontal Segmentation<br />

Application &<br />

Subsystem Design<br />

Application &<br />

Subsystem Design<br />

Chip Design<br />

EDA/IP<br />

Chip Design<br />

Wafer Fab<br />

Design<br />

Foundry<br />

Wafer Fab<br />

Packaging/Test<br />

Packaging/Test<br />

Source::GSA, 2007<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


VeriSilicon’s Business Practice<br />

Tape out one chip per week and ramp up one product per month.<br />

Can support turn key service from spec.<br />

Foundry neutral.<br />

Customer<br />

Netlist to GDSII<br />

Manufacturing<br />

Service<br />

Backend<br />

Design<br />

Software<br />

Development<br />

Wafers<br />

Packaging<br />

Service<br />

Customer<br />

Customer<br />

RTL to Netlist<br />

Untested<br />

Chips<br />

WLP<br />

Customer<br />

Customer<br />

Front end<br />

Design<br />

Spec to RTL<br />

System<br />

Prototyping<br />

Testing<br />

Service<br />

Tested<br />

Chips<br />

Known<br />

Good<br />

Die<br />

Shipping<br />

Service<br />

Customer<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


A Snapshoot of On-going Design Projects<br />

15 on going projects.<br />

47% on advanced nodes.<br />

26% on Common Platform<br />

65nm, 4, 27%<br />

0.11um, 2,<br />

13%<br />

TSMC, 3,<br />

20%<br />

0.13um, 2,<br />

13%<br />

GSMC, 1,<br />

7%<br />

SMIC, 7,<br />

47%<br />

55nm, 1, 7%<br />

45nm, 2, 13%<br />

0.18um, 2,<br />

13%<br />

0.15um, 1,<br />

7%<br />

0.16um, 1,<br />

7%<br />

GF/CHRD,<br />

2, 13%<br />

IBM, 2,<br />

13%<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Project History<br />

VeriSilicon Projects with <strong>Power</strong>PC<br />

●<br />

●<br />

●<br />

●<br />

Project Name: CNCN1<br />

• Process node: IBM Cu65<br />

• Status: Pilot run<br />

• No. of Cores: 1 <strong>Power</strong>PC460 embedded<br />

Project Name: Sg945<br />

• Process node: IBM Cu65<br />

• Status: MPW<br />

• No. of Cores: 1 <strong>Power</strong>PC460 embedded<br />

Project Name: Axxxx<br />

• Process node: IBM Cu08<br />

• Status: design on-going<br />

• No. of Cores: 1 <strong>Power</strong>PC476 embedded<br />

Project Name: Ix1600<br />

• Process node: IBM Cu45<br />

• Status: design on going<br />

• No. of Cores: 4 <strong>Power</strong>PC476 embedded<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


HRNR –GHz Ethernet ASIC for Internet Infrastructure<br />

China customer<br />

IBM 90nm ASIC , Hierarchical flow<br />

13.5Mgates; 9.8MB memories<br />

Die size:17.16 x 17.16mm2<br />

High Speed SerDes (HSS) – 8.5 to 11.1G V3<br />

Freq: 312.5 MHz<br />

Difficulties: Big chip size, tough timing closure.<br />

Package info<br />

• Package size: 52.5mm×52.5mm<br />

• C4 Bump count: 6053<br />

• Package Type: FCPBGA-2577<br />

• Substrate layer: 10 (4-2-4)<br />

• SerDes: 10GHz@128 Channel<br />

• Tank PLL/Lib PLL 1.625GHz<br />

• <strong>Power</strong> : Up to 106.3W<br />

• (need special external heat sink)<br />

Redundancy methodology<br />

• Signal-to <strong>Power</strong>&GND ratio<br />

• <strong>Power</strong> bus/image<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


<strong>Power</strong> PC-based SoC for x-Pad and Media Tablet<br />

Custom Silicon turn key service from specification.<br />

CPU (<strong>Power</strong>PC 460)<br />

Android 2.3 and Flash Player 10.1.<br />

1080P HD video playback, including WebM.<br />

HD audio: DTS-HD Master Audio, Dolby TrueHD.<br />

2D/3D GPU with OPENGL ES2.0 and OPEN VG1.1.<br />

1080P HDMI output.<br />

Wireless access: Wi-Fi, Bluetooth, GPS, 3G.<br />

Up to 1280x800 TFT panel with multi-touch.<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


The State of the Art Application Processor SoC<br />

Design service for top US fabless companies.<br />

Dual 1GHz ARM core. Better 3D graphics than iPad2.<br />

Full HD video (1080p) and full HD ZSP based audio.<br />

TSMC 40 nm LP.<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


<strong>Power</strong>PC-based Open Platform for Digital 3.0<br />

1. Open Software Platform<br />

for Innovation<br />

2. Open SoC Hardware<br />

Platform for Acceleration<br />

3. Open IP<br />

Platform for<br />

Collaboration<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Increasing Software Cost<br />

Trend of Software Investment in SoC<br />

Percentage of Software Product Development Costs<br />

(%)<br />

80<br />

70<br />

60<br />

50<br />

40<br />

30<br />

20<br />

10<br />

0<br />

90nm<br />

65nm<br />

69.5<br />

45nm<br />

62.9<br />

65.3<br />

32nm<br />

56.6<br />

60.7<br />

56.8<br />

58.4<br />

56.8<br />

47.4<br />

49.6<br />

46.3 45.7<br />

41.2<br />

37.6<br />

2002 2005 2008 2011 2014<br />

Year<br />

More than half of all design team engineers<br />

for advanced products are software engineers.<br />

Source: IBS, 2007<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Linux Is A Single Largest Embedded OS in The Market<br />

27.4% of next projects will use Linux.<br />

Venture Development Corporation 2007/2008 and Mentor Graphics<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.<br />

1<br />

2


Android Architecture Overview<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


ZSP Based Multimedia (SD) Platform v1.0<br />

Demux Audio Video<br />

▲AVI file<br />

▲MPEG-4 file format (ISO-<br />

14496-14)<br />

▲MPEG-2/MPEG-4 Transport<br />

Stream<br />

▲RMVB / FLV<br />

▲MP3 audio file / AAC audio file<br />

▲WMA file / WMV file<br />

▲JPEG file<br />

Codec<br />

▲ MPEG-1/2 Layer I, II and III<br />

▲ AAC-LC / AAC plus V2<br />

▲ WMA<br />

▲ APE/FLAC<br />

▲ G. 729<br />

Post-Processing<br />

▲ SRS<br />

▲ Equalizer<br />

ZSP Based Video Decoder<br />

▲ MPEG-4 SP QVGA/CIF<br />

▲ H.264 BP QVGA/CIF<br />

▲ RMVB / FLV<br />

▲ JPEG<br />

Smart Controlling HW IP Video<br />

Codec<br />

▲ MPEG-4, H.264, VC-1 @ D1<br />

H.264, MPEG-4, AVS, and MPEG-2<br />

Up to D1 resolution with 30 frame per second<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Tablet Multimedia (HD) SoC Platform v2.0<br />

▲<br />

Tablet SoC Platform<br />

▲ ANDRIOD V2.3<br />

▲ Big/Little Endian support<br />

▲ Quad-Core SoC Architecture:<br />

▲ High Performance CPUs<br />

▲ ZSP800 (HD Audio)<br />

▲ GPU (OES2.0/OVG1.1. 2D/3D )<br />

▲ 1080P Video Decoder+Encoder Engine)<br />

▲ AXI Bus fabric<br />

▲ Big Endian and little Endian are supported<br />

▲<br />

Tablet SoC Platform<br />

▲ HDMI 1.3a<br />

▲ SATAII/III<br />

▲ Support high density NAND flash, mDDR /<br />

DDR2/3<br />

▲ Strong Communication interface for 802.11<br />

b/g, GPS, 3G<br />

▲<br />

▲<br />

Other General peripherals like USB,<br />

SD/MMC, UART, I2C, AC97, ….<br />

Available on 65nm/55nm/40nm Process<br />

node<br />

4 Virtex-5 5VLX330-FC1760<br />

DDR2 SODIMM<br />

USB2.0 PHY /Ethernet IF<br />

SRAM /SDRAM/NOR /NAND FLASH<br />

SD Disk /UART<br />

22 pcs SAMTEC High speed<br />

Connectors<br />

22 layer PCB -28.6mmx32.4mm<br />

CPU+ZSP+2D/3D GPU+VIDEO<br />

First-Time-Right Design<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


5pins<br />

81pins<br />

Optimized FPGA interconnection<br />

fpga_ppc_a<br />

clkgen<br />

clock<br />

resetn<br />

rstgen<br />

<strong>Power</strong> LDO<br />

POR/Reset<br />

button<br />

axi_sub<br />

OSC/CLK<br />

buffer<br />

DC JACK<br />

axi2apb_sub<br />

i2c0<br />

i2c1<br />

i2c2<br />

pwm<br />

rtc<br />

timer<br />

wdog<br />

gpio<br />

sysreg<br />

tsc<br />

240pins<br />

240pins<br />

120pins<br />

120pins<br />

ps0<br />

ps1<br />

ps2<br />

ps3<br />

ps4<br />

axi2apb<br />

ps5<br />

ps6<br />

ps7<br />

ps8<br />

ps9<br />

480pins<br />

ps10 ps11 ps12 ps13 ps14<br />

vdo0<br />

ppc464<br />

sec vdi<br />

8270 9190<br />

vdo1<br />

fpga_hantro_c<br />

m1 m2 m3<br />

s3 m4 m5 m7 m8 m9<br />

NIC301(IN_BRIDGE)<br />

m6 s5 s6 s7 s8 s9 s10 s2 m11 m10 s1<br />

s4<br />

s11<br />

gc800<br />

ddr<br />

sdma vrom<br />

fpga_gpu_b<br />

fpga_zsp_d<br />

zsp800 nand mems sdio0 sdio1<br />

ahb_sub<br />

hs8<br />

hs9<br />

hs10 hm0 hs0 hs11 hs12 hs13 hs14<br />

ahb<br />

hm1 hs1 hm2 hs2 hm3 hs3 hs15 hm4 hs4 hm5 hs5 hm6 hs6 hs7<br />

dma0 dma1<br />

usb0 DW_apb usb1<br />

sata<br />

emac ictl<br />

4LED<br />

4Switch<br />

ZSP JTAG<br />

OSC<br />

ICS844071I<br />

4LED<br />

4Switch<br />

8pins<br />

CLK 8pins<br />

5pins<br />

8pins<br />

2pins<br />

CLK 8pins<br />

DDR/SDRAM<br />

Connector<br />

PPC JTAG 6pins<br />

80pins<br />

FPGA_B:XC5VL330<br />

GC800<br />

AXI(200pins)<br />

AHB(120pins)<br />

FPGA_A:XC5VL330<br />

<strong>Power</strong> PC460S<br />

DDR<br />

AXI BUS Matrix<br />

AXI(200pins)<br />

AHB(120pins)<br />

40Pins<br />

120pins<br />

AHB(120pins)<br />

AXI(200pins)<br />

40Pins<br />

Peripheral Signals(240)<br />

4LED<br />

CLK<br />

4Switch<br />

8pins<br />

8pins<br />

FPGA_D:XC5VL330<br />

ZSP800<br />

SD/MMC/SDIO<br />

NFC, Memory Stick, SATA<br />

TS steam, TV encoder,<br />

USB Host/Device,<br />

MAC, CMOS Sensor<br />

LCDC, HDMI<br />

Audio Code(I2S), UART<br />

I2C, Touch Panal, RTC<br />

IR, SPI, GPIO,Timer<br />

SPDIF, AC97, SIM, GPS<br />

ZSP JTAG<br />

268pins<br />

2pins<br />

19pins<br />

7pins<br />

4pins<br />

38pins<br />

16pins<br />

120pins<br />

OSC<br />

ICS844071I<br />

MAC PHY<br />

LPT<br />

RS45<br />

SD Socket<br />

UART Port<br />

USB PHY<br />

Connector<br />

NAND Flash<br />

Memory<br />

ahb2apb_sub<br />

FPGA_C:XC5VL330<br />

DDR/SDRAM<br />

Connector<br />

uart0<br />

uart1<br />

uart2 uart3 uart4<br />

i2s0<br />

i2s1<br />

i2s2<br />

Video Decoder or Encoder IPs<br />

82pins<br />

ps0<br />

ps1 ps2 ps3<br />

ps4<br />

ps5 ps6 ps7<br />

105pin<br />

ps8<br />

ps9<br />

ps10<br />

ahb2apb<br />

ps11<br />

ps12<br />

ps13<br />

ps14<br />

ps15<br />

82pins<br />

8pins<br />

CLK<br />

246pin<br />

8pins<br />

4LED<br />

4Switch<br />

81pins<br />

i2s3<br />

spi0<br />

spi1<br />

ac97<br />

spdif<br />

gps<br />

tss<br />

simc<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Open SoC Hardware Platform<br />

Android Phone and Smart Phone<br />

Android Pad and Media Tablet<br />

Google TV and Smart TV<br />

Three screens under one cloud<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Typical SoC Requirements<br />

CPU<br />

Memory Interface<br />

Bus Interface<br />

De-Mux<br />

Video Processor<br />

Audio Processor<br />

Display Processor<br />

3D Graphic Processor<br />

Legacy Data I/O<br />

Legacy A/V I/O<br />

Android Phone Android Tablet Google TV<br />

1000 DMIPS-level High Performance CPU<br />

DDR2/DDR3 Interface<br />

AXI<br />

MPEG-2 Transport Demux<br />

Multi-standard Full HD Video Decoding<br />

Multi-standard Full HD Audio Decoding<br />

2D Blitter/Mixer/Scaler/CSC/OSD/etc*<br />

OpenGL Support*<br />

I2C/UART/SPI/HPI/SD/MMC/USB/WLAN/etc<br />

NTSC/PAL/CCIR/RGB/CVBS/I2S/SPDIF/etc<br />

Specific Data I/O SATA SATA/Ethernet<br />

Specific A/V I/O MIPI HDMI(rx/tx)<br />

The SoC back-bone is mostly re-usable<br />

Specific Data I/O & A/V I/O differentiate each 3S SoC platform<br />

* The higher resolution support for the lager screen<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Increasing IP Costs<br />

IP Investment is continuously increasing<br />

31% of total<br />

cost<br />

23% of total cost<br />

12% of total cost<br />

16% of total cost<br />

Source: IBS, 2007<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Star IP Based SoC Platform<br />

SoC = Core + in-house IP + 3 rd Party IP<br />

CPU: <strong>Power</strong> PC, etc<br />

MCU/FPU<br />

Embedded DSP family: ZSP<br />

2D/3D OES2.0/OVG1.1 GPU<br />

Hi Definition Video CODECs<br />

Audio CODEC<br />

Voice CODEC<br />

USB1.1/2.0<br />

LVDS/mini LVDS<br />

SAR ADC Family<br />

Video ADC/DAC<br />

IQ ADC<br />

SD/Nand Flash Contrller<br />

SDR/DDR1/2/3<br />

USB 2.0 OTG/3.0<br />

HDMI 1.3/1.4<br />

SATA<br />

MIPI<br />

High Speed SerDes<br />

DTV Demodulator<br />

GPS, etc<br />

Design Services<br />

Embedded software<br />

development<br />

Turn Key<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Market Dominance of ZSP Based HD Audio<br />

The most powerful single core HD audio solution.<br />

The most comprehensive suite of certified HD audio software.<br />

65% of stand alone Blu-ray players are ZSP based.<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


VeriSilicon ZSP-based HD Audio SW Solutions<br />

AC-3 5.1 Decode<br />

DTS Decode<br />

DTS HD LBR<br />

Decode<br />

MPEG-4 AAC LC<br />

Decode<br />

MPEG-4 AAC LC<br />

Encode<br />

AC-3 5.1 Encode<br />

DTS Encode<br />

MPEG 1,2,3 L1-L3<br />

Decode<br />

MPEG 1 L2, L3<br />

Encode<br />

DTS Neo:6<br />

Dolby Digital Plus<br />

Decode<br />

DTS HD Decode<br />

WMA<br />

HE-AAC<br />

DAB+ HE-AAC<br />

Dolby True HD<br />

Decode<br />

DTS Master Audio<br />

(Lossless)<br />

MPEG-4 AAC v2<br />

(5.1) Decode<br />

Dolby Digital<br />

Encoder<br />

Dolby Digitial Plus<br />

Decoder Converter<br />

Certified, field-proven software shipping with customers<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Award Winning ZSP Based HD Audio Solution<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


VeriSilicon ZSP Based 3G Wireless Solutions<br />

▲ Widely presence in<br />

worldwide Tier 1<br />

wireless SoC solutions<br />

providers<br />

▲ Huawei, world’s largest<br />

data card supplier, shipped<br />

ZSP based WCDMA/HSPA<br />

terminals since 2010<br />

- GSM/GPRS<br />

- WCDMA/HSPA<br />

-TD-SCDMA<br />

ZSP<br />

400<br />

ZSP<br />

500<br />

ZSP<br />

540<br />

ZSP<br />

800<br />

ZSP<br />

840<br />

Next Generation<br />

- WiMAX<br />

- LTE/TD-LTE<br />

- LTE/TD-LTE Advanced<br />

▲ Sequans came back to<br />

ZSP for LTE, more ZSP<br />

based LTE solutions going to silicon<br />

▲ Innofidei launched world<br />

1st TD-LTE chip based on<br />

ZSP, demonstrated at<br />

Shanghai World Expo.<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Market Proven Voice Solutions<br />

BCM1100<br />

BCM1101<br />

BCM1113x<br />

BCM1115x<br />

BCM3341<br />

BCM335x<br />

BCM6341<br />

IP Phones<br />

Cisco, Nortel, Alcatel<br />

VoCable, VoDSL<br />

Residential Gateway<br />

MSP4200<br />

VoIP Wireless<br />

Router<br />

Dual Mode Cellular Phones<br />

LSI403LP<br />

VoIP Coprocessor<br />

+ Z.Voice<br />

LSI403WLP<br />

VoIP Coprocessor<br />

VoWLAN Module for<br />

Dual Mode Cellular Phones<br />

35M ZSP based VoIP parts shipped with 100M VoIP ports enabled<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


ZSP Based SoC Platforms<br />

HD DVD<br />

Blu-Ray<br />

AV Receivers<br />

Camcorders<br />

Auto Infotainment<br />

+<br />

G3<br />

High Definition<br />

Audio<br />

3G/4G/WiM<br />

ax<br />

Speech Processing<br />

G2<br />

PMP, DVD<br />

DTV, 1st gen HD DVD<br />

WCDMA, TD-SCDMA, WiMax<br />

Residential Gateway<br />

Enterprise<br />

G1<br />

Portable Audio/Video<br />

DTV/DVD<br />

GSM, TDMA, PAS,<br />

SCDMA<br />

IP Phone<br />

WiFi Phone, Gateway<br />

Multimedia<br />

Wireless<br />

Voice<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Hantro Video IP’s Track Record<br />

First Hantro Video IP successfully taped out in 2001<br />

12 generations of Hantro decoders and encoders<br />

Hantro Video IP deployed in hundreds of millions of devices with over<br />

50 licensees worldwide<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Vivante GPU Product Line-up<br />

TSMC 40nm LP<br />

Shader clock speed: 1 GHz<br />

GC4000<br />

96 GFLOPS<br />

8x SIMD Vec4<br />

GC8000<br />

192 GFLOPS<br />

16x SIMD<br />

Vec4<br />

2X<br />

GC2000<br />

48 GFLOPS<br />

4x SIMD Vec4<br />

2X<br />

GC1000<br />

24 GFLOPS<br />

2x SIMD Vec4<br />

2X<br />

GC400<br />

3.4 GFLOPS<br />

1x SIMD Vec4<br />

@ 250 MHz<br />

GC600<br />

12 GFLOPS<br />

1x SIMD Vec4<br />

1.5X<br />

GC800<br />

12 GFLOPS<br />

1x SIMD Vec4<br />

1.5X<br />

2X<br />

nVIDIA Tegra<br />

250<br />

GC4000 – 2 Pixel Pipe is ready.<br />

GC4000 – 4 pixel pipe planned for 2011<br />

GC8000 is planned for 2011<br />

2010 2011<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.


Custom Silicon Solution Provider<br />

VeriSilicon is not just an IP provider.<br />

VeriSilicon is not just a design service provider.<br />

VeriSilicon is a custom silicon solution provider.<br />

• Application oriented SoC/SiP platforms<br />

– Multimedia<br />

– Narrow band and wide band voice (Beanforming)<br />

– OFDM/OFDMA (EOC/PLC/LTE)<br />

– New: RF front end for wireless<br />

– New: <strong>Power</strong> management for smart grid, smart building, LED, electric car, solar<br />

energy<br />

• SoC/SiP platform based IP portfolio<br />

• Middleware and software stack<br />

• FPGA based prototyping and Virtual prototyping<br />

• The only service provider that can provide spec to silicon, strong IP<br />

portfolio, software and advanced package design in China<br />

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. The <strong>Power</strong> Architecture and <strong>Power</strong>.<strong>org</strong> word marks and the <strong>Power</strong> and <strong>Power</strong>.<strong>org</strong> logos and related marks are trademarks and service marks licensed by <strong>Power</strong>.<strong>org</strong>.

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