The Draper Technology Digest - Draper Laboratory

The 2011 Engineering Vice President’sOutstanding Task Leader AwardsLow Talker Wire Bond DevelopmentMichael Clohecy is a Senior Member of the Technical Staff in the ProductEngineering Group within the Microsystems Fabrication Division. Sincejoining Draper in 2001, he has made many contributions across processengineering, packaging engineering, and Multichip Module design. Mr. Clohecyhas demonstrated increasing technical leadership and expanded his domainexpertise. He recently took on the role of Packaging Task Leader on the LowTalker Wirebonded program. The program required a very quick developmentcycle from concept through process development to deliverable first articles. Itwas the first of its kind integration of an integrated ultra-high-density (i-UHD)module with commercially-available stacked die wirebonding technology toprovide a lower cost solution to demanding system requirements. He led a smalltechnical team from concept design through proof-of-concept demonstrationsto win sponsor approval to proceed to full-scale development. The programwas successfully completed on an aggressive timeline and was rewardedwith production module orders. Mr. Clohecy holds a B.S. in MechanicalEngineering from Worcester Polytechnic Institute, an M.Eng. in MechanicalEngineering from Tufts University, and an M.S. in Electrical Engineeringfrom Tufts University.84 Outstanding Task Leader Awards