kerf-free wafering - Avsusergroups.org

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Scalability to Thin WafersTV inTV outTTV, RMS RoughnessWire SawPolyMaxWaferWirev w20μm 50μm 100μm 150μmThickness• Wire saw process has thickness variations and roughness driven bymechanical effects. Eg. Wire wear, grit size• Variations do not scale down. Limits minimum thickness of wafer• PolyMax thickness variations and roughness driven by physics• Variations scale down. Enables roadmap to thin wafers©2011 Silicon Genesis Corporation. All rights reserved NCCAVS Joint User Group Meeting - On Photovoltaic Technologies
Equipment – Alpha ImplanterAcceleratorBeamlineEndstationPlatenService CartEnclosure Wall(vault room)• 3 major components: Accelerator, Beamline, Endstation• 4MeV (150 um) max energy• Enclosure (vault room) constructed of standard concrete. Shields prompt gammas.• Designed for Serviceability: Cart, Horn, Accelerator• Currently operating at SiGen facility, San Jose©2011 Silicon Genesis Corporation. All rights reserved NCCAVS Joint User Group Meeting - On Photovoltaic Technologies
Page 1 and 2: KERF-FREE WAFERING: TECHNOLOGY OVER
Page 3 and 4: About Silicon Genesis• Founded in
Page 5 and 6: c-Si PV Value ChainPoly SiGluingIng
Page 7 and 8: Limits of Wire-Saw Technology• Co
Page 9: Proton Range in Silicon• ‘Range
Page 12 and 13: PolyMax SEM & AFM ResultsX 5.00 μm
Page 16 and 17: Brick Transport TraySilicon brickTr
Page 18 and 19: 2D Magnetically-Scanned Beam4x4 Bla
Page 20 and 21: PolyMax Manufacturing LayoutBRICK+P
Page 22 and 23: Effective Lifetime Recovery
Page 24 and 25: Cell Thickness and Cell Efficiency
Page 26 and 27: Controlled Initiation and Propagati
Page 28 and 29: Summary•Disruptive PolyMax waferi

kerf-free wafering - Avsusergroups.org

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