Quarterly FIT Rate Reliability Monitor- Test Report ... - PLX Technology

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RELIABILITY STRESS DATAPressure Cooker <strong>Test</strong>: 168 Hours, 121 ˚C/ 100% RHYEAR PKG SAMPLE 96 Hours 168 Hours FAILURE RATETYPE SIZE ( Ref ) ( Accep ) (%)2008 HSBGA 150 0 0 02009 HSBGA 60 0 0 02010 HSBGA 120 0 0 02011 HSBGA 292 0 0 0Q1'12 HSBGA 120 0 0 0Q2'12 HSBGA 120 0 0 0Q3'12 HSBGA 22 0 0 0Q4'12 HSBGA NILQ1'13 HSBGA NIL2004-2007 PBGA 1130 0 0 02008 PBGA 120 0 0 02009 PBGA 120 0 0 02010 PBGA 90 0 0 02011 PBGA 150 0 0 0Q1'12 PBGA 257 0 0 0Q2'12 PBGA 120 0 0 0Q3'12 PBGA NILQ4'12 PBGA NILQ1'13 PBGA NIL2010 QFN 205 0 0 02011 QFN 188 0 0 0Q1'12 QFN 375 0 0 0Q2'12 QFN 345 0 0 0Q3'12 QFN 201 0 0 0Q4'12 QFN 145 0 0 0Q1'13 QFN NIL2004-2007 QFP 6792 0 0 02008 QFP 474 0 0 02009 QFP 337 0 0 02010 QFP 358 0 0 02011 QFP 558 0 0 0Q1'12 QFP 449 0 0 0Q2'12 QFP 561 0 0 0Q3'12 QFP 233 0 0 0Q4'12 QFP 90 0 0 0Q1'13 QFP NILNote:FINAL RESULT(PASS/FAIL)PASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSASSEMBLY SUBCONASE, KaohsiungASE, MalaysiaRenesas, JapanSeiko-Epson, JapanPACKAGE TECHNOLOGIESEPQFP, QFN, aQFN, PBGA, HSBGA, HFCBGA, FCBGAPQFP, PBGA, HSBGAPQFP, PBGA, FBGAPQFP, PBGA