Quarterly FIT Rate Reliability Monitor- Test Report ... - PLX Technology

RELIABILITY HTOL DATA @125 °C for 0.25µmFOUNDRY: TSMC Taiwan, Process: 0.25 µm CMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ1'08 120 0 0 120 1,966,264 0 6Q2'08 120 0 0 120 2,026,264 1*** 13Q3'08 100 0**** 0 100 2,126,264 0**** 12Q1'09 100 0**** 0 100 2,226,264 0**** 12Q2'09 100 0**** 0 100 2,326,264 0**** 11Q3'09 100 0**** 0 100 2,426,264 0**** 11Q4'09 100 0**** 0 100 2,526,264 0**** 10Q1'10 100 0**** 0 100 2,626,264 0**** 10Q2'10 100 0**** 0 100 2,726,264 0**** 10Q3'10 100 0**** 0 100 2,826,264 0**** 9Q4'10 100 0**** 0 100 2,926,264 0**** 9Q1'11 100 0**** 0 100 3,026,264 0**** 9Q2'11 100 0**** 0 100 3,126,264 0**** 8Q3'11 100 0**** 0 100 3,226,264 0**** 8Q4'11 100 0**** 0 100 3,326,264 0**** 8Q1'12 100 0**** 0 100 3,426,264 0**** 8Q2'12 100 0**** 0 100 3,526,264 0**** 7Q3'12 100 0**** 0 100 3,626,264 0**** 7Q4'12 100 0**** 0 100 3,726,264 0**** 7Note: * = Mechanical damage after 500 hrs** = 9 mechanical damage after 1KH***= 1 unit functional failure after 1000 hrs, root cause could not be determined, random failure.****= TSMC Process HTOL Reliability Data.PPM Goal = 200ppm FIT Goal ≤ 2010EFR(Early Fail Rate, =168 Hours)Cumulative880PPM6420FIT60402008 8 8 7 7 7YearYear