References of Bioplastics technology - Nec

-Masatoshi Iji and Shin Serizawa, “Silicone Derivatives as New Flame Retardantsfor Aromatic Thermoplastics Used in Electronic Devices”, Polymers for AdvancedTechnologies, 9, 593-600 (1998).-Masatoshi Iji and Yuji Ikuta, “Pyrolysis-Based Material Recovery from MoldingResin for Electronic Parts”, Journal of Environmental Engineering, 124, 9,821-828 (1998).-Masatoshi Iji, “Recycling of Epoxy Resin Compounds for Molding ElectronicComponents”, Journal of Material Science, 33, 45-53 (1998).-Masatoshi. Iji and Sadahiko Yokoyama, “Recycling of Printed Wiring Boards withMounted Electronic Components”, Circuit World, 23, 3, 10-15 (1997).■ Invited International Conference (16)First author・EcoBalance 2012,“Highly Functional Bioplastic Used for Electronic Products: Polylactic Acid Composites and Cellulose-Cardanol Resin”, Proceedings C3-06 /Yokohama, Japan・Innovation Takes Root 2012 ”Highly functional PLA composites used for electronicproducts” ,Proceedings 30(2012)/ Orlando, USA・4 th Bioplastic Market :“Environmentally Friendly Flame Retardant Bioplastic(PLA Composite)”(2010.) /Shanghai, China.・ICEM9 Committee in The Ecomaterials Forum(The Society of Non-TraditionalTechnology (SNTT) ) : ”Highly Functional Bioplastics Used for ElectronicProducts”, Proceedings of the 9 th International Conference on Eco-Material, E05、59-60 (2009) / Nara, Japan.・ INC5 Committee: “ Highly Functional Biomass-based Plastics UsingNano-Composite Technologies” 5th International Nanotechnology Conference onCommunication and Cooperation, SESSION 5: Energy & Resource Management(2009) / LA,USA.・BioJapan 2008: “Application of bioplastics to electronic products” BioJapan 2008Committee (2008) / Yokohama, Japan.・National Innovation Agency (NIA) of Thailand, Highly Functional BioplasticsUsed for Electronic Products ” Int. Conf. on Biofuel & Bioplastics (EcoInnovAsia)Proceeding 57(2008) / Bangkok, Thailand.3