(PoF) and Environmental Stress Screening - DfR Solutions

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Thermal Cycle Life Model (Darveaux)• Unified energy approach Determines energy dissipated with eachtemperature cycle• Applicable to finite element analysis (FEA)• Advantages Has the potential to provide a moreaccurate life prediction Complex or unique package styles• Disadvantages Requires specialized software (FEA)5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com78
Vibration (MIL-STD-810, Section 514.4)PSD (G 2 /Hz)• Provides the appropriate test condition for agiven field environment (acceleration factor)Can not provide an absolute prediction PSD PSD124TT2110.1PSD in g 2 /HzT is duration ofexposure0.010.0010.00010.00001TestField10 100 1000 10000Frequency (Hz)5110 Roanoke Place, Suite 101, College Park, Maryland 20740Phone (301) 474-0607 Fax (240) 757-0053© 2004 - 2007 2009 www.DfRSolutions.com79
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DfR Solutions works with companies
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Who Uses DfR?Military / Avionics /
Page 5 and 6:
How is NASA using DfR?• Current f
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DfR Locations (North America)Seattl
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IC Wearout - Value Proposition• T
Page 11 and 12:
Design: Design for Excellence (DfX)
Page 13 and 14:
Supply Chain: Component Qualificati
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Root Cause Capability -- Personnel
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Knowledge and Education (Website)
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Interested?• Could your next prod
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PoF and ESS• Can Physics of Failu
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Physics of Failure (PoF) ModelingT
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Examples: Desired Lifetime• Low-E
Page 27 and 28: Environments: Transportation / Stor
Page 29 and 30: What is Screening?• The purpose o
Page 31 and 32: Failure RateStress Screening• Str
Page 33 and 34: Burn-In• A screen consisting of a
Page 35 and 36: HASS• HASS requires a prior, prop
Page 37 and 38: ESS• In industry, typically not d
Page 39 and 40: Failure RateCan PoF improve ESS?Tim
Page 41 and 42: How to use PoF in ESS?• Calculati
Page 43 and 44: • “I am very interested in the
Page 45 and 46: Desired Lifetime (Capacitor Wearout
Page 47 and 48: Solder Wearout (cont.)• Eliminati
Page 49 and 50: Characteristic Life (Cycles to Fail
Page 51 and 52: JESD22-B110A, Subassembly Mechanica
Page 53 and 54: 5110 Roanoke Place, Suite 101, Coll
Page 55 and 56: Vibration (cont.)• Vibration load
Page 57 and 58: Field Environment (Best Practice)
Page 59 and 60: DfR (Electrolytic Capacitors)• Ho
Page 61 and 62: Physics of Failure• Based on how
Page 63 and 64: Life Predictions of Integrated Circ
Page 65 and 66: IPC TR-579• Determine stress appl
Page 67 and 68: Assessment of IPC-TR-579• Based o
Page 69 and 70: DfR - Solder Joints• Failure of s
Page 71 and 72: Solder Joints (cont.)• How do nom
Page 73 and 74: Stress Relief600 hrs• Axial diode
Page 75 and 76: Thermal Cycle Life Model (Engelmaie
Page 77: Engelmaier (Discussion)• Most pop
Page 81 and 82: Vibration (Steinberg)• Step 2: Ca
Page 83 and 84: TemperatureTemperature Cycling + Po
Page 85 and 86: Mechanical Shock / Drop Testing•
Page 87: Product Qualification (other)• Mi
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