kerf-free wafering - Avsusergroups.org

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PolyMax SEM & AFM ResultsX 5.00 μm/divZ 1000.00 nm/divPolyMax TM 20μm thick waferRMS 59.1nmZ range: 493.1nmX 5.00 μm/divZ 1000.00 nm/divPolyMax TM 50μm thick waferRMS 97.6nmZ range: 796.3nmX 10.00 μm/divZ 2000.00 nm/divPolyMax TM 150μm thick waferRMS 386.8nmZ range: 3.2μm• Roughness scalesdown with thinnerwafers• Scaling is visuallyobservable withnaked eye• SEM and AFMconfirm• No microscratchesas insawn wafers.20um 50um 150um©2011 Silicon Genesis Corporation. All rights reserved NCCAVS Joint User Group Meeting - On Photovoltaic Technologies
Wafer Thickness• Wafer thicknessdistribution is very tight• 9-points measured perwafer. Avg, Max, Minshown• Wafer-to-wafer ~ +/-1μm• Within wafer ~ +/- 1μm• 10x-20x better than wiresaw©2011 Silicon Genesis Corporation. All rights reserved NCCAVS Joint User Group Meeting - On Photovoltaic Technologies
Page 1 and 2: KERF-FREE WAFERING: TECHNOLOGY OVER
Page 3 and 4: About Silicon Genesis• Founded in
Page 5 and 6: c-Si PV Value ChainPoly SiGluingIng
Page 7 and 8: Limits of Wire-Saw Technology• Co
Page 9: Proton Range in Silicon• ‘Range
Page 14 and 15: Scalability to Thin WafersTV inTV o
Page 16 and 17: Brick Transport TraySilicon brickTr
Page 18 and 19: 2D Magnetically-Scanned Beam4x4 Bla
Page 20 and 21: PolyMax Manufacturing LayoutBRICK+P
Page 22 and 23: Effective Lifetime Recovery
Page 24 and 25: Cell Thickness and Cell Efficiency
Page 26 and 27: Controlled Initiation and Propagati
Page 28 and 29: Summary•Disruptive PolyMax waferi

kerf-free wafering - Avsusergroups.org

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