References of Bioplastics technology - Nec

・ Sadahiko Yokoyama, Yukihiro Kiuchi, Masatoshi Iji “Development ofSeparation/Recovery Technology for Paper and Plastic”, Int. Conf onEco-Materials (ICEM) Japan, (1999).・Sadahiko Yokoyama, Masatoshi Iji, “Recycling System for Printed Wiring Boardswith Mounted Parts”, Int. Symp. on East Asian Recycling Technology,Japan, (1999).・Sadahiko Yokoyama, Yugi Ikuta, Masatoshi Iji, “Recycling System for PrintedWiring Boards with Mounted Parts”, Int. Symp. on Environmentally ConsciousDesign & Inverse Manufacturing (EcoDesign), Japan, (1999).・Shin Serizawa, Masatoshi Iji, “New Flame-Retarding Polycarbonate Resin with aSilicone Derivative”, Int. Conf. on the New Polymers Inst of Physics, UK, (1998).・Masatoshi Iji, “Recycling of IC Modeling resin Waste from IC Package ProductionProcess“ Int. Semiconductor Manufacturing Science (Symp. Semiconductor Equip& Materials Inst:SEMI) 197-200 Japan,(1997).・Masatoshi Iji, Sadahiko Yokoyama, ”Recycling of Printed Wiring Boards MountingElectronic Components Inst of Printed Circuits (IPC) Printed Circuits WorldConvention (PCWC), Swaziland, (1996).・Yuji Ikuta, Masatoshi Iji, Daisuku Ayukawa, Shinji Shibano “A Pyrolysis-basedTechnology for Recovering Useful Metrials from IC Package Modeling ResinWaste”, IEEE Int Symp on Electronics & Environment, USA, Proceedings,124-129 (1996).・Sadahiko Yokoyama, Masatoshi Iji “Recycling of Thermosetting Plastic Wastesfrom Electronic Component Production Processes ” , IEEE Int. Symp. onElectronics & Environment, USA, Proceedings, 132-137(1995).・Sadahiko Yokoyama, Masatoshi Iji “Material recycling of Thermosetting PlasticWastes for Electronic Components”, Workshop on Disposal & Recycling of OrganicConstruction Materials, RILEM, Japan, Proceedings, 126-136 (1995).・Sadahiko Yokoyama, Masatoshi Iji, “Recycling of Printed Wiring Board Waste”Int.Workshop on Advanced Robotics, IEEE /Intelligent Robots & Systems, USA,Proceedings, 55-58(1993).・Sadahiko Yokoyama, Masatoshi Iji,” Recycling of Silicon from Silicon SuspensionDrainage in Integrated Circuit Fabrication Process” Int. Conf on Industrial WasteMinimization, USA, Proceedings,3409-3416 (1992).7