(PoF) and Environmental Stress Screening - DfR Solutions

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Vibration (Steinberg)• Step 1: Calculationof maximumdeflection (Z 0 )Z09.83 PSD 2f2nfnQPSD is the power spectral density (g 2 /Hz),f n is the natural frequency of the CCA,Q is transmissibility (assumed to be square root ofnatural frequency)5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com80
Vibration (Steinberg)• Step 2: Calculatecritical displacementB is length of PCBparallel to componentc is a componentpackaging constant• 1 to 2.25h is PCB thicknessr is a relative positionfactor• 1.0 when component atcenter of PCBL is component length0. 00022BZ cchr L• At critical displacement,component can survive aminimum 20 million cycles underrandom vibration• Recent modifications have alsoincluded the influence of curvature5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com81
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DfR Solutions works with companies
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Who Uses DfR?Military / Avionics /
Page 5 and 6:
How is NASA using DfR?• Current f
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DfR Locations (North America)Seattl
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IC Wearout - Value Proposition• T
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Design: Design for Excellence (DfX)
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Supply Chain: Component Qualificati
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Root Cause Capability -- Personnel
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Knowledge and Education (Website)
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Interested?• Could your next prod
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PoF and ESS• Can Physics of Failu
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Physics of Failure (PoF) ModelingT
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Examples: Desired Lifetime• Low-E
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Environments: Transportation / Stor
Page 29 and 30: What is Screening?• The purpose o
Page 31 and 32: Failure RateStress Screening• Str
Page 33 and 34: Burn-In• A screen consisting of a
Page 35 and 36: HASS• HASS requires a prior, prop
Page 37 and 38: ESS• In industry, typically not d
Page 39 and 40: Failure RateCan PoF improve ESS?Tim
Page 41 and 42: How to use PoF in ESS?• Calculati
Page 43 and 44: • “I am very interested in the
Page 45 and 46: Desired Lifetime (Capacitor Wearout
Page 47 and 48: Solder Wearout (cont.)• Eliminati
Page 49 and 50: Characteristic Life (Cycles to Fail
Page 51 and 52: JESD22-B110A, Subassembly Mechanica
Page 53 and 54: 5110 Roanoke Place, Suite 101, Coll
Page 55 and 56: Vibration (cont.)• Vibration load
Page 57 and 58: Field Environment (Best Practice)
Page 59 and 60: DfR (Electrolytic Capacitors)• Ho
Page 61 and 62: Physics of Failure• Based on how
Page 63 and 64: Life Predictions of Integrated Circ
Page 65 and 66: IPC TR-579• Determine stress appl
Page 67 and 68: Assessment of IPC-TR-579• Based o
Page 69 and 70: DfR - Solder Joints• Failure of s
Page 71 and 72: Solder Joints (cont.)• How do nom
Page 73 and 74: Stress Relief600 hrs• Axial diode
Page 75 and 76: Thermal Cycle Life Model (Engelmaie
Page 77 and 78: Engelmaier (Discussion)• Most pop
Page 79: Vibration (MIL-STD-810, Section 514
Page 83 and 84: TemperatureTemperature Cycling + Po
Page 85 and 86: Mechanical Shock / Drop Testing•
Page 87: Product Qualification (other)• Mi
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(PoF) and Environmental Stress Screening - DfR Solutions

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