(PoF) and Environmental Stress Screening - DfR Solutions

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How Do Companies Use DfR?• Work overflowMaximize the efficiency of your current staff• Independent party on critical design reviews• Supplier benchmarking (commodity / custom)• Test plan development and execution• Reliability predictions• Root-Cause AnalysisPb-FreeTransition• Continuing education5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com4
How is NASA using DfR?• Current focus is Technology InsertionWearout of semiconductor devicesIntroduction of water-soluble fluxes5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com5
Page 1 and 2: DfR Solutions works with companies
Page 3: Who Uses DfR?Military / Avionics /
Page 7 and 8: DfR Locations (North America)Seattl
Page 9 and 10: IC Wearout - Value Proposition• T
Page 11 and 12: Design: Design for Excellence (DfX)
Page 13 and 14: Supply Chain: Component Qualificati
Page 15 and 16: Root Cause Capability -- Personnel
Page 17 and 18: Knowledge and Education (Website)
Page 19 and 20: Interested?• Could your next prod
Page 21 and 22: PoF and ESS• Can Physics of Failu
Page 23 and 24: Physics of Failure (PoF) ModelingT
Page 25 and 26: Examples: Desired Lifetime• Low-E
Page 27 and 28: Environments: Transportation / Stor
Page 29 and 30: What is Screening?• The purpose o
Page 31 and 32: Failure RateStress Screening• Str
Page 33 and 34: Burn-In• A screen consisting of a
Page 35 and 36: HASS• HASS requires a prior, prop
Page 37 and 38: ESS• In industry, typically not d
Page 39 and 40: Failure RateCan PoF improve ESS?Tim
Page 41 and 42: How to use PoF in ESS?• Calculati
Page 43 and 44: • “I am very interested in the
Page 45 and 46: Desired Lifetime (Capacitor Wearout
Page 47 and 48: Solder Wearout (cont.)• Eliminati
Page 49 and 50: Characteristic Life (Cycles to Fail
Page 51 and 52: JESD22-B110A, Subassembly Mechanica
Page 53 and 54: 5110 Roanoke Place, Suite 101, Coll
Page 55 and 56:
Vibration (cont.)• Vibration load
Page 57 and 58:
Field Environment (Best Practice)
Page 59 and 60:
DfR (Electrolytic Capacitors)• Ho
Page 61 and 62:
Physics of Failure• Based on how
Page 63 and 64:
Life Predictions of Integrated Circ
Page 65 and 66:
IPC TR-579• Determine stress appl
Page 67 and 68:
Assessment of IPC-TR-579• Based o
Page 69 and 70:
DfR - Solder Joints• Failure of s
Page 71 and 72:
Solder Joints (cont.)• How do nom
Page 73 and 74:
Stress Relief600 hrs• Axial diode
Page 75 and 76:
Thermal Cycle Life Model (Engelmaie
Page 77 and 78:
Engelmaier (Discussion)• Most pop
Page 79 and 80:
Vibration (MIL-STD-810, Section 514
Page 81 and 82:
Vibration (Steinberg)• Step 2: Ca
Page 83 and 84:
TemperatureTemperature Cycling + Po
Page 85 and 86:
Mechanical Shock / Drop Testing•
Page 87:
Product Qualification (other)• Mi
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(PoF) and Environmental Stress Screening - DfR Solutions

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