(PoF) and Environmental Stress Screening - DfR Solutions

More documents

Recommendations

Info

Tech Insertion: 2 nd Gen Solder Reliability• Major solder manufacturer needed to demonstrate reliability of2 nd generation Pb-free alloy• DfR provided a turn-key solutionTest plan development (12 conditions) Test coupon design (CSP, TSOP, 2512)Test execution (temp cycle, vibe, shock)Failure analysisSolder reliability model creation• ResultsDeveloped new test technology to meetschedule and cost constraintsOnline calculators now available forcustomers world-wide5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com10
Design: Design for Excellence (DfX)• DfR uses industry-leading design for excellence (DfX) practicesto optimize design and ensure success early in new productdevelopment (NPD)• Expertise Circuit Analysis Power Supply Design Design for Reliability Design for Manufacturability Design for Testability Design for Environment Physics of Failure (PoF) Reliability Prediction Finite Element Analysis (FEA)• Focus Semiconductor Packaging Printed Circuit Board Circuit Card Assemblies Product and System-Level5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com11
Page 1 and 2: DfR Solutions works with companies
Page 3 and 4: Who Uses DfR?Military / Avionics /
Page 5 and 6: How is NASA using DfR?• Current f
Page 7 and 8: DfR Locations (North America)Seattl
Page 9: IC Wearout - Value Proposition• T
Page 13 and 14: Supply Chain: Component Qualificati
Page 15 and 16: Root Cause Capability -- Personnel
Page 17 and 18: Knowledge and Education (Website)
Page 19 and 20: Interested?• Could your next prod
Page 21 and 22: PoF and ESS• Can Physics of Failu
Page 23 and 24: Physics of Failure (PoF) ModelingT
Page 25 and 26: Examples: Desired Lifetime• Low-E
Page 27 and 28: Environments: Transportation / Stor
Page 29 and 30: What is Screening?• The purpose o
Page 31 and 32: Failure RateStress Screening• Str
Page 33 and 34: Burn-In• A screen consisting of a
Page 35 and 36: HASS• HASS requires a prior, prop
Page 37 and 38: ESS• In industry, typically not d
Page 39 and 40: Failure RateCan PoF improve ESS?Tim
Page 41 and 42: How to use PoF in ESS?• Calculati
Page 43 and 44: • “I am very interested in the
Page 45 and 46: Desired Lifetime (Capacitor Wearout
Page 47 and 48: Solder Wearout (cont.)• Eliminati
Page 49 and 50: Characteristic Life (Cycles to Fail
Page 51 and 52: JESD22-B110A, Subassembly Mechanica
Page 53 and 54: 5110 Roanoke Place, Suite 101, Coll
Page 55 and 56: Vibration (cont.)• Vibration load
Page 57 and 58: Field Environment (Best Practice)
Page 59 and 60: DfR (Electrolytic Capacitors)• Ho
Page 61 and 62:
Physics of Failure• Based on how
Page 63 and 64:
Life Predictions of Integrated Circ
Page 65 and 66:
IPC TR-579• Determine stress appl
Page 67 and 68:
Assessment of IPC-TR-579• Based o
Page 69 and 70:
DfR - Solder Joints• Failure of s
Page 71 and 72:
Solder Joints (cont.)• How do nom
Page 73 and 74:
Stress Relief600 hrs• Axial diode
Page 75 and 76:
Thermal Cycle Life Model (Engelmaie
Page 77 and 78:
Engelmaier (Discussion)• Most pop
Page 79 and 80:
Vibration (MIL-STD-810, Section 514
Page 81 and 82:
Vibration (Steinberg)• Step 2: Ca
Page 83 and 84:
TemperatureTemperature Cycling + Po
Page 85 and 86:
Mechanical Shock / Drop Testing•
Page 87:
Product Qualification (other)• Mi
show all

(PoF) and Environmental Stress Screening - DfR Solutions

Create successful ePaper yourself

Delete template?

Save as template?